Focus on modular IoT standards
Prof. Dr. Abdelmajid Khelil emphasizes the importance of cooperating with industry partners such as congatec: “Students need practical industry challenges to enable them to develop digitization prototypes for real-world applications instead of working inside an academic ivory tower. Modular systems such as congatec’s embedded computer technology and SGET’s UIC standard, which defines a kind of universal modular IoT connector on the software side, are also excellent examples of scientifically recognized development methods. As a result, this cooperation brings theory and practice together in perfect harmony.”
The UIC project, which saw several students working in groups to develop a solution for exchanging data between a computer and a cloud using agile software and system development methods, was mentored by Carsten Rebmann, R&D Director at congatec. Together with lab coach Tobias Christian Piller, he coordinated the project work with the HAW Landshut IoT Innovation Lab, defined the requirements for the software component prototype and monitored project milestone compliance.
Rebmann is enthusiastic about the cooperation with the IoT Innovation Lab and students’ commitment: “I greatly enjoyed coordinating the project with Professor Khelil and the very dedicated coach of the Innovation Lab, Tobias Christian Piller, as well as supervising the group work. Next to developing a concrete component for SGET’s UIC standard, the goal was to explore the journey to get there by trying out solution ideas and creating proof-of-concepts with agile development methods such as Scrum. Thanks to the great commitment from the university and students, this has worked out extremely well and we are looking forward to implementing further projects.”
The results of the IoT project, which counts as a specialization module and during which the “UIC Communication Engine for Amazon Web Services (AWS)” was developed, will be incorporated into the SGET standards and made publicly available under MIT license on the online software development platform GitHub. The MIT license makes it possible to distribute reviews and larger projects without releasing the source code. The results of the students’ open-source IoT project are accessible to the entire community and described in detail at https://github.com/sgetuic/aws_ca.
The spokesman for the student development team, Sebastian Niksch, confirms that despite the great challenges, the project was highly enjoyable: “Actively developing components for digital transformation and knowing that they will be included in standards and probably used worldwide gives us a sense of pride. At the same time, we have gained deeper insight in concrete IoT challenges faced by industry, and learned through practical experience how to approach them methodically. Also, we now understand the challenge of connecting the IoT with hundreds of clouds and even more field devices much better. Uniform standards like the SGET seem to make great sense under those circumstances.”
congatec is a leading supplier of industrial computer modules using the standard form factors COM Express, Qseven and SMARC as well as single board computers and customizing services. congatec’s products can be used in a variety of industries and applications, such as industrial automation, medical, entertainment, transportation, telecommunication, test & measurement and point-of-sale. Core knowledge and technical know-how includes unique extended BIOS features as well as comprehensive driver and board support packages. Following the design-in phase, customers are given support via extensive product lifecycle management. The company’s products are manufactured by specialist service providers in accordance with modern quality standards. Headquartered in Deggendorf, Germany, congatec currently has entities in USA, Taiwan, China, Japan and Australia as well as United Kingdom, France, and the Czech Republic. More information is available on our website at www.congatec.com or via Facebook, Twitter and YouTube.
This release was published on openPR.
Permanent link to this press release:
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.
