Global Advanced Semiconductor Packaging Market will reach 49500 million US$ by 2025

Electronic devices are available in a variety of package types and include semiconductors (integrated circuits), magnets, capacitors, and resistors.

The semiconductor packaging services market has drawn the greatest attention in the investment community.

The Semiconductor packaging industry is expected to achieve a CAGR of 10% over the next three to five years. This trend is not only driven by the increasing market demand for packaging of components for various new semiconductor applications in the fields of radio, Internet and consumer products, but also external packaging assembly by semiconductor device manufacturers (SDM). Driven by the growth of test runs.

The global Advanced Semiconductor Packaging market is valued at 22200 million US$ in 2017 and will reach 49500 million US$ by the end of 2025, growing at a CAGR of 10.6% during 2018-2025.

The major manufacturers covered in this report

AMD

Intel Corp

Amkor Technology

STMicroelectronics

Hitachi Chemical

Infineon

Avery Dennison

Sumitomo Chemical

ASE Group

Kyocera

Geographically, this report studies the top producers and consumers, focuses on product capacity, production, value, consumption, market share and growth opportunity in these key regions, covering

United States

I

China

Japan

South Korea

Taiwan

We can also provide the customized separate regional or country-level reports, for the following regions:

North America

United States

Canada

Mexico

Asia-Pacific

China

India

Japan

South Korea

Australia

Indonesia

Singapore

Rest of Asia-Pacific

Europe

Germany

France

UK

Italy

Spain

Russia

Rest of Europe

Central & South America

Brazil

Argentina

Rest of South America

Middle East & Africa

Saudi Arabia

Turkey

Rest of Middle East & Africa

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into

Fan-Out Wafer-Level Packaging (FO WLP)

Fan-In Wafer-Level Packaging (FI WLP)

Flip Chip (FC)

2.5D / 3D

On the basis of the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate for each application, including

Telecommunications

Automotive

Aerospace and Defense

Medical Devices

Consumer Electronics

Other End Users

The study objectives of this report are:

To analyze and study the global Advanced Semiconductor Packaging capacity, production, value, consumption, status (2013-2017) and forecast (2018-2025);

Focuses on the key Advanced Semiconductor Packaging manufacturers, to study the capacity, production, value, market share and development plans in future.

Focuses on the global key manufacturers, to define, describe and analyze the market competition landscape, SWOT analysis.

To define, describe and forecast the market by type, application and region.

To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.

To identify significant trends and factors driving or inhibiting the market growth.

To analyze the opportunities in the market for stakeholders by identifying the high growth segments.

To strategically analyze each submarket with respect to individual growth trend and their contribution to the market

To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market

To strategically profile the key players and comprehensively analyze their growth strategies.

In this study, the years considered to estimate the market size of Advanced Semiconductor Packaging are as follows:

History Year: 2013-2017

Base Year: 2017

Estimated Year: 2018

Forecast Year 2018 to 2025

For the data information by region, company, type and application, 2017 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.

Key Stakeholders

Advanced Semiconductor Packaging Manufacturers

Advanced Semiconductor Packaging Distributors/Traders/Wholesalers

Advanced Semiconductor Packaging Subcomponent Manufacturers

Industry Association

Downstream Vendors

Available Customizations

With the given market data, QYResearch offers customizations according to the company's specific needs. The following customization options are available for the report:

Regional and country-level analysis of the Advanced Semiconductor Packaging market, by end-use.

Detailed analysis and profiles of additional market players.

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