High-Density Interconnect (HDI) PCB Market Key Players by 2025 : Compeq Manufacturing Co. Ltd, TTM Technologies, Unimicron, AT&S, Ibiden Group, SEMCO, Unitech Printed Circuit Corp., Tripod Technology Corp., DAP Corporation, and Meiko

According to a recent report published by Allied Market Research, titled,"HDI PCB Market by End-User and Application: Global Opportunity Analysis and Industry Forecast, 2018 - 2025,"the global HDI PCBs market was valued at $9,491.0 million in 2017 and is projected to reach $22,258.8 million by 2025, growing at a CAGR of 11.1% from 2018 to 2025.

In 2017, in terms of revenue, consumer electronics segment dominated the global HDI PCB market in the end-user category. By application, the smartphone & tablet segment is anticipated to dominate the market throughout the forecast period. The key players are adopting new techniques to provide advanced technologies to the customers.

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At present, Asia-Pacific dominates the market, followed by Europe. In 2017, China dominated the Asia-Pacific market and Germany led the overall market in Europe. While, in North America, the US dominates the current market.
The factors such as miniaturization of size and lower weight, high efficiency, and growing sales of consumer electronics are expected to drive the global HDI PCB market. However, high construction cost impedes the growth of the global market. In the near future, increasing utilization of HDI technology in automobiles is expected to provide lucrative opportunities for the growth of the global HDI PCB market.

According to Prasad Kakade, Lead Analyst at Allied Market Research, In 2017, in terms of revenue, consumer electronics segment dominated the global HDI PCB market in the end-user category. By application, the smartphone & tablet segment is anticipated to dominate the market throughout the forecast period. The key players are adopting new techniques to provide advanced technologies to the customers.

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Key Findings of the HDI PCB Market:

• Based on end user, the consumer electronics segment led the global HDI PCB market in 2017. However, the industrial electronics segment is anticipated to grow at the highest CAGR during the forecast period.
• Asia-Pacific held a major market share in 2017.
• By application, the smartphone & tablets segment dominated the global HDI PCB market in 2017.
• LAMEA is anticipated to exhibit the highest CAGR during the forecast period.

Top Impacting Factors

Miniaturization of size and lower weight

HDI PCBs enable accommodation of more components on either side of the PCB, which increases its functionality and maximizes the abilities of the products or equipment in which it is incorporated. In addition to the high functionality of the HDI boards, the size and weight of the products are also reduced as compared to the traditional PCBs. These boards are heavily utilized in communication devices such as smartphones and tablets, as these products are small and require high functionality in limited space. Moreover, rising need of better power performance of consumer electronic devices and larger color display demands larger battery space reducing the space for PCBs in these devices, thereby driving the growth of the global HDI PCB market.

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High efficiency

The HDI PCBs utilize minimum materials and boards for its composition and also increase the efficiency of HDI boards as compared to conventional PCBs. In addition, the time required for the construction of these boards is less that helps faster production. Such functionalities of HDI boards increases the performance of the devices in which it is incorporated. All these factors are expected to drive the growth of the global HDI PCB market.

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