Press release
Die-level Packaging Equipment Market Share, Trend, Segmentation and Forecast to 2025
This report studies the Die-level Packaging Equipment market size (value and volume) by players, regions, product types and end industries, history data 2013-2017 and forecast data 2018-2025; This report also studies the global market competition landscape, market drivers and trends, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.ICs manufactured in the global semiconductor industry are delicate, and thus vulnerable to contamination causing malfunction. To prevent from such malfunctions, silicon chips or ICs are protected using packaging materials.
Wafer-level packaging and die-level packaging are the most predominant packaging types. Wafer-level packaging involves the packaging of individual ICs through the best-fit packaging processes conducted in wafer-level manufacturing during the semiconductor production process, while die-level packaging involves packaging of each dice and not the wafer as a whole.
The global Die-level Packaging Equipment market was xx million US$ in 2017 and is expected to xx million US$ by the end of 2025, growing at a CAGR of xx% between 2018 and 2025.
Request Sample Copy of the Report @ https://www.qyresearch.com/sample-form/form/592620/global-die-level-packaging-equipment-market
Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Die-level Packaging Equipment in these regions, from 2013 to 2025, covering
North America (United States, Canada and Mexico)
Europe (Germany, UK, France, Italy, Russia and Turkey etc.)
Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
South America (Brazil etc.)
Middle East and Africa (Egypt and GCC Countries)
The various contributors involved in the value chain of the product include manufacturers, suppliers, distributors, intermediaries, and customers. The key manufacturers in this market include
ASM International
BE Semiconductor Industries
DISCO
Kulicke & Soffa Industries
Advantest
Cohu
Hitachi High-Technologies
Shinkawa
TOWA
By the product type, the market is primarily split into
Wafer-level packaging
Die-level packaging
By the end users/application, this report covers the following segments
Solder Paste
Automated Component Pick and Place
Reflow
Flux Cleaning
Underfill
Rework
Click to view the full report TOC, figure and tables: https://www.qyresearch.com/index/detail/592620/global-die-level-packaging-equipment-market
QY Research established in 2007, focus on custom research, management consulting, IPO consulting, industry chain research, data base and seminar services. The company owned a large basic data base (such as National Bureau of statistics database, Customs import and export database, Industry Association Database etc), expert’s resources (included energy automotive chemical medical ICT consumer goods etc.
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