You can edit or delete your press release Focus on modular IoT standards here
News-ID: 1219787 • Views: 1017
More Releases from congatec AG
Happy new year for high-end embedded computers: The world's fastest Client Compu …
Deggendorf, Germany, 3 January 2023 * * * congatec - a leading vendor of embedded and edge computing technology - announces the availability of COM-HPC and COM Express Computer-on-Modules based on high-end 13th Gen Intel Core processors in BGA assembly. congatec expects series production of OEM designs based on these new modules to ramp up quickly and massively as the new processors with long life availability offer vast improvements in
Mini form factor for maximum performance
Deggendorf, Germany, 19. December 2022 * * * congatec is pleased to announce that the PICMG COM-HPC technical subcommittee has approved the pinout and footprint of the new credit-card-sized (95x60mm) high-performance Computer-on-Module specification COM-HPC Mini. The new COM-HPC Mini standard is now entering the home stretch towards final ratification, which is scheduled for the first half of 2023. Designed for small yet extremely performance-hungry applications the new COM-HPC Mini specification
Ultra-rugged quad core module
Deggendorf, Germany, 30 April 2020 * * * congatec - a leading vendor of embedded computing technology - introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen(TM) Embedded V1000 Series processors for the industrial temperature range from 40�C to +85�C. It is available with optional burn-in & cold-soak stress screening service for highest reliability. The most demanding graphics and compute workloads benefit from the
More Releases for IoT
IoT Cloud Market Next Big Thing | Major Giants Oracle, AWS IOT, IBM Watson IoT, …
COVID-19 Outbreak-Global IoT Cloud Industry Market Report-Development Trends, Threats, Opportunities and Competitive Landscape in 2020 is latest research study released by HTF MI evaluating the market, highlighting opportunities, risk side analysis, and leveraged with strategic and tactical decision-making support. The study provides information on market trends and development, drivers, capacities, technologies, and on the changing investment structure of the COVID-19 Outbreak-Global IoT Cloud Market. Some of the key players profiled
Narrowband IoT (NB-IoT) Market Future Adoption Overview 2025
The report titled "Global Narrowband IoT (NB-IoT) Market Size, Status and Forecast 2025, Trends, Share, Size Research Report " offers a primary impression of the Narrowband IoT (NB-IoT) industry covering different product Scope, Characterizations, Classifications, Objectives, and Participants in the industry chain structure. This report profiles major 15 topmost manufactures operating like ( Vodafone, China Unicom, China Telecom, AT&T, Etisalat, Telstra, Orange, Telefonica, SK Telecom, Deutsche Telekom - for complete manufactures list, please
Blockchain In IOT Market Business Growth Statistics And Key Players Insights Blo …
Research N Report has released a new report on the “global Blockchain in IOT Market”. This report offers a comprehensive evaluation of the market. It does so via in-depth insights, understanding market evolution by tracking historical developments, and analyzing the present scenario and future projections based on optimistic and likely scenarios. Each research report serves as a repository of analysis and information for every side of the market. "Blockchain in Internet
IoT Healthcare Market - Revolution in Healthcare with IOT & IoT has the Potentia …
In this report, the Internet of Things (IoT) Healthcare market was valued at USD 28.42 Billion in 2015, and is projected to reach USD 337.41 billion by 2025, growing at a CAGR of 28.2% over the forecast period. "Internet of Things (IoT) Healthcare Market", published by Xpodence Research, provides extensive insight and analysis of the Internet of Things (IoT) Healthcare market over the next eight years (2015-2025) and acts as a
Narrowband IoT (NB-IoT) Chipset Market - Product Drawbacks 2025
Global Narrowband IoT (NB-IoT) Chipset Market: Overview Narrowband IoT (NB‑IoT) is the new method of communicating with “things” that need limited amounts of data, over long periods, in places that are hard to reach. It is essentially a wireless technology that was standardized by 3GPP in 2016. Request Sample Copy of the Report @ https://www.tmrresearch.com/sample/sample?flag=B&rep_id=2879 Narrowband IoT is considered the best in class low-power wide area (LPWA) technology to facilitate functioning of various
Narrowband IoT (NB-IoT) Chipset Market Rapidly expanding 2025
Global Narrowband IoT (NB-IoT) Chipset Market: Overview Narrowband IoT (NB‑IoT) is the new method of communicating with “things” that need limited amounts of data, over long periods, in places that are hard to reach. It is essentially a wireless technology that was standardized by 3GPP in 2016. Narrowband IoT is considered the best in class low-power wide area (LPWA) technology to facilitate functioning of various new industrial IoT (IIoT) devices, which includes