Chip On Flex Market 2017 by Global Leaders: LGIT, Stemko Group, Flexceed, CWE, Danbond Technology, AKM Industrial Company, Compunetics, Stars Microelectronics Company

Market Research Future published a research report on “Global Chip On Flex Market Research Report- Forecast to 2021” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2021.

Market Highlights

Chip On Flex Market is expected to grow at CAGR of ~4.43% during the forecast period and expected to reach market size of US ~$1795 Million by the end of forecast period. Chip On Flex is also known as direct chip attachment. Chip On Flex possess high bending strength, which makes it useful in processes that require bending and folding. It is also used in electronic equipment which requires repeated movements such as printers. The other advantages provided by Chip On Flex technology include savings in space, mechanical flexibility, low production cost and increased reliability from heat distribution. The market is majorly driven by growing range of applications in the industrial, military, computer, telecommunication, consumer electronics, and medical electronics industries. The increasing collaboration between printed circuit board companies and funding by government bodies also ensures the prevalence of flexible printed circuit board in consumer electronics, automotive, aerospace, defense, Medical as well as other applications.

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Unlike rigid boards, flex circuits are not restricted to two dimensions. Because they are as flexible as wires or ribbon cables, flex circuit design options are endless. Flex circuits can be designed to meet highly complex and unimaginable configurations while being able to operate in the most hostile environments. Flexible Circuits are third dimension and can interconnect between two or more planes during execution. With the increasing footprints of wearable’s in the medical device space the two dimensional circuits are getting replaced by the flexible circuit boards acts as an opportunity for the growth of flexible printed boards during the forecasted period. The ability of the flexible circuit boards is to bend and twist into different shapes that helps them to fit into place where rigid PCB’s cannot. Flexible circuits are favored in applications where size and weight are important considerations, such as implantable medical devices, that includes pacemakers, defibrillators, and cochlear implants are among the implantable devices that employ flexible circuits.

Key Players

The prominent players in the Chip On Flex market are- LGIT corporation (U.S.), Stemko Group (Korea), Flexceed (Japan), Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond Technology Co. Ltd.(China), AKM Industrial Company Ltd.(China), Compass Technology Company Limited (Hong Kong), Compunetics Inc. (U.S.) and Stars Microelectronics Company Ltd (Thailand) and among others.

Segments:

The Global Chip On Flex Market has been segmented on the basis of types, applications and verticals. The types of Chip On Flex are one sided Chip On Flex and others. The applications comprises of static and dynamic flexing. The various verticals of Chip On Flex market are military, medical, aerospace, electronics and others.

Market Research Analysis:

Market Research Future Analysis shows that the dynamic flexing used in Chip On Flex will be the highest growing. In dynamic flexing applications, the flexible circuit itself is repeatedly flexed while using the final product. Dynamic flexing is most useful in applications where a high degree of accuracy is needed. It also facilitates those processes where high volume of flexing is required. Dynamic flexing has various applications which majorly include Air bag systems, Bar code equipment, Heart monitors and pacemakers, automotive engine controls, cameras, calculators, motion systems, cell phones and printers among others.

Geographically, Asia pacific is expected to dominate the market owing to presence of China which is the biggest consumption market of Chip On Flex. Taiwan also contributes to growth of Chip on Flex Market in Asia Pacific owing to its economic structure and strong bureaucratic system. Europe will experience a growth due to presence of large automobile industries in the region. With the increasing demand automobiles in the Europe region, the manufacturers have to focus on high quality Chip On Flex components and follow adequate quality assurance procedures. North America region will be followed by Europe in terms of market share.

Key Finding:

• The Global Chip on Flex Market is expected to reach USD 1795 million by 2021.
• Europe accounts for the largest market share and is growing with a market share of USD 494 million during forecast period.
• China accounts highest production capacity in the year 2016
• Global Chip on flex is segmented by type that includes single sided COF and Others. Out of which single sided COF captures 94.43% of market share.

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Intended Audience

• COF manufactures
• Industries such as aerospace, automotive, IT, industrial, and medical, among others
• Government institutions
• Research institutions
• Adhesive manufacturers
• Conductor and insulator manufacturers like silver, copper and others

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