Global Advanced Packaging Market Consumer Needs, Trends and Drivers Analysis and Forecast to 2025

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This report researches the worldwide Advanced Packaging market size (value, capacity, production and consumption) in key regions like North America, Europe, Asia Pacific (China, Japan) and other regions.
This study categorizes the global Advanced Packaging breakdown data by manufacturers, region, type and application, also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter’s Five Forces Analysis.

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During the final stages of semiconductor development, a tiny block of materials (the silicon wafer, logic, and memory) is wrapped in a supporting case that prevents physical damage and corrosion and allows the chip to be connected to a circuit board. Typical packaging configurations have included the leadless chip carriers and pin-grid arrays of the 1980s, the system-in-package and package-on package setups of the 2000s, and, most recently, 2-D integrated-circuit technologies such as wafer-level, flip-chip, and through silicon via setups.
The commercial reality for most integrated-circuit (IC) manufacturers is that node migrations and changes in wafer sizes are slowing down even as capital expenditures are increasing. One way for manufacturers to preserve their edge on their circuits small sizes, low costs, and high performance is to incorporate newer chip-packaging options such as 2.5-D integrated circuits (2.5DICs) and 3-D integrated circuits (3.0DICs) into their production processes. These advanced-packaging technologies, many of which are still in their infancy, promise greater chip connectivity and lower power consumption compared with traditional packaging configurations.

Meanwhile, advanced packaging has become a technology priority for the Chinese semiconductor industry, according to the high-level policy framework released by the State Council of the Peoples Republic of China in June 2014. The council aims to have advanced packaging account for about 30 percent of all packaging revenues earned by Chinese vendors by 2015.

Global Advanced Packaging market size will increase to xx Million US$ by 2025, from xx Million US$ in 2017, at a CAGR of xx% during the forecast period. In this study, 2017 has been considered as the base year and 2018 to 2025 as the forecast period to estimate the market size for Advanced Packaging.

This report focuses on the top manufacturers’ Advanced Packaging capacity, production, value, price and market share of Advanced Packaging in global market. The following manufacturers are covered in this report:
ASE
Amkor
SPIL
Stats Chippac
PTI
JCET
J-Devices
UTAC
Chipmos
Chipbond
STS
Huatian
NFM
Carsem
Walton
Unisem
OSE
AOI
Formosa
NEPES

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Advanced Packaging Breakdown Data by Type
3.0 DIC
FO SIP
FO WLP
3D WLP
WLCSP
2.5D
Filp Chip

Advanced Packaging Breakdown Data by Application
Automotives
Computers
Communications
LED
Healthcare
Other

Advanced Packaging Production Breakdown Data by Region
United States
Europe
China
Japan
Other Regions

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The study objectives are:
To analyze and research the global Advanced Packaging capacity, production, value, consumption, status and forecast;
To focus on the key Advanced Packaging manufacturers and study the capacity, production, value, market share and development plans in next few years.
To focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.

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