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Asia-Pacific (APAC) Memory Packaging Market Revenue and Demand by 2023; Players - Apple, Dell EMC, Qualcomm, IBM, Intel Corporation, Cisco, Samsung Electronics, Winbond and Toshiba Corporation

01-09-2019 08:06 PM CET | IT, New Media & Software

Press release from: P&S Intelligence

Asia-Pacific (APAC) Memory Packaging Market Revenue and Demand

Asia-Pacific (APAC) memory packaging market is expected to reach $18,488.1 million by 2023. Surge in investments in fabrication activities in China, rising demand for smartphones across the region, growing popularity of autonomous driving and in-car entertainment (ICE), and continuous improvements in high-bandwidth memory (HBM) and redistribution layer (RDL) are some of the major factors driving the growth of the APAC memory packaging market.

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Increasing demand for smartphones in APAC is one of the major factors driving the growth of the regional APAC memory packaging market. With the rising adoption of smartphones, the use of packaged memory chips is also increasing. Effective space utilization offered by memory packaging technologies is one of the key factors propelling the growth of the APAC memory packaging market.

China is estimated to contribute the largest revenue share, accounting for more than 40% to the APAC memory packaging market. This can be mainly attributed to the broader application areas of memory packaging in various consumer electronics, particularly smartphones and tablets.

Some of the key players in the APAC memory packaging market are Apple Inc., Dell EMC, Qualcomm Technologies Inc., IBM Corporation, Intel Corporation, Cisco Systems Inc., Samsung Electronics Co. Ltd., Winbond Electronics Corporation, Fujitsu Group, LG Electronics, Toshiba Corporation, SK hynix Inc., Nanya Technology Corporation, ASE Group, NEC Corporation, ST Microelectronics N.V., Micron Technology Inc. and Western Digital Corporation.

Explore report description @ https://www.psmarketresearch.com/market-analysis/apac-memory-packaging-market

APAC Memory Packaging Market Segmentation -
Market Segmentation by Platform
• Wire-Bond
• Lead-Frame
• Flip-Chip
• Wafer-Level Chip-Scale Packaging (WLCSP)
• Through-Silicon Via (TSV)

Market Segmentation by Application
• Dynamic Random-Access Memory (DRAM) Packaging
• Negative AND (NAND) Flash Packaging
• Negative OR (NOR) Flash Packaging
• 3D Through-Silicon Via (TSV) Packaging

Market Segmentation by End-Use
• Consumer Electronics
• Information Technology (IT) and Telecommunication
• Embedded Systems
• Automotive
• Military and Aerospace
• Medical Devices
• Others

About P&S Intelligence

P&S Intelligence, a brand of P&S Market Research, is a provider of market research and consulting services catering to the market information needs of burgeoning industries across the world. Providing the plinth of market intelligence, P&S as an enterprising research and consulting company, believes in providing thorough landscape analyses on the ever-changing market scenario, to empower companies to make informed decisions and base their business strategies with astuteness.

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P&S Intelligence
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International: +1-347-960-6455
Email: enquiry@psmarketresearch.com
Web: https://www.psmarketresearch.com

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