Global 3D IC & 2.5D IC Packaging Industry Research by Company, Type & Application 2023

ReportsnReports recently announces a latest research report titled “Global 3D IC & 2.5D IC Packaging Market 2018” which highlights the 3D IC & 2.5D IC Packaging Market size, comprehensive 3D IC & 2.5D IC Packaging Industry dynamics and high-tech updates of global 3D IC & 2.5D IC Packaging Market with respect to 3D IC & 2.5D IC Packaging Industry opportunities, threats, challenges, constraints, cost structure and current trends in the 3D IC & 2.5D IC Packaging Industry.

Download 3D IC & 2.5D IC Packaging Market Research (Sample) Copy: https://www.reportsnreports.com/contacts/requestsample.aspx?name=1764952

This independent 116 Page report based on analysis over 11 Major Key Players guarantees you will remain better informed than your competition. 2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.

Report Covers 3D IC & 2.5D IC Packaging Market Segment by Top Manufacturers are:

• Intel Corporation
• Toshiba Corp
• Samsung Electronics
• Stmicroelectronics
• Taiwan Semiconductor Manufacturing
• Amkor Technology
• United Microelectronics
• Broadcom
• ASE Group
• Pure Storage
• Advanced Semiconductor Engineering

3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers. The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.
In terms of Technology, the market is categorized into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP). Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.

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3D IC & 2.5D IC Packaging Market Segmentation based on the Product Types are:

- 3D TSV
- 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

3D IC & 2.5D IC Packaging Market Segmentation based on the User Applications are:

- Automotive
- Consumer electronics
- Medical devices
- Military & aerospace
- Telecommunication
- Industrial sector and smart technologies

To understand 3D IC & 2.5D IC Packaging Market dynamics in the world principally, the global 3D IC & 2.5D IC Packaging Market is analyzed across key global regions. ReportsnReports also prepares customized separate regional and country-level 3D IC & 2.5D IC Packaging reports for the following areas :- North America: United States, Canada, and Mexico.
Central & South America: Brazil and Argentina.
Middle East & Africa: Saudi Arabia, and Turkey.
Europe: Germany, France, UK, Italy, Spain, and Russia.
Asia-Pacific: China, India, Japan, South Korea, Australia, Indonesia, and Singapore.

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This release was published on openPR.