Chip On Flex Market 2017 Global Leaders: LGIT, Stemko group, Flexceed, Chipbond technology, CWE, Danbond technology, Compunetics, Stars microelectronics public company

Market Research Future published a research report on “Global Chip On Flex Market Research Report- Forecast to 2021” – Market Analysis, Scope, Stake, Progress, Trends and Forecast to 2021.

Market Scenario:

Chip on Flex is a very interesting and promising interconnection method that are used especially in portable electronic products such as mobile phones, portable terminals, and digital cameras and among others. In the process of Chip on Flex, integrated circuits (IC) are normally connected using anisotropically conductive adhesive. Various technological advancement and development of cost effective flexible printed boards are major factors that affects the demand.

Growing demand of Smartphone has made the significant growth in flexible printed circuit board industry. This is due to increasing global demand for mobile phones in recent years which led to substantial demand for flexible circuits. However, consumer electronics is expected to emerge as the fastest growing end-use market for flexible printed circuits worldwide. The physical characteristics of flexible printed circuit boards such as lesser thickness, lesser weight, and the ability to take any forms, besides these reliability and functionality will contribute towards the growth of this market.

According to Market Research Future Analysis, Global chip on flex market has been valued at US $ ~1795 Million by the end of forecast period with CAGR of ~4.43% during forecast period 2016 to 2021.

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Commenting on the report, an analyst from Market Research Future (MRFR)’s team said:

“Among all verticals of chip on flex, electronics is expected to grow the highest. Chip on Flex (COF) is used in various electronics, such as telephone, LCD driver IC, LED, Laptop, etc. It maximizes the performance of driver-IC to achieve sharp images. It is suitable for next-generation flexible/wearable displays and enables the implementation of ultra-thin, narrow bezels. The growing demand of semiconductor and component test equipment is also influenced by the change and development in semiconductor and electronic component technology. With the growing demand of semiconductor and electronic parts which are small in size, incorporates more function and require less energy to operate and driven by the continuous improvement in the personal computers such as flat TV’s, DVD/ Blu-ray recorders, digital camera, mobile handsets, gaming consoles and many more.”

Market Research Future Analysis shows that Asia pacific is forecasted to dominate the market owing to presence of major COF manufactures in China. China is also the biggest consumption market of chip on flex. The growth in Asia pacific region can also be attributed to stable growth of Taiwan economy owing to its economic structure and bureaucratic system. North America will experience a growth in chip on flex market owing to huge number of automobile industries in the region. With the increasing demand of high quality automobiles in the North America region, the manufacturers have started focusing on the adaption of high quality manufacturing techniques and quality assurance procedures. Europe will experience a consistent growth in the forecast period and will contribute approximately 25% in the global chip on flex revenue market.

Key Players

The prominent players in the market of chip on flex market are – LGIT corporation (U.S.), Stemko group(Korea), Flexceed(Japan) , Chipbond technology corporation(Taiwan), CWE(Taiwan), Danbond technology co. ltd.(China), AKM industrial company ltd.(China), compass technology company limited(Hong Kong), Compunetics(U.S.), and Stars microelectronics public company ltd (Thailand) among others.

Segments:

The Global chip on flex Market has been segmented on the basis of types, applications and verticals. The types of chip on flex are one sided chip on flex and others. The applications comprises of static and dynamic flexing. The various verticals of chip on flex market are military, medical, aerospace, electronics and others.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

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Regional Analysis:

The regional analysis of chip on flex market is being studied for areas such as Asia pacific, North America, Europe and rest of the world. Asia pacific is expected to record highest growth rate owing to existence of large number of chip on flex manufacturers in china like Danbond Technology, AKM Industrial, Compass Technology Company and others. Asia pacific will be followed by North America owing to increased adoption of new technologies especially in automobile sector. American depository of shares is also helping in mergers of various organizations to enhance the production capabilities in chip on flex market. Many well established firms such as AKM Industrial, Compunetics and others are increasing their sales area in the Europe region which will lead to the growth of Europe region in chip on flex market.

Intended Audience

• COF manufactures
• Industries such as aerospace, automotive, IT, industrial, and medical, among others
• Government institutions
• Research institutions
• Adhesive manufacturers
• Conductor and insulator manufacturers like silver, copper and others

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