Press release
Global 3D IC and 2.5D IC Market Analysis and Forecast by key vendors, application, product, and geography from 2018
This report studies the global 3D IC and 2.5D IC market status and forecast, categorizes the global 3D IC and 2.5D IC market size (value & volume) by manufacturers, type, application, and region. This report focuses on the top manufacturers in North America, Europe, Japan, China, India, Southeast Asia and other regions (Central & South America, and Middle East & Africa).
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In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.
The global 3D IC and 2.5D IC market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018-2025.
The major manufacturers covered in this report
TSMC (Taiwan)
Samsung (South Korea)
Toshiba (Japan)
ASE Group (Taiwan)
Amkor (U.S.)
UMC (Taiwan)
Stmicroelectronics (Switzerland)
Broadcom (U.S.)
Intel (U.S.)
Jiangsu Changjiang Electronics (China)
Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering
North America
Europe
China
Japan
India
Southeast Asia
Other regions (Central & South America, Middle East & Africa)
We can also provide the customized separate regional or country-level reports, for the following regions:
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Singapore
Rest of Asia-Pacific
Europe
Germany
France
UK
Italy
Spain
Russia
Rest of Europe
Central & South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Saudi Arabia
Turkey
Rest of Middle East & Africa
On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
3D wafer-level chip-scale packaging
3D TSV
2.5D
By Application, the market can be split into
Consumer electronics
Telecommunication
Industry sector
Automotive
Military and Aerospace
Smart technologies
Medical devices
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The study objectives of this report are:
To analyze and study the global 3D IC and 2.5D IC capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);
Focuses on the key 3D IC and 2.5D IC manufacturers, to study the capacity, production, value, market share and development plans in future.
Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.
To define, describe and forecast the market by type, application and region.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends and factors driving or inhibiting the market growth.
To analyze the opportunities in the market for stakeholders by identifying the high growth segments.
To strategically analyze each submarket with respect to individual growth trend and their contribution to the market.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
To strategically profile the key players and comprehensively analyze their growth strategies.
In this study, the years considered to estimate the market size of 3D IC and 2.5D IC are as follows:
History Year: 2013-2017
Base Year: 2017
Estimated Year: 2018
Forecast Year 2018 to 2025
For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.
Key Stakeholders
3D IC and 2.5D IC Manufacturers
3D IC and 2.5D IC Distributors/Traders/Wholesalers
3D IC and 2.5D IC Subcomponent Manufacturers
Industry Association
Downstream Vendors
Available Customizations
With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:
Regional and country-level analysis of the 3D IC and 2.5D IC market, by end-use.
Detailed analysis and profiles of additional market players.
Request For TOC Report @ https://www.marketresearchreports.biz/reports/1858887/global-d-ic-and-d-market-research-reports/toc
Table of Contents
Global 3D IC and 2.5D IC Market Professional Survey Report 2018
1 Industry Overview of 3D IC and 2.5D IC
1.1 Definition and Specifications of 3D IC and 2.5D IC
1.1.1 Definition of 3D IC and 2.5D IC
1.1.2 Specifications of 3D IC and 2.5D IC
1.2 Classification of 3D IC and 2.5D IC
1.2.1 3D wafer-level chip-scale packaging
1.2.2 3D TSV
1.2.3 2.5D
1.3 Applications of 3D IC and 2.5D IC
1.3.1 Consumer electronics
1.3.2 Telecommunication
1.3.3 Industry sector
1.3.4 Automotive
1.3.5 Military and Aerospace
1.3.6 Smart technologies
1.3.7 Medical devices
1.4 Market Segment by Regions
1.4.1 North America
1.4.2 Europe
1.4.3 China
1.4.4 Japan
1.4.5 Southeast Asia
1.4.6 India
2 Manufacturing Cost Structure Analysis of 3D IC and 2.5D IC
2.1 Raw Material and Suppliers
2.2 Manufacturing Cost Structure Analysis of 3D IC and 2.5D IC
2.3 Manufacturing Process Analysis of 3D IC and 2.5D IC
2.4 Industry Chain Structure of 3D IC and 2.5D IC
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