Global IO Link Market Analysis 2018 Top Companies are are Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc., Festo AG & Co. KG., OMRON Corporation, Banner Engineering Corporation, Hans Turck GmbH & Co. KG
The global IO Link market report also contains the drivers and restrains for the IO Link market that are derived from SWOT analysis, and also shows what all the recent developments, product launches, joint ventures, merges and accusations by the several key players and brands that are driving the market are by systemic company profiles.
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Global IO Link Market Segmentation
• By Component (IO-Link Masters, IO-Link Devices),
• By Application (Machine Tool, Handling and Assembly Automation, Packaging, Intralogistics),
• By Industry (Discrete, Hybrid, Process),
• By Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa)
The Global IO Link Market is expected to rise from its initial estimated value of USD 2.46 billion in 2018 to an estimated value of USD 26.80 billion by 2026 registering a CAGR of 34.75% in the forecast period of 2019-2026. This trend in growth can be attributed to the focus on optimisation of energy that can be achieved with the ability of IO Link supporting several communication protocols at once.
IO Link is an industrial communication networking device that is used for interlinking sensors to a high level fieldbus or
ethernet communication protocol. It provides the data from these sensors that can be used for monitoring and hence, helps in optimizing the resources being utilized in the said industry.
• Focus on optimal utilization of resources and increase of energy efficiency is expected to drive the market growth
• IO Link’s ability in supporting several Fieldbus and Ethernet communication protocols
• IO Link’s usage and effectiveness is limited in the cases of high-speed or motion control applications is expected to
restrain the market growth
• Lack of standardization of IO Links is another factor that is expected to restrain the market growth
Major Market Competitors/Players:
Few of the major competitors currently working in the IO Link Market are
• Siemens AG,
• Balluff GmbH,
• ifm electronic gmbh,
• SICK AG,
• Rockwell Automation Inc.,
• Festo AG & Co. KG.,
• OMRON Corporation,
• Banner Engineering Corporation,
• Hans Turck GmbH & Co. KG,
• Datalogic S.p.A.,
• Beckhoff Automation GmbH & Co. KG,
• Bosch Rexroth AG,
• Belden Inc.,
• AVENTICS GmbH,
• Weidmüller Interface GmbH & Co. KG.
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The Global IO Link Market is highly fragmented and the major players have used various strategies such as new product
launches, expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of IO Link Market for global, Europe, North America, Asia Pacific and South America.
• To perceive the most influencing pivoting and hindering forces in IO Link Market and its footprint in the international
• Learn about the market policies that are being endorsed by ruling respective organizations.
• To gain a perceptive survey of the market and have an extensive interpretation of the IO Link Market and its
• To understand the structure of IO Link Market by identifying its various sub segments.
• Focuses on the key global IO Link Market players, to define, describe and analyze the sales volume, value, market
share, market competition landscape, SWOT analysis and development plans in next few years.
• To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the
• To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers, industry-specific challenges and risks).
• To project the consumption of IO Link Market submarkets, with respect to key regions (along with their respective key countries).
• To strategically profile the key players and comprehensively analyze their growth strategies
• To analyze the IO Link Market with respect to individual growth trends, future prospects, and their contribution to the
• By Component
o IO-Link Masters
o IO-Link Devices
Radio-Frequency Identification (RFID) Read Heads and Others
• By Application
o Machine Tool
o Handling and Assembly Automation
• By Industry
• By Geography
o North America
o South America
o Middle East and Africa
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