Press release
High-Density Interconnect (HDI) PCB Market is Expected to Reach $22,258.8 Million, By Top Leading Companies: Compeq Manufacturing Co. Ltd, TTM Technologies, Unimicron, AT&S, Ibiden Group, SEMCO, Unitech Printed Circuit Corp., Tripod Technology Corp., DAP
The Global HDI PCB Market was valued at $9,491.0 million in 2017 and is projected to reach $22,258.8 million by 2025, registering a CAGR of 11.1% from 2018 to 2025. Asia-Pacific accounted for the highest revenue share of $4555.7 million in 2017 and is estimated to reach $9971.9 million by 2025, registering a CAGR of 10.1% during forecast period.A high-density interconnect (HDI) is a fastest growing technology used in the printed circuit board (PCB), which have higher wiring density per unit as compared to the conventional circuit boards. These HDI PCBs have finer lines and spaces ( 100 m), smaller vias ( 150 m), and capture pads ( 400 m). Moreover, HDI PCBs have a relatively higher connection pad density over conventional PCBs that is over 20 pads/cm2. Hence, they are widely adopted in the consumer electronics sector and have a high growth potential in the automotive industry.
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The factors that drive the global HDI PCB market include miniaturization of size and lower weight, high efficiency, and growing sales of consumer electronics. In addition, increase in utilization of HDI technology in automobiles is expected to provide lucrative growth opportunities for the market. On the contrary, high construction cost is anticipated to restrain the growth of the global market.
The global HDI PCB market is dominated by key players such as Compeq Manufacturing Co. Ltd, TTM Technologies, Unimicron, AT&S, Ibiden Group, SEMCO, Unitech Printed Circuit Corp., Tripod Technology Corp., DAP Corporation, and Meiko.
The global HDI PCB market is segmented based on end-user, application, and region. Based on end-user, the market is classified into consumer electronics, automotive, industrial electronics, IT & telecommunications, and others. Based on application, it is categorized into smartphone & tablet, laptop & PC, smart wearables, and others. Based on region, the market is analyzed across North America, Europe, Asia-Pacific, and LAMEA.
HDI PCBs enable accommodation of more components on either side of the PCB, which increases its functionality and maximizes the abilities of the products or equipment in which it is incorporated. In addition to the high functionality of the HDI boards, the size and weight of the products are also reduced as compared to the traditional PCBs. These boards are heavily utilized in communication devices such as smartphones and tablets, as these products are small and require high functionality in limited space.
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The HDI PCBs utilize minimum materials and boards for its composition and also increase the efficiency of HDI boards as compared to conventional PCBs. In addition, the time required for the construction of these boards is less that helps faster production. Such functionalities of HDI boards increases the performance of the devices in which it is incorporated. All these factors are expected to drive the growth of the global HDI PCB market.
The growing sales of consumer electronics and a substantial rise in the demand for HDI PCBs in these applications are driving the growth of the global HDI PCB market. Therefore, the consumer electronics industry is becoming one of the important end-user markets for high-density technology. Currently, application of these boards in consumer electronic devices such as smartphones, smart wearables, gaming consoles, tablets, and others are significant. Thereby with increasing demand and production of these devices, the global HDI PCB market is projected to grow in the forecast period.
The manufacturing of HDI PCBs requires special methods such as laser direct imaging (LDI). This method is used in the fabrication process as HDI requires the construction of fine lines on the boards. In addition to the fine lines, implementation of tighter spacing of the components makes LDI a necessary element in this process. As the expense of the overall LDI equipment and machinery costs are significantly higher it makes the construction of HDI PCBs expensive. Moreover, the individual operating or handling the construction of the HDIs needs sufficient knowledge and intense training to handle the complete manufacturing process.
