Thin Wafer Processing and Dicing Equipment Market is expected to grow at a CAGR of over 6% during the forecast period (2018 - 2023)| Key Players - SUZHOU DELPHI LASER CO., LTD, SPTS TECHNOLOGIES LIMITED (ORBOTECH), PLASMA-THERM LLC, HAN'S LASER TECHNOLOGY

Market Analysis:

Asia Pacific is growing at A Faster Pace

Asia Pacific is the fastest growing semiconductor market in the world. Growing initiatives like Make in India by the Indian government and Vision 2020 by the Chinese government are increasingly drawing attention from the international players to set up local production establishments.

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Integration of microelectronics into several consumer electronics and smart cards needed for thinner wafers are increasing rapidly. Technologies like RFID, MEMS Devices, and power devices are considered to be the major source of demand for these thin wafers With increasing innovations in enterprise security solutions to manage employees of the organization, upcoming foundries and semiconductor manufacturing establishments and applications in consumer electronics are expected to keep a steady demand for processing and dicing equipment over the forecast period.

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Market Segments:
Thin Wafer Processing and Dicing Equipment Market is segmented by:
1. Equipment Type: Thinning Equipment, Dicing Equipment
2. Equipment Technology: Thinning Equipment (Grinding, Grinding + CPM, Wet/Dry Etching, TAIKO), Dicing Equipment (Blade Dicing, Laser Ablation, Stealth Dicing, Plasma Dicing)
3. Application: Memory and Logic (TSV), MEMS Devices, Power Devices, CMOS Image Sensors, RFID
4. Geography: North America, South America, Europe, Asia Pacific, Middle East & Africa

Key Developments in the Market
• February 2018 - SPTS Technologies received approximately USD 37 million in orders for multiple etch and deposition systems from two GaAs foundry customers. SPTS’s Omega plasma etch, Delta PECVD, and Sigma PVD are expected to be installed in these foundries to manufacture radio frequency (RF) devices for 4G and emerging 5G wireless infrastructure.

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