Global Ultra-low Alpha Metals Market 2016-2024 | Indium Corporation, Honeywell International Inc., Mitsubishi Materials Corporation, Pure Technologies

Ultra-low alpha metals possess the alpha emission rate of 0.002 cph/cm2 (the unit cph/cm2 stands for counts per hour per centimeter square) or less. Alpha emission of a material can be defined as transformation or decaying of one atom into another with mass number reduced by four and atomic number reduced by two. The rate of alpha emission determines the grade of the metal as low alpha ( less than 0.02 cph/cm2), ultra-low alpha ( less than 0.002 cph/cm2), or super ultra-low alpha ( less than 0.001 cph/cm2).

The report estimates and forecasts the ultra-low alpha metal market on the global and regional levels. The study provides forecast between 2016 and 2024 based on volume (tons/kilograms) and revenue (US$ Mn/US$ thousand) with 2015 as the base year. The report comprises an exhaustive value chain analysis for each of the segments. It provides a comprehensive view of the market. Value chain analysis also offers detailed information about value addition at each stage.

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Global Ultra-low Alpha Metals Market: Drivers and Trends

The study includes drivers and restraints for the ultra-low alpha metal market along with their impact on demand during the forecast period. The study also provides key market indicators affecting the growth of the market. The report analyzes opportunities in the ultra-low alpha metal market on the global and regional level. Drivers, restraints, and opportunities mentioned in the report are justified through quantitative and qualitative data. These have been verified through primary and secondary resources. Furthermore, the report analyzes substitute analysis of ultra-low alpha metal and global average price trend analysis.

Ultra-low alpha metals are predominantly employed in soldering fabrication in the flip chip technology sector. They are also used in plating, bumping, PCBs, semiconductor packaging, and circuit boards. These components are required in different industries including electronics, medical, aviation, automotive, and telecommunication.

Global Ultra-low Alpha Metals Market: Segmentation

Ultra-low alpha metals are segmented on the basis of product as ULA tin (tin alloys with the proportion of tin (Sn) being 99% or greater), ULA tin alloys (the proportion of tin (Sn) being less than or equal to 95% in the alloy and other constituent metals being silver (Ag) and copper (Cu)), ULA lead alloys (alloys with varying compositions of lead (Pb) and tin (Sn)) and ULA lead-free alloys (alloys that do not contain lead (Pb) at all or contain lead in a very low proportion (0.1%)).

Typically, advanced solder bumping applications, which are common features of 3-D wafer-level chip packages and advanced flip chip, require ULA metals. Alpha emissions in these chip components are often responsible for soft errors caused, as they are situated near sensitive device features. It is essential that metals and alloys used in soldering applications, especially in PCB assemblies, have ultra-low alpha grade so as to avoid malfunctioning caused by soft errors in devices, such as automotive systems, computer motherboards, network servers, consumer electronic products and medical and military equipment.

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Key Players Mentioned in this Report are:

The report covers detailed competitive outlook that includes market share and profiles of key players operating in the global market. Key players profiled in the report include Indium Corporation, Honeywell International Inc., Mitsubishi Materials Corporation, Pure Technologies, and Alpha Assembly Solutions. Company profiles include attributes such as company overview, number of employees, brand overview, key competitors, business overview, business strategies, recent/key developments, acquisitions, and financial overview (wherever applicable).

Ultra-low Alpha Metal Market – Product Analysis
- ULA Tin
- ULA Tin Alloys
- ULA Lead Alloys
- ULA Lead-free Alloys

Ultra-low Alpha Metal Market – End-user Industry Analysis
- Aviation
- Automotive
- Electronics
- Medical
- Telecommunication
- Others

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