Pot and Protect – Techsil Introduce Two New Black Epoxy Potting Compounds

Epoxy potting and encapsulation compounds protect electronic assemblies from many environmental factors such as water, harsh chemicals, physical damage, shock and vibration. Techsil supply potting materials for electronic components from manufacturers MG Chemicals who understand the requirements of the electronics industry and offer a range of high spec solutions.

The most recently launched products from MG Chemicals are two new black encapsulation resins to use for pcb potting. Due to their low viscosity, once mixed, these epoxies can easily penetrate small gaps and cavities. They also provide excellent electrical insulation and protect components from electrostatic discharges (ESD), vibration, abrasion, thermal shock, environmental humidity, salt water, fungus, and many harsh chemicals.

MG 832FX – Flexible like Silicone but with the Durability and Cost-effectiveness of Epoxy
A flexible black epoxy encapsulating and potting compound. It forms a tough bond that flexes to provide impact and vibration resistance and offer excellent physical, chemical, and electrical protection. This Epoxy is particularly effective where severe thermal shocks occur in the components' environment or where devices are in a submersion state. 832FX is designed for applications where minimizing the physical stress on components is critical. Classed as a ‘low temperature epoxy’, it is also good in arctic environments, as well as applications that involve temperature cycling or rapid temperature changes.

MG 832HD – Harder than most Epoxies to give Extreme Protection
An economical, general purpose, flowable, electronic-grade black potting epoxy that provides extreme environmental, chemical, and physical protection for circuit boards and electronic assemblies. It features a very hard shell (harder than standard black epoxy resins) providing a greater protection against extreme impacts and vibrations. It has excellent electrical insulating characteristics, a broad service temperature range of -40 to 140 °C and adheres to most substrates including metals, composites, glass, ceramics and many plastics.

These epoxies have a convenient 1:1 volume mix ratio, making them compatible with most dispensing equipment. They can be cured at room temperature or higher and are available in dual cartridge format. Being black in colour means that they help to restrict access to proprietary electronics and hide electrical circuit designs.

Developed for use in the manufacture of printed circuit boards (PCBs), electronic devices and many types of electrical assemblies such as transformers, sensors, connectors, ECU’s, LED assemblies and LED luminaires. So whether you are looking for ESD protection, impact protection, environmental protection, chemical protection or to protect your intellectual property, these two new black potting compounds can deliver a robust solution.

About Techsil
Trading since 1989, UK based Techsil has grown into a global supplier of industrial RTV silicones, adhesives, sealants, encapsulants, conformal coatings, tapes, casting and mould making materials to a wide range of manufacturing industries including Aerospace, Automotive, Medical, Electronics, Railway, LED Lighting and Rapid Prototyping.

About MG Chemicals
Founded in 1955, M.G. Chemicals is based in Surrey, British Columbia, Canada; with a 70,000 square foot manufacturing facility in Burlington, Ontario. As a manufacturer and wholesaler of cleaning, coating, shielding, adhesive, soldering and lubricating chemical products for the electronics industry, MG’s Chemicals provides the Aerospace, Automotive, Consumer Electronics, Industrial Electronics, Education, LED, Marine, Medical Equipment, Military, Service, Repair and Maintenance, Solar, Transport, Telecommunications and Utilities industries with high quality products for a wide range of applications.

Techsil Ltd
Unit 34 Bidavon Industrial Estate, Waterloo Road, Bidford-on-Avon, Warks, B50 4JN, UK.

Tel:01789 773232

Press Contact: Jane Powell

This release was published on openPR.