Press release
High-bandwidth Memory Market to Witness Robust Expansion by 2023
High-bandwidth memory (HBM) is a dynamic random-access memory (DRAM) technology approved by the Joint Electron Device Engineering Council (JEDEC) as an industry standard. The technology uses through-silicon vias (TSVs) and a silicon interposer technology to interconnect stacked DRAM dies.
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Global High-bandwidth Memory Market: Forecast by Type / Application / Region
This prosperity of the market for aluminum foil packaging is a reflection of a number of factors, such as high preference for convenience packaging, growing demand for extended shelf-life of packaged food, popularity of ready-to-eat meals and processed food, and growing usage in pharmaceutical products and confectionaries.
The worldwide market for High-bandwidth Memory is expected to grow at a CAGR of roughly x% over the next five years, will reach x million US$ in 2023, from x million US$ in 2017, according to a new GIR (Global Info Research) study.
This report focuses on the High-bandwidth Memory in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
Global Nonferrous Metal Recycling Market:Key Players
Advanced Micro Devices
Intel
SAMSUNG
SK HYNIX
XILINX
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Related Information:
United States High-bandwidth Memory Market 2018 Forecast to 2023
Europe High-bandwidth Memory Market 2018 Forecast to 2023
North America High-bandwidth Memory Market 2018 Forecast to 2023
Asia-Pacific High-bandwidth Memory Market 2018 Forecast to 2023
China High-bandwidth Memory Market 2018 Forecast to 2023
EMEA High-bandwidth Memory Market 2018 Forecast to 2023
Global High-bandwidth Memory Market 2018 Forecast to 2023
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