Global IO Link Market Analysis 2018 Top Companies are are Siemens AG, Balluff GmbH, ifm electronic gmbh, SICK AG, Rockwell Automation Inc., Festo AG & Co. KG., OMRON Corporation, Banner Engineering Corporation, Hans Turck GmbH & Co. KG, Pepperl+Fuchs

This Report Expects To Examine The Developments Of A IO Link Market Including Its Market Improvement, Development Position Etc. The Report On The IO Link Market Offers Explain Knowledge On The Market Parts Like Dominating Players, Drivers And Restraints, Production, Revenue, Consumption, Import And Export, And The Most Effective Development Within The Organization Size, Deployment Type, Inside, Segmentation Comprised Throughout This Analysis, Also Major The Players Have Used Various Strategies Such As New Product Launches, Expansions, Agreements, Joint Ventures, Partnerships, Acquisitions and Others .To Increase Their Footprints In This Market In Order To Sustain In Long Run. Additionally To The Present The Report Covers Chart And Tables Which Provide A Clear Viewpoint Of The IO Link Industry.

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Global IO Link Market Segmentation

• By Component (IO-Link Masters, IO-Link Devices),

• By Application (Machine Tool, Handling and Assembly Automation, Packaging, Intralogistics),

• By Industry (Discrete, Hybrid, Process),

• By Geography (North America, South America, Europe, Asia-Pacific, Middle East and Africa)

The Global IO Link Market is expected to rise from its initial estimated value of USD 2.46 billion in 2018 to an estimated value of USD 26.80 billion by 2026 registering a CAGR of 34.75% in the forecast period of 2019-2026. This trend in growth can be attributed to the focus on optimisation of energy that can be achieved with the ability of IO Link supporting several communication protocols at once.

Market Definition:

IO Link is an industrial communication networking device that is used for interlinking sensors to a high level fieldbus or ethernet
communication protocol. It provides the data from these sensors that can be used for monitoring and hence, helps in optimizing the resources being utilized in the said industry.

Market Drivers:

• Focus on optimal utilization of resources and increase of energy efficiency is expected to drive the market growth

• IO Link’s ability in supporting several Fieldbus and Ethernet communication protocols

Market Restraints:

• IO Link’s usage and effectiveness is limited in the cases of high-speed or motion control applications is expected to restrain the
market growth

• Lack of standardization of IO Links is another factor that is expected to restrain the market growth

Major Market Competitors/Players:

Few of the major competitors currently working in the IO Link Market are

• Siemens AG,

• Balluff GmbH,

• ifm electronic gmbh,

• SICK AG,

• Rockwell Automation Inc.,

• Festo AG & Co. KG.,

• OMRON Corporation,

• Banner Engineering Corporation,

• Hans Turck GmbH & Co. KG,

• Pepperl+Fuchs,

• Datalogic S.p.A.,

• Comtrol,

• Beckhoff Automation GmbH & Co. KG,

• Baumer,

• Bosch Rexroth AG,

• ABB,

• Belden Inc.,

• AVENTICS GmbH,

• Weidmüller Interface GmbH & Co. KG.

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Competitive Analysis:

The Global IO Link Market is highly fragmented and the major players have used various strategies such as new product launches,
expansions, agreements, joint ventures, partnerships, acquisitions, and others to increase their footprints in this market. The report includes market shares of IO Link Market for global, Europe, North America, Asia Pacific and South America.

Research objectives

• To perceive the most influencing pivoting and hindering forces in IO Link Market and its footprint in the international market.

• Learn about the market policies that are being endorsed by ruling respective organizations.

• To gain a perceptive survey of the market and have an extensive interpretation of the IO Link Market and its materialistic
landscape.

• To understand the structure of IO Link Market by identifying its various sub segments.

• Focuses on the key global IO Link Market players, to define, describe and analyze the sales volume, value, market share, market
competition landscape, SWOT analysis and development plans in next few years.

• To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.

• To share detailed information about the key factors influencing the growth of the market (growth potential, opportunities, drivers,
industry-specific challenges and risks).

• To project the consumption of IO Link Market submarkets, with respect to key regions (along with their respective key countries).

• To strategically profile the key players and comprehensively analyze their growth strategies

• To analyze the IO Link Market with respect to individual growth trends, future prospects, and their contribution to the total market.

Segmentation:

• By Component
o IO-Link Masters
o IO-Link Devices
 Sensor Nodes
 Modules
 Actuators
 Radio-Frequency Identification (RFID) Read Heads and Others

• By Application
o Machine Tool
o Handling and Assembly Automation
o Packaging
o Intralogistics

• By Industry
o Discrete
o Hybrid
o Process

• By Geography
o North America
o South America
o Europe
o Asia-Pacific
o Middle East and Africa

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