Ceramic IC Packages Market - Increasing Application of Ceramic Ic Packages In The Commercial Defence and Aerospace Industry

Integrated circuit packaging is a last process of semiconductor device manufacturing. In this process, a small portion of the material used to make the semiconductor device is wrapped in a supplementary case. This is mainly done for avoiding physical damage as well as corrosion activities that might negatively affect the semiconductor device. The supplementary case, which is also called package, is utilized to provide a medium for passage of electrical contact. This electrical contact further forms a bridge between semiconductor devices and their respective circuit boards.

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Ceramic IC packages, as the name suggests, are manufactured from ceramic materials. Depending on material type, quality, and other factors, a plethora of IC packages can be made using ceramic. These packages can provide a completely sealed environment, so that the packed devices are not affected by being in contact with air, thus avoiding negative corrosion effects. The package can also be manufactured in small sizes, even if they are required to provide numerous electrical connections.

Ceramic IC packages are mainly manufactured by using two methods: dry pressing and multilayer structure. The first method involves using a mixture of ceramic and binders. This mixture is further molded by employing a dry pressing process, thus earning the name. This dry pressing process finalizes the shape of the products, which is further followed by the components being sintered into a finished framework. In this way, the ceramic IC packages assume a form similar to a sandwich, wherein a frame made from lead metal is placed between two ceramic components, by using the dry pressing method. These packages are less costly as compared to the ones manufactured through multilayer process. However they also have limitations associated with less electrical features due to a simple construction.

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In contrast, the multilayer IC packages use ceramics that have not been subjected to heat, and combining with screen-printed tungsten, to provide a metallic appearance. The entire set is then exposes to high temperature and pressure.

Integrated circuit packaging is final stage of the semiconductor device fabrication, in which a tiny block of the semiconductor material is encapsulated in the supporting case that is used to prevent any physical damage or corrosion. The case which is called as "package" is used to support the electrical contact which connects the device to the circuit board. Ceramic IC packages are the package that mainly use ceramic materials. A wide variety of IC package types use ceramic materials.

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One of the main properties of ceramic IC packages is that they can be sealed hermetically and even with large number of electrical connections they can be manufactured in small sizes. There are two methods used for the fabrication of ceramic IC packages. One method uses the mixture of ceramic and binders which is then molded by dry pressing process into a shape and finally sintered into a finished component. Thus the ceramic IC Package is formed by sandwich of a metal lead frame between dry pressed ceramic components. These ceramic IC packages have less cost but the simple construction limits their electrical features. Another approach is using multilayer structure. This method involves unfired (green state) ceramics metallized with screen-printed tungsten pattern. These are fired at high temperature under pressure.

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