3D IC & 2.5D IC Packaging Market Size, Shares | Industry Revenue by Top Key Companies – Intel Corporation,Toshiba Corp, Samsung Electronics, Stmicroelectronics, Taiwan Semiconductor Manufacturing

2.5D interposer is also a 3D WLP that interconnects die side-side on a silicon, glass or organic interposer using TSVs and RDL. In all types of 3D Packaging, chips in the package communicate using off-chip signaling, much as if they were mounted in separate packages on a normal circuit board.

The 3D IC & 2.5D IC Packaging Market report offers a detailed Outlook and future prospects of the Industry. The 3D IC & 2.5D IC Packaging market report includes various topics like market size & share, Competitive Analysis, applications, key market drivers & restraints, challenges, growth opportunities, key players, competitive landscape, Regions etc.

3D ICs can be divided into 3D Stacked ICs (3D SIC), which refers to stacking IC chips using TSV interconnects, and monolithic 3D ICs, which use fab processes to realize 3D interconnects at the local levels of the on-chip wiring hierarchy as set forth by the ITRS, this results in direct vertical interconnects between device layers.

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Scope of the Report:

The Global 3D IC & 2.5D IC Packaging Market is poised to grow strong during the forecast period 2017 to 2027. Some of the prominent trends that the market is witnessing include increasing demand for high-end computing, servers, and data centers, rising demand for smartphones, tablets, and gaming devices and recent technological developments in 3D IC & 2.5D IC packaging.

In terms of Technology, the market is categorised into 3D TSV, 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP).

Depending on Application, the market is classified into MEMS/Sensors, logic, imaging & optoelectronics, power, analog & mixed signal, RF, photonics, memory and LED.

The worldwide market for 3D IC & 2.5D IC Packaging is expected to grow at a CAGR of roughly xx% over the next five years, will reach xx million US$ in 2023, from xx million US$ in 2017, according to a new GIR (Global Info Research) study.

Market Segment by Companies, this report covers

• Intel Corporation
• Toshiba Corp
• Samsung Electronics
• Stmicroelectronics
• Taiwan Semiconductor Manufacturing
• Amkor Technology
• United Microelectronics
• Broadcom
• ASE Group
• Pure Storage
• Advanced Semiconductor Engineering

Market Segment by Type, covers

• 3D TSV
• 2.5D and 3D Wafer-Level Chip-Scale Packaging (WLCSP)

Market Segment by Applications, can be divided into

• Automotive
• Consumer electronics
• Medical devices
• Military & aerospace
• Telecommunication
• Industrial sector and smart technologies

Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

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There are 15 Chapters to deeply display the global 3D IC & 2.5D IC Packaging market.

Chapter 1, to describe 3D IC & 2.5D IC Packaging Introduction, product scope, market overview, market opportunities, market risk, market driving force;
Chapter 2, to analyze the top manufacturers of 3D IC & 2.5D IC Packaging, with sales, revenue, and price of 3D IC & 2.5D IC Packaging, in 2016 and 2017;
Chapter 3, to display the competitive situation among the top manufacturers, with sales, revenue and market share in 2016 and 2017;
Chapter 4, to show the global market by regions, with sales, revenue and market share of 3D IC & 2.5D IC Packaging, for each region, from 2013 to 2018;
Chapter 5, 6, 7, 8 and 9, to analyze the market by countries, by type, by application and by manufacturers, with sales, revenue and market share by key countries in these regions;
Chapter 10 and 11, to show the market by type and application, with sales market share and growth rate by type, application, from 2013 to 2018;
Chapter 12, 3D IC & 2.5D IC Packaging market forecast, by regions, type and application, with sales and revenue, from 2018 to 2023;
Chapter 13, 14 and 15, to describe 3D IC & 2.5D IC Packaging sales channel, distributors, traders, dealers, Research Findings and Conclusion, appendix and data source

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This release was published on openPR.