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Die-level Packaging Equipment Market Share, Trend, Segmentation and Forecast to 2025

07-18-2018 08:35 AM CET | Advertising, Media Consulting, Marketing Research

Press release from: QY Research, Inc. 

Die-level Packaging Equipment Market Share, Trend,

This report studies the Die-level Packaging Equipment market size (value and volume) by players, regions, product types and end industries, history data 2013-2017 and forecast data 2018-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.

ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials.

Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.

The global Die-level Packaging Equipment market was xx million US$ in 2017 and is expected to xx million US$ by the end of 2025, growing at a CAGR of xx% between 2018 and 2025.

Request Sample Copy of the Report @ https://www.qyresearch.com/sample-form/form/592620/global-die-level-packaging-equipment-market

Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Die-level Packaging Equipment in these regions, from 2013 to 2025, covering

North America (United States, Canada and Mexico)

Europe (Germany, UK, France, Italy, Russia and Turkey etc.)

Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)

South America (Brazil etc.)

Middle East and Africa (Egypt and GCC Countries)

The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include

ASM International

BE Semiconductor Industries

DISCO

Kulicke & Soffa Industries

Advantest

Cohu

Hitachi High-Technologies

Shinkawa

TOWA

By the product type, the market is primarily split into

Wafer-level packaging

Die-level packaging

By the end users/application, this report covers the following segments

Solder Paste

Automated Component Pick and Place

Reflow

Flux Cleaning

Underfill

Rework

Click to view the full report TOC, figure and tables: https://www.qyresearch.com/index/detail/592620/global-die-level-packaging-equipment-market

QY Research established in 2007, focus on custom research, management consulting, IPO consulting, industry chain research, data base and seminar services. The company owned a large basic data base (such as National Bureau of statistics database, Customs import and export database, Industry Association Database etc), expert’s resources (included energy automotive chemical medical ICT consumer goods etc.

QY Research, INC.
17890 Castleton,
Suite 218,
City of industry, CA - 91748
USA: +1 626 295 2442
Email – inquiry@qyrsearch.com
Web – www.qyresearch.com

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