Global Fan-out Wafer Level Packaging Market Anticipated for Progressive CAGR Growth during 2018-2025

Market Research Hub (MRH) has recently broadcasted a new study to its broad research portfolio, which is titled as “Global Fan-out Wafer Level Packaging Market Size, Status and Forecast 2025” provides an in-depth analysis of the Fan-out Wafer Level Packaging with the forecast of market size and growth. The analysis includes addressable market, market by volume, and market share by business type and by segment (external and in-house).The research study examines the Fan-out Wafer Level Packaging on the basis of a number of criteria, such as the product type, application, and its geographical presence.
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This report studies the global Fan-out Wafer Level Packaging market size, industry status and forecast, competition landscape and growth opportunity. This research report categorizes the global Fan-out Wafer Level Packaging market by companies, region, type and end-use industry.

FOWLP is a chip packaging technology that is used to package an IC, while the IC is still part of the wafer.
In terms of geography, APAC led the global FOWLP market. According to analysts, the region will continue to dominate this market during the forecast period as well and this will mainly attribute to the presence of major semiconductor industries in the region.
In 2017, the global Fan-out Wafer Level Packaging market size was xx million US$ and it is expected to reach xx million US$ by the end of 2025, with a CAGR of xx% during 2018-2025.

This report focuses on the global top players, covered
STATS ChipPAC
TSMC
Texas Instruments
Rudolph Technologies
SEMES
SUSS MicroTec
STMicroelectronics
Ultratech

Market segment by Regions/Countries, this report covers
United States
Europe
China
Japan
Southeast Asia
India

Market segment by Type, the product can be split into
200mm Wafer Level Packaging
300mm Wafer Level Packaging
Other

Market segment by Application, split into
CMOS Image Sensor
Wireless Connectivity
Logic and Memory IC
MEMS and Sensor
Analog and Mixed IC
Other

The study objectives of this report are:
To study and forecast the market size of Fan-out Wafer Level Packaging in global market.
To analyze the global key players, SWOT analysis, value and global market share for top players.
To define, describe and forecast the market by type, end use and region.
To analyze and compare the market status and forecast between China and major regions, namely, United States, Europe, China, Japan, Southeast Asia, India and Rest of World.
To analyze the global key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market
To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of Fan-out Wafer Level Packaging are as follows:
History Year: 2013-2017
Base Year: 2017
Estimated Year: 2018
Forecast Year 2018 to 2025
For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders
Fan-out Wafer Level Packaging Manufacturers
Fan-out Wafer Level Packaging Distributors/Traders/Wholesalers
Fan-out Wafer Level Packaging Subcomponent Manufacturers
Industry Association
Downstream Vendors

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Table of Contents

Global Fan-out Wafer Level Packaging Market Size, Status and Forecast 2025
1 Industry Overview of Fan-out Wafer Level Packaging
1.1 Fan-out Wafer Level Packaging Market Overview
1.1.1 Fan-out Wafer Level Packaging Product Scope
1.1.2 Market Status and Outlook
1.2 Global Fan-out Wafer Level Packaging Market Size and Analysis by Regions (2013-2018)
1.2.1 United States
1.2.2 Europe
1.2.3 China
1.2.4 Japan
1.2.5 Southeast Asia
1.2.6 India
1.3 Fan-out Wafer Level Packaging Market by Type
1.3.1 200mm Wafer Level Packaging
1.3.2 300mm Wafer Level Packaging
1.3.3 Other
1.4 Fan-out Wafer Level Packaging Market by End Users/Application
1.4.1 CMOS Image Sensor
1.4.2 Wireless Connectivity
1.4.3 Logic and Memory IC
1.4.4 MEMS and Sensor
1.4.5 Analog and Mixed IC
1.4.6 Other

2 Global Fan-out Wafer Level Packaging Competition Analysis by Players
2.1 Fan-out Wafer Level Packaging Market Size (Value) by Players (2013-2018)
2.2 Competitive Status and Trend
2.2.1 Market Concentration Rate
2.2.2 Product/Service Differences
2.2.3 New Entrants
2.2.4 The Technology Trends in Future

3 Company (Top Players) Profiles
3.1 STATS ChipPAC
3.1.1 Company Profile
3.1.2 Main Business/Business Overview
3.1.3 Products, Services and Solutions
3.1.4 Fan-out Wafer Level Packaging Revenue (Million USD) (2013-2018)
3.2 TSMC
3.2.1 Company Profile
3.2.2 Main Business/Business Overview
3.2.3 Products, Services and Solutions
3.2.4 Fan-out Wafer Level Packaging Revenue (Million USD) (2013-2018)
3.3 Texas Instruments
3.3.1 Company Profile
3.3.2 Main Business/Business Overview
3.3.3 Products, Services and Solutions
3.3.4 Fan-out Wafer Level Packaging Revenue (Million USD) (2013-2018)
3.4 Rudolph Technologies
3.4.1 Company Profile
3.4.2 Main Business/Business Overview

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