Embedded Die Packaging Technology Market Analysis, 2017-2023: ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer

Embedded die packaging technology can be explained as the process of positioning or molding the components or ICs that are on an internal layer of an organic circuit board, unit, or chip package, such that it is hidden inside the complete structure, in spite of being connected on the top or bottom.

The embedded die packaging technology provides a reduced form-factor, improved thermal performance, enhanced integration capacity, and less inductance through advanced manufacturing chain with reduced cost. However, the large-scale production of these chips is still awaited, although the increased adoption in automotive and healthcare industries is anticipated to fuel the mass production of these chips in near future.

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The embedded die packaging technology is expected to present high growth rate as companies are heavily expending on R&D activities and the industries, such as automotive & transport, healthcare, and aerospace & defense, have a high adoption rate for this technology. This technology is expected to grow over twofolds in next 5-6 years, owing to its increasing applications across industries such as electronics, industrial, IT & telecom, and healthcare.

North America is the second highest revenue contributor to the global market, after Asia-Pacific. The market growth is attributed to factors such as rise in R&D investment in automotive industry, well-established IT & telecommunication industry, and rise in number of smart homes.

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Global Embedded Die Packaging Technology was valued at $26 million in 2016, and is projected to reach $68 million by 2023, growing at a CAGR of 14.8% from 2017 to 2023. Embedded die packaging technology refers to embedding the die directly into printed circuit board (PCB) laminated substrate, which facilitates size reduction, power saving, and improves the overall efficiency of the system on a large scale. There are two types of packaging technologies, namely, Flip-Chip Chip Scale Packaging (FC CSP) and Wafer Level Chip Scale Packaging (WL CSP), which have shown interesting growth rates in the recent past. This technology is growing rapidly and is expected to maintain this trend in the near future due to additional features, such as considerable cost reduction of whole packaging process, more compact chips, and reduced power loss of the system.

Impending Need for Circuit Miniaturization in Microelectronic Devices

The adoption of embedded die packaging has increased in the recent years, owing to the rise in need for miniaturization of electronic circuits in microelectronic devices. Embedded die packaging is a promising technology for emerging telecommunication applications, owing to its excellent electrical performance at high frequencies. Moreover, the demand for compact electronic circuitry is on a rise due to reduction in size of electronic devices for ease of access for users. This demand is catered by the embedded die packaging technology, which offers advantages such as increased functionality & efficiency of the electronic circuit; reduced size, signal inductance, and power inductance; improved reliability; and higher signal density.

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Key Benefits for Stakeholders

The study provides an in-depth analysis of the global embedded die packaging technology market to elucidate the prominent investment pockets from 2017 to 2023.
Current trends and future estimations are outlined to determine the overall market scenario.
The report provides information about key drivers, restraints, and opportunities with a detailed impact analysis.

The key players in the embedded die packaging technology market are Amkor Technology, Taiwan Semiconductor Manufacturing Company, ASE Group, AT & S, General Electric, Infineon, Fujikura, MicroSemi, TDK-Epcos, and Schweizer.

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