Wafer Level Packaging Market to Gain a Stronghold by 2026

Packaging industry has made strides in terms of design incorporating functionality into the mix. Innovations in packaging have become key to keeping up with the changing needs of the consumers as well as the manufacturers. Packaging has encompassed almost all the industries in the world and they have individually experienced a shift in their packaging designs. One of the most interesting industries to incorporate packaging innovation into their operations is the semiconductor and technology industry.

Semiconductor and technology industry utilizes packaging not only in the overall packaging of the product, but also during the manufacturing of the product on the shop floor. One of these techniques is the wafer based packaging. Wafer based package being the same size as the die allows the wafer fabrication, packaging, testing and the burn-in during the manufacturing process till the shipment.

With the rise in the demand for smaller and faster consumer electronics, we can expect the wafer level packaging market to experience a positive impact. Wafer level packaging allows for greater flexibility and integration providing a small, thin package giving us an active interposer. By decreasing the die size and increasing the wafer size, wafer level packaging is more cost effective compared to the conventional method of production of integrated circuits. With the rising demand for longer battery life and smaller designs in smart phones, we will find wafer level packaging to perfectly fit the bill.

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The open source appropriate technology allows for collaboration among different players in the market to produce a superior product that will keep redefining the technology and semiconductor sector. The wide use of wafer level packaging in radar technology has allowed it to become an essential art in the self-driving cars. Also, the healthcare medical devices sector and wearable devices market will heavily utilize wafer level packaging market. The boost in these sectors will positively impact the wafer level packaging market. The wafer level packaging is prone to chipping during the process of production and shipping.

In terms of geography, the wafer level packagingmarket has been divided in to five key regions; North America, Latin America, Europe, Asia-Pacific and Middle East & Africa. The wafer level packaging market is expected to exhibit an above average CAGR during the forecast period. Asia Pacific region will continue to show a rise in demand for wafer level packaging due to the rising disposable incomes in the market. The growing adoption of smartphones in India will permit the wafer level packagingmarket to experience a tumultuous rise in demand. The production of wafer level packagingwill be focused more in the APEJ region.

Some of the key players in the wafer level packaging market are Jiangsu Changjiang Electronics Technology Co. Ltd., Infineon Technologies AG, KLA-Tencor Corration, China Wafer Level CSP Co. Ltd., Marvell Technology Group Ltd., Siliconware Precision Industries, Deca Technologies, Nanium SA, STATS ChipPAC Ltd.

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