Table of Content:
Chapter: 1: INTRODUCTION
1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS FOR STAKEHOLDERS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY
1.4.1. Primary research
1.4.2. Secondary research
1.4.3. Analyst tools and models
Chapter: 2: EXECUTIVE SUMMARY
2.1. CXO PERSPECTIVE
Chapter: 3: MARKET OVERVIEW
3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS
3.2.1. Top impacting factors
3.2.2. Top investment pockets
3.2.3. Top winning strategies
3.3. PORTERS FIVE FORCES ANALYSIS
3.4. MARKET SHARE ANALYSIS (2017)
3.5. MARKET DYNAMICS
3.5.1. Drivers
3.5.1.1. Miniaturization of size and lower weight
3.5.1.2. High efficiency
3.5.1.3. Growing sales of consumer electronics
3.5.2. Restraint
3.5.2.1. High Construction Cost
3.5.3. Opportunities
3.5.3.1. Increase in utilization of HDI technology in automobiles
Chapter: 4: HDI PCB MARKET, BY END-USER
4.1. OVERVIEW
4.2. CONSUMER ELECTRONICS
4.2.1. Key market trends, growth factors and opportunities
4.2.2. Market size and forecast, by region
4.2.3. Market analysis by country
4.3. AUTOMOTIVE
4.3.1. Key market trends, growth factors, and opportunities
4.3.2. Market size and forecast, by region
4.3.3. Market analysis by country
4.4. INDUSTRIAL ELECTRONICS
4.4.1. Key market trends, growth factors, and opportunities
4.4.2. Market size and forecast, by region
4.4.3. Market analysis by country
4.5. IT & TELECOMMUNICATIONS
4.5.1. Key market trends, growth factors, and opportunities
4.5.2. Market size and forecast, by region
4.5.3. Market analysis by country
4.6. OTHERS
4.6.1. Key market trends, growth factors, and opportunities
4.6.2. Market size and forecast, by region
4.6.3. Market analysis by country
Chapter: 5: HDI PCB MARKET, BY APPLICATION
5.1. OVERVIEW
5.2. SMARTPHONE & TABLET
5.2.1. Key market trends, growth factors and opportunities
5.2.2. Market size and forecast, by region
5.2.3. Market analysis by country
5.3. PC & LAPTOP
5.3.1. Key market trends, growth factors, and opportunities
5.3.2. Market size and forecast, by region
5.3.3. Market analysis by country
5.4. SMART WEARABLE
5.4.1. Key market trends, growth factors, and opportunities
5.4.2. Market size and forecast, by region
5.4.3. Market analysis by country
5.5. OTHERS
5.5.1. Key market trends, growth factors, and opportunities
5.5.2. Market size and forecast, by region
5.5.3. Market analysis by country
Chapter: 6: HDI PCB MARKET, BY REGION
6.1. OVERVIEW
6.2. NORTH AMERICA
6.2.1. Key market trends, growth factors, and opportunities
6.2.2. Market size and forecast, by End-User
6.2.3. Market size and forecast, by application
6.2.4. Market analysis by country
6.2.4.1. U.S.
6.2.4.1.1. Market size and forecast, by End-User
6.2.4.1.2. Market size and forecast, by application
6.2.4.2. Canada
6.2.4.2.1. Market size and forecast, by End-User
6.2.4.2.2. Market size and forecast, by application
6.2.4.3. Mexico
6.2.4.3.1. Market size and forecast, by End-User
6.2.4.3.2. Market size and forecast, by application
6.3. EUROPE
6.3.1. Key market trends, growth factors, and opportunities
6.3.2. Market size and forecast, by End-User
6.3.3. Market size and forecast, by application
6.3.4. Market analysis by country
6.3.4.1. U.K.
6.3.4.1.1. Market size and forecast, by End-User
6.3.4.1.2. Market size and forecast, by application
6.3.4.2. Germany
6.3.4.2.1. Market size and forecast, by End-User
6.3.4.2.2. Market size and forecast, by application
