Underfill Market - Lucrative Opportunities Across Globe
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Global flip chip market is showing strong demand and is estimated to witness double digit growth in near future. The ever growing demand for lighter, smaller, efficient yet cost effective devices has drawn remarkable attention towards the underfill material. Capillary underfill (CUF), no flow underfill (NUF), and molded underfill (MUF) techniques are used for the application of underfill materials. Due to growing pricing pressure from end use industry, CUF being a conventional and relatively costly technique is replaced by MUF process technique. The global semiconductor packaging industry, a parent market for the global underfill material market is expected to continually expand at high growth rates in near future.
Global Underfill Materials Market Dynamics
Recently, the microelectronic industry is governed by more complex devices, due to trending system on chip (SOC) and system in package (SIP). The trends in portable end use market are driving the global underfill material market growth. The growing demand for low cost, high performing, small in size devices is one of the major driving factors for global underfill material market growth.
The increasing use of underfill material from flip chip packaging and wafer level packaging due growing demand in smart phones and tablets is a prominent driving factor for global underfill material market growth. Being a technology driven market, underfill material market is expected to be compelled by the recent advancements in electronic industry. The end use market is posing new requirement of compatibility with lead free solder paste material due latest trend of sustainability in the market. Some of the leading manufacturers in the market are offering underfill material products which are compatible with lead free solder paste.
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On the basis of geography, global underfill material market can be divided by major regions which include North America, Western Europe, Eastern Europe, Asia-Pacific Excluding Japan, Japan, Middle East and Africa, and Latin America. Asia Pacific is a largest market for underfill materials with China, Korea, Japan, and Taiwan being prominent countries producing semiconductor packaging materials. North America and Europe are the largest market after Asia.
Global Underfill Material Market Players
Some of the major players in global underfill material market are Henkel, Won Chemicals Co. Ltd., Epoxy Technology Inc., AIM solder, Namics Corporation.
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