Semiconductor Wafer Fab Equipment (WFE) Market Size & Share - Industry Trend and Forecast 2014 - 2020

The report analyzes and presents an overview of "Semiconductor Wafer Fab Equipment (WFE) Market - Global Industry Analysis, Size, Share, Growth, Trends And Forecast, 2014 - 2020" worldwide.

The main objective of this report is to define, describe, and forecast the global “Semiconductor Wafer Fab Equipment (WFE)” market on the basis of types of applications, major sectors, deployment models, organization size, and regions. The report contains an analysis of the major factors influencing the growth of the market (drivers, restraints, opportunities, and challenges). It aims to strategically analyze the micromarkets with respect to individual growth trends, prospects, and their contribution to the market. The report attempts to forecast the market size for 5 major regions, namely, North America, Europe, Asia Pacific (APAC), Middle East and Africa (MEA), and Latin America. It contains key vendor profiles and comprehensively analyzes their core competencies. The report also tracks and analyzes competitive developments, including partnerships, collaborations, acquisitions, new product developments, and R&D activities in the market.

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Semiconductor wafer fabrication is defined as process for production of photonic and electrical circuits which include LEDs, RF (radio frequency) amplifiers, and, optical computer components. Wafer fabrication helps in building components with required electrical structures. Wafer fabrication process is done for processing raw wafers to finished chips (discrete or integrated circuits). Traditional wafer fabrication process involves individual steps for resistors, transistors, conductors, and other electronic components processing on the semiconductor wafer. Semiconductor equipment plays a vital role in IC manufacturing which are located in fab, a manufacturing facility. Thus, semiconductor wafer fabrication is used to create circuits which are used in electronic and electrical devices. In semiconductor device fabrication, a wide range of processes are used to transform a “bare silicon” wafer to a circuit. These processes include PVD/CVD (physical or chemical vapor deposition), RTP (rapid thermal processing) plasma etch, photolithography, and CMP (chemical-mechanical planarization).

Semiconductor wafer fabrication involves sequential steps of chemical and photolithographic processes which create a semiconductor device. Semiconductor device fabrication involves four steps which include processes ranging from deposition, removal to modification of electrical properties. Silicon is used to make wafers while fabrication is done. Silicon is melted, purified, and cooled to form an “ingot” which is further cut into wafers. To ensure the quality of semiconductor wafer fabrication equipment, a wafer test is done to monitor damages caused to the wafer. It helps in analyzing whether the processing can continue or not.

Factors such as growing demand from consumer electronics industry, and increasing technological advancements in telecom and semiconductor sector are expected to drive the demand for semiconductor wafer fab equipment market during the forecast period. Other factors such as demand for silicon wafer, equipment footprint would help in analyzing semiconductor wafer fab equipment market in future. Moreover, innovation in wafer technologies which have led to “denser packaging” of devices such as MEMS (micro-electro-mechanical system) and transistors are expected to create foundation for new opportunities which can be leveraged by companies.

Semiconductor wafer fab equipment market is segmented on the basis of wafer fabrication process, application, wafer size, and end-user. Further classification of wafer fabrication processing includes FEOL (front-end-of-line) processing, and BOEL (back-end-of-line) processing. FEOL processing is the prime stage of IC fabrication in which devices such as capacitors, and resistors, among others are amalgamated in the circuit. BEOL is the second phase of fabrication which interconnects devices on the wafer with wiring. Based on end-user the segment is classified as telecom, retail, healthcare, and banking and financial services, among others. According to the wafer size, classification includes wafers sizes such as 150 mm, 200 mm, and 300 mm. Semiconductor wafer fab equipment have varied applications for consumer audio/video and entertainment products, smart phone, television, pagers, PC peripherals, copiers, and automotive parts.

Some of the market players in the semiconductor wafer fab equipment market include Intel, TSMC (Taiwan Semiconductor Manufacturing Company), Motorola, Samsung, and Lam Research, among others. For instance, Motorola announced the launch of its first wafer processing plant in China. The technologies developed would be used to “fabricate ICs for cellular phones” in China.

This research report analyzes this market depending on its market segments, major geographies, and current market trends. Geographies analyzed under this research report include
North America
Asia Pacific
Europe
Rest of the World
This report provides comprehensive analysis of
Market growth drivers
Factors limiting market growth
Current market trends
Market structure
Market projections for upcoming years
This report is a complete study of current trends in the market, industry growth drivers, and restraints. It provides market projections for the coming years. It includes analysis of recent developments in technology, Porter’s five force model analysis and detailed profiles of top industry players. The report also includes a review of micro and macro factors essential for the existing market players and new entrants along with detailed value chain analysis.

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