Press release
3D Ics 2018 Global Industry Size, Share, Trends, key Players Analysis, Applications, Forecasts to 2023
WiseGuyReports.Com Publish a New Market Research Report On –“ 3D Ics 2018 Global Industry Size, Share, Trends, key Players Analysis, Applications, Forecasts to 2023”.Description:-
3D IC is a single chip in which all components onthe layers communicate using on-chip signaling, whethervertically or horizontally.
Scope of the Report:
This report focuses on the 3D Ics in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.
There are four ways to built 3D ICs :- 1. Monolithic 2. Wafer on wafer 3. Die on wafer 4. Die on die
3D integration can reduce the wiring, thereby reducing the capacitances, power dissipation and chip area improves performance.
The worldwide market for 3D Ics is expected to grow at a CAGR of roughly 15.9% over the next five years, will reach 7340 million US$ in 2023, from 3030 million US$ in 2017, according to a new GIR (Global Info Research) study.
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Market Segment by Manufacturers, this report covers
XILINX
Taiwan Semiconductor Manufacturing Company
The 3M Company
Tezzaron Semiconductor Corporation
STATS ChipPAC
Ziptronix
United Microelectronics Corporation
MonolithIC 3D
Elpida Memory
Market Segment by Regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia and Italy)
Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
South America (Brazil, Argentina, Colombia etc.)
Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)
Market Segment by Type, covers
Beam re-crystallization
Wafer bonding
Silicon epitaxial growth
Solid phase crystallization
Market Segment by Applications, can be divided into
Consumer electronics
Information and communication technology
Transport (automotive and aerospace)
Military
Others(Biomedical applications and R&D)
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Table Of Contents – Major Key Points
1 Market Overview
1.1 3D Ics Introduction
1.2 Market Analysis by Type
1.2.1 Beam re-crystallization
1.2.2 Wafer bonding
1.2.3 Silicon epitaxial growth
1.2.4 Solid phase crystallization
1.3 Market Analysis by Applications
1.3.1 Consumer electronics
1.3.2 Information and communication technology
1.3.3 Transport (automotive and aerospace)
1.3.4 Military
1.3.5 Others(Biomedical applications and R&D)
1.4 Market Analysis by Regions
1.4.1 North America (United States, Canada and Mexico)
1.4.1.1 United States Market States and Outlook (2013-2023)
1.4.1.2 Canada Market States and Outlook (2013-2023)
1.4.1.3 Mexico Market States and Outlook (2013-2023)
1.4.2 Europe (Germany, France, UK, Russia and Italy)
1.4.2.1 Germany Market States and Outlook (2013-2023)
1.4.2.2 France Market States and Outlook (2013-2023)
1.4.2.3 UK Market States and Outlook (2013-2023)
1.4.2.4 Russia Market States and Outlook (2013-2023)
1.4.2.5 Italy Market States and Outlook (2013-2023)
1.4.3 Asia-Pacific (China, Japan, Korea, India and Southeast Asia)
1.4.3.1 China Market States and Outlook (2013-2023)
1.4.3.2 Japan Market States and Outlook (2013-2023)
1.4.3.3 Korea Market States and Outlook (2013-2023)
1.4.3.4 India Market States and Outlook (2013-2023)
1.4.3.5 Southeast Asia Market States and Outlook (2013-2023)
1.4.4 South America, Middle East and Africa
1.4.4.1 Brazil Market States and Outlook (2013-2023)
1.4.4.2 Egypt Market States and Outlook (2013-2023)
1.4.4.3 Saudi Arabia Market States and Outlook (2013-2023)
1.4.4.4 South Africa Market States and Outlook (2013-2023)
1.4.4.5 Nigeria Market States and Outlook (2013-2023)
1.5 Market Dynamics
1.5.1 Market Opportunities
1.5.2 Market Risk
1.5.3 Market Driving Force
2 Manufacturers Profiles
2.1 XILINX
2.1.1 Business Overview
2.1.2 3D Ics Type and Applications
2.1.2.1 Product A
2.1.2.2 Product B
2.1.3 XILINX 3D Ics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.2 Taiwan Semiconductor Manufacturing Company
2.2.1 Business Overview
2.2.2 3D Ics Type and Applications
2.2.2.1 Product A
2.2.2.2 Product B
2.2.3 Taiwan Semiconductor Manufacturing Company 3D Ics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.3 The 3M Company
2.3.1 Business Overview
2.3.2 3D Ics Type and Applications
2.3.2.1 Product A
2.3.2.2 Product B
2.3.3 The 3M Company 3D Ics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.4 Tezzaron Semiconductor Corporation
2.4.1 Business Overview
2.4.2 3D Ics Type and Applications
2.4.2.1 Product A
2.4.2.2 Product B
2.4.3 Tezzaron Semiconductor Corporation 3D Ics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.5 STATS ChipPAC
2.5.1 Business Overview
2.5.2 3D Ics Type and Applications
2.5.2.1 Product A
2.5.2.2 Product B
2.5.3 STATS ChipPAC 3D Ics Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
Continued……
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Wise Guy Reports is part of the Wise Guy Consultants Pvt. Ltd. and offers premium progressive statistical surveying, market research reports, analysis & forecast data for industries and governments around the globe. Wise Guy Reports features an exhaustive list of market research reports from hundreds of publishers worldwide. We boast a database spanning virtually every market category and an even more comprehensive collection of market research reports under these categories and sub-categories.
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