Global 3D IC and 2.5D IC Market Sales, Leading Player, Application & Forecast to 2025

The market for 3D IC and 2.5D IC is growing with the expansion of this Industry Sector Worldwide. Market Research Hub (MRH) has added a new report titled “Global 3D IC and 2.5D IC Sales Market Report 2018” which offer details about the current trends and analysis, as well as scope for the near future. This research study also covers information about the production, consumption and market share based on different active regions. Furthermore, an anticipated growth at a double-digit CAGR for the 3D IC and 2.5D IC sector is highlighted in the report which indicates a prosperous future.

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This report studies the global 3D IC and 2.5D IC market status and forecast, categorizes the global 3D IC and 2.5D IC market size (value & volume) by key players, type, application, and region. This report focuses on the top players in North America, Europe, China, Japan, Southeast Asia India and Other regions (Middle East & Africa, Central & South America).

In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.

3D TSV in 3D IC and 2.5D IC market is estimated to grow at the highest CAGR during the forecast period
In terms of geographic regions, Asia-Pacific acquired largest market for 3D IC and 2.5D IC in 2018.The large market in Asia-Pacific is owing to the broad scope of 3D IC and 2.5D IC packages in various consumer electronics applications, particularly in smartphones and tablets.

The global 3D IC and 2.5D IC market is valued at xx million US$ in 2017 and will reach xx million US$ by the end of 2025, growing at a CAGR of xx% during 2018-2025.

The major players covered in this report
TSMC (Taiwan)
Samsung (South Korea)
Toshiba (Japan)
ASE Group (Taiwan)
Amkor (U.S.)
UMC (Taiwan)
Stmicroelectronics (Switzerland)
Broadcom (U.S.)
Intel (U.S.)
Jiangsu Changjiang Electronics (China)

Geographically, this report studies the key regions, focuses on product sales, value, market share and growth opportunity in these regions, covering
United States
Europe
China
Japan
Southeast Asia
India

We can also provide the customized separate regional or country-level reports, for the following regions:
North America
United States
Canada
Mexico
Asia-Pacific
China
India
Japan
South Korea
Australia
Indonesia
Singapore
Rest of Asia-Pacific
Europe
Germany
France
UK
Italy
Spain
Russia
Rest of Europe
Central & South America
Brazil
Argentina
Rest of South America
Middle East & Africa
Saudi Arabia
Turkey
Rest of Middle East & Africa

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
3D wafer-level chip-scale packaging
3D TSV
2.5D
On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, sales volume, market share and growth rate for each application, including
Consumer electronics
Telecommunication
Industry sector
Automotive
Military and Aerospace
Smart technologies
Medical devices

Browse Full Report with TOC: https://www.marketresearchhub.com/report/global-3d-ic-and-25d-ic-sales-market-report-2018-report.html

Table of Content:

Global 3D IC and 2.5D IC Sales Market Report 2018
1 3D IC and 2.5D IC Market Overview
1.1 Product Overview and Scope of 3D IC and 2.5D IC
1.2 Classification of 3D IC and 2.5D IC by Product Category
1.2.1 Global 3D IC and 2.5D IC Market Size (Sales) Comparison by Type (2013-2025)
1.2.2 Global 3D IC and 2.5D IC Market Size (Sales) Market Share by Type (Product Category) in 2017
1.2.3 3D wafer-level chip-scale packaging
1.2.4 3D TSV
1.2.5 2.5D
1.3 Global 3D IC and 2.5D IC Market by Application/End Users
1.3.1 Global 3D IC and 2.5D IC Sales (Volume) and Market Share Comparison by Application (2013-2025)
1.3.1 Consumer electronics
1.3.2 Telecommunication
1.3.3 Industry sector
1.3.4 Automotive
1.3.5 Military and Aerospace
1.3.6 Smart technologies
1.3.7 Medical devices
1.4 Global 3D IC and 2.5D IC Market by Region
1.4.1 Global 3D IC and 2.5D IC Market Size (Value) Comparison by Region (2013-2025)
1.4.2 United States 3D IC and 2.5D IC Status and Prospect (2013-2025)
1.4.3 Europe 3D IC and 2.5D IC Status and Prospect (2013-2025)
1.4.4 China 3D IC and 2.5D IC Status and Prospect (2013-2025)
1.4.5 Japan 3D IC and 2.5D IC Status and Prospect (2013-2025)
1.4.6 Southeast Asia 3D IC and 2.5D IC Status and Prospect (2013-2025)
1.4.7 India 3D IC and 2.5D IC Status and Prospect (2013-2025)
1.5 Global Market Size (Value and Volume) of 3D IC and 2.5D IC (2013-2025)
1.5.1 Global 3D IC and 2.5D IC Sales and Growth Rate (2013-2025)
1.5.2 Global 3D IC and 2.5D IC Revenue and Growth Rate (2013-2025)

2 Global 3D IC and 2.5D IC Competition by Players/Suppliers, Type and Application
2.1 Global 3D IC and 2.5D IC Market Competition by Players/Suppliers
2.1.1 Global 3D IC and 2.5D IC Sales and Market Share of Key Players/Suppliers (2013-2018)
2.1.2 Global 3D IC and 2.5D IC Revenue and Share by Players/Suppliers (2013-2018)
2.2 Global 3D IC and 2.5D IC (Volume and Value) by Type
2.2.1 Global 3D IC and 2.5D IC Sales and Market Share by Type (2013-2018)
2.2.2 Global 3D IC and 2.5D IC Revenue and Market Share by Type (2013-2018)
2.3 Global 3D IC and 2.5D IC (Volume and Value) by Region
2.3.1 Global 3D IC and 2.5D IC Sales and Market Share by Region (2013-2018)
2.3.2 Global 3D IC and 2.5D IC Revenue and Market Share by Region (2013-2018)
2.4 Global 3D IC and 2.5D IC (Volume) by Application

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