6.3.4.3. France
6.3.4.3.1. Market size and forecast, by End-User
6.3.4.3.2. Market size and forecast, by application
6.3.4.4. Russia
6.3.4.4.1. Market size and forecast, by End-User
6.3.4.4.2. Market size and forecast, by application
6.3.4.5. Rest of Europe
6.3.4.5.1. Market size and forecast, by End-User
6.3.4.5.2. Market size and forecast, by application
6.4. ASIA-PACIFIC
6.4.1. Key market trends, growth factors, and opportunities
6.4.2. Market size and forecast, by End-User
6.4.3. Market size and forecast, by application
6.4.4. Market analysis by country
6.4.4.1. China
6.4.4.1.1. Market size and forecast, by End-User
6.4.4.1.2. Market size and forecast, by application
6.4.4.2. Japan
6.4.4.2.1. Market size and forecast, by End-User
6.4.4.2.2. Market size and forecast, by application
6.4.4.3. India
6.4.4.3.1. Market size and forecast, by End-User
6.4.4.3.2. Market size and forecast, by application
6.4.4.4. South Korea
6.4.4.4.1. Market size and forecast, by End-User
6.4.4.4.2. Market size and forecast, by application
6.4.4.5. Rest of Asia-Pacific
6.4.4.5.1. Market size and forecast, by End-User
6.4.4.5.2. Market size and forecast, by application
6.5. LAMEA
6.5.1. Key market trends, growth factors, and opportunities
6.5.2. Market size and forecast, by End-User
6.5.3. Market size and forecast, by application
6.5.4. Market analysis by country
6.5.4.1. Latin America
6.5.4.1.1. Market size and forecast, by End-User
6.5.4.1.2. Market size and forecast, by application
6.5.4.2. Middle East
6.5.4.2.1. Market size and forecast, by End-User
6.5.4.2.2. Market size and forecast, by application
6.5.4.3. Africa
6.5.4.3.1. Market size and forecast, by End-User
6.5.4.3.2. Market size and forecast, by application
Chapter: 7: COMPANY PROFILES
7.1. AT&S
7.1.1. Company overview
7.1.2. Company snapshot
7.1.3. Operating business segments
7.1.4. Product portfolio
7.1.5. Business performance
7.1.6. Key strategic moves and developments
7.2. COMPEQ
7.2.1. Company overview
7.2.2. Company snapshot
7.2.3. Product portfolio
7.2.4. Business performance
7.2.5. Key strategic moves and developments
7.3. DAP CORPORATION
7.3.1. Company overview
7.3.2. Company snapshot
7.3.3. Product portfolio
7.3.4. Business performance
7.4. IBIDEN CO., LTD.
7.4.1. Company overview
7.4.2. Company snapshot
7.4.3. Operating business segments
7.4.4. Business performance
7.5. MEIKO ELECTRONICS CO., LTD.
7.5.1. Company overview
7.5.2. Company snapshot
7.5.3. Product portfolio
7.5.4. Business performance
7.5.5. Key strategic moves and developments
7.6. SEMCO
7.6.1. Company overview
7.6.2. Company snapshot
7.6.3. Operating business segments
7.6.4. Product portfolio
7.6.5. Business performance
7.7. TTM TECHNOLOGIES
7.7.1. Company overview
7.7.2. Company snapshot
7.7.3. Operating business segments
7.7.4. Product portfolio
7.7.5. Business performance
7.7.6. Key strategic moves and developments
7.8. TRIPOD TECHNOLOGY
7.8.1. Company overview
7.8.2. Company snapshot
7.8.3. Product portfolio
7.8.4. Business performance
7.9. UNIMICRON
7.9.1. Company overview
7.9.2. Company snapshot
7.9.3. Operating business segments
7.9.4. Product portfolio
7.9.5. Business performance
7.9.6. Key strategic moves and developments
7.10. UNITECH PCB
7.10.1. Company overview
7.10.2. Company snapshot
7.10.3. Product portfolio
7.10.4. Business performance
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