Flip Chip Technology Market 2018 Global Leaders: Amkor Technology, STATS ChipPAC, Powertech Technology, STMicroelectronics, Global Foundries, UMC, ASE, Texas Instruments

Market Research Future published a research report on “Flip Chip Technology Market Report- Forecast till 2023” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2023.

Flip Chip Technology Market – An Insight

The metallurgical industry is developing at a lightning speed, concepts like copper pillar and micro-bumping metallurgy are gaining a whole lot of traction. They are being put to work for developing consumer electronic products and smart devices like mobile phones and laptops. Owing to this the flip chip technology is also gaining its fair share of recognition. It can be utilized for normal-range as well as advanced-range applications. During the forecast period of 2017-2023, the global market for flip chip technology is expected to grow tremendously.

A flip chip is basically a conventional semiconductor that has been created so as to integrate solder bumps over the connection pads of the micro-electromechanical system (MEMS). This procedure can facilitate an extremely comprehensive and unswerving connection between the main source of electricity and the board.

The research report released by MRFR (Market Research Future) suggests that the market’s conversion rate will double up by the end of the forecast period i.e. 2023. The estimated CAGR for these years is 8.29%.
Recently, the field of electronics has witnessed a lot of advancement which serves as a major growth booster for the flip chip technology market. The developments like improved performance, efficient and reliable circuit boards and high packaging density further foster the growth of the market.

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Another major aspect that works in the favor of the market is flip-chips versatility. It forms an integral part of a number of devices like memory devices, application processors, PMIC, and baseband. This technology can also prove to be beneficial mobile communications, it can increase the performance bar and improve package miniaturization trends.

Although, the market may come across a small restraint in the form of expensiveness of the technology. However, efforts are being made in this direction and as the market progresses, it will cope with this small issue.

Segmentation:

The global flip chip technology market is segmented on the basis of wafer bumping process, packaging technology, packaging type, product, application, and region. On the basis of the wafer bumping process, the segment is further classified into copper (CU) pillar, lead-free, Tin-lead eutectic solder and gold stud plated solder. On the basis of the packaging technology, the market is further classified into 2D, 2.5D, and 3D packaging technology. On the basis of the packaging type, the market is further classified into FC BGA (Flip Chip Ball Grid Array), FC PGA (Flip Chip Pin Grid Array), FC LGA (Flip Chip Land Grid Array), FC QFN (Flip Chip Quad Flat No-Lead), FC SIP (Flip Chip System-In-Package), and FC CSP (Flip Chip-Chip-Scale Package). On the basis of the product the segment is further classified into LED, CMOS image sensor, CPU, RF, Analog, Mixed Signal, and Power IC, SoC and others. Flip chip technology is widely used in many areas such as consumer electronics, automotive, telecommunications, industrial, medical devices, military and aerospace and others.

Regional Analysis:

In terms of geography, Asia Pacific is anticipated to dominate the global market over the forecast period. Countries like China and India are the major manufacturing hubs and are likely to provide abundant opportunities for the growth of the flip chip technologies. As a result, the presence of major companies in this sector such as Samsung and Sony are driving the flip chip technology market in the APAC region. North America holds the second largest market share of the global flip chip technology market. Due to the presence of major players in the regions and high investments in the research and development activities are expected to drive the market.

Key Players

Some of the major players in Flip Chip Technology market are Samsung Group (South Korea), Intel Corporation (U.S.), Global Foundries (U.S.), UMC (Taiwan), ASE, Inc. (Taiwan), Amkor Technology (U.S.), STATS ChipPAC (Singapore), Powertech Technology (Taiwan), and STMicroelectronics (Switzerland), Texas Instruments (U.S.) among others.

Key Findings:

• LG Innotek developed flip-chip LED package allowing stable 220lm/W efficiency
• Intel has unveiled a superconducting quantum test chip with 49 qubits, to enable quantum computing that begins to exceed the practical limits of modern classical computers through flip chip technology

Industry News

AUSTIN, Texas: The latest update for the industry is the news that flip chip technology is going to be launched in the commercial IC market. Earlier, this device was only utilized in high-end industries but now a company named LSI Corp’s has launched a series of four-layer laminate flip-chip packages that can be employed for networking and wireless-basestation markets.

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Intended Audience

• Wafer manufacturers
• Raw material and manufacturing equipment suppliers
• Chip manufacturers
• System integrators
• Device manufacturers
• Foundry players
• Distributors and retailers
• Research organizations

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At Market Research Future (MRFR), we enable our customers to unravel the complexity of various industries through our Cooked Research Report (CRR), Half-Cooked Research Reports (HCRR), Raw Research Reports (3R), Continuous-Feed Research (CFR), and Market Research & Consulting Services.

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This release was published on openPR.