Chip On Flex Market Analysis by Global Leaders: Compunetics, AKM industrial company, Chipbond technology, Flexceed, CWE, Danbond technology, LGIT, Stemko group

Market Research Future published a research report on “Global Chip On Flex Market Research Report- Forecast to 2021” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2021.

Market Scenario:

Chip-on-Flex refers to the semiconductor assembly technology wherein the microchip or die is directly mounted on and electrically connected to a flexible circuit which is a circuit built on a flexible substrate instead of the usual printed circuit board. The shorter interconnection paths on chip on flex simplifies the process of designing and manufacturing the product and improving its performance. Chip on flex has some important features such as heat sinks, component assembly, penalization, shielding, over molding and graphic overlay among others which makes it more acceptable among end users such as electronic industry, aerospace, defense and others. The major drivers for the growth of this market are increasing need for small and flexible electronics in various applications such as displays, sensors, lighting, biomedical implants, and radio frequency identification among others and the rapid technological advancements which lead to accurate designs and automated production, of flex circuits that helps to eliminate human errors once involved in hand-built wire harnesses. With the use of these flexible circuit board companies ensure the 100% efficiency in the products, due to which level of fault ratio is drastically reduced. Chip on flex helps in reducing the cost, improving operator ergonomics, amplified product quality and testing repeatability.

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The Global Chip on Flex Market is expected to grow from US ~$1437 Million in 2016 to US~$ 1795 Million by 2021, at an estimated CAGR of 4.43%. The growth of this market can be constrained by the increased cost of raw materials in related industries like the electronic industry along with the wide variety of technology used and the consumer needs changing to efficient, cheaper and powerful consumer electronics and mobile technologies.

Key Players

The prominent players in the market of chip on flex market are – LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.

Market Segmentation

The worldwide chip flex market has been divided into four equal parts. They consist of applications, geographies, verticals and types.

On account of applications, the market has been bifurcated into dynamic and static flexing.

Geographically, the market is spread across various regions of the globe like Europe, Asia Pacific, North America and Rest of the World. Amongst these, Asia Pacific is expected to grow at a rapid pace in the coming years.
When it comes to verticals, the industry is fragmented into medical, electronics, military and aerospace.

Lastly, on the basis of types, the market can be separated into single sided chip flex and others.

Regional Analysis:

The regional analysis of chip on flex market is being studied for areas such as Asia pacific, North America, Europe and rest of the world. Asia pacific is expected to record highest growth rate owing to existence of large number of chip on flex manufacturers in china like Danbond Technology, AKM Industrial, Compass Technology Company and others. Asia pacific will be followed by North America owing to increased adoption of new technologies especially in automobile sector. American depository of shares is also helping in mergers of various organizations to enhance the production capabilities in chip on flex market. Many well established firms such as AKM Industrial, Compunetics and others are increasing their sales area in the Europe region which will lead to the growth of Europe region in chip on flex market.

Innovations

One of the most recent advancements in this field has been the introduction of flexible display. Although, the product is yet to be launched in the commercial market, the makers have high hopes and expectations from it. It can help vendors to decrease the manufacturing cost of the end product and hence will promote commercialization.

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Intended Audience

• COF manufactures
• Industries such as aerospace, automotive, IT, industrial, and medical, among others
• Government institutions
• Research institutions
• Adhesive manufacturers
• Conductor and insulator manufacturers like silver, copper and others

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