Global Encapsulation Resins Market Driven by Trend of Miniaturization of Electronic Devices

The prestigious research reports repository of MarketResearchReports.biz announces the availability of a fresh business intelligence study on the prospering market for encapsulation resins. The report, compiled by a group of professional research analysts who are experts in the commerce of electrical and electronic devices, aspires to provide analytical insights in the encapsulation resins market to its stockholders. The report, titled “Encapsulation Resins Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast 2017 – 2026,” is a summation an executive summary of the current condition of the market for encapsulation, explores and analyzes all important factors that will determine the demand in the near future, and segments it on the basis of product type and end use. The report also gauges the potential of demand that can be expected from various regions and countries as well as showcases how the demand has evolved in each of those regions in the recent past. The report finishes with a featured section on the vendors landscape, wherein the degree of competition has been evaluated besides profiling some of the key companies for their product portfolio and geographical presence.

According to the estimations provided in the report, the global encapsulation resins market will be worth US$3,757.6 million by the end of 2026, with the demand projected to expand at a CAGR of 3.2% during the forecast period of 2017 to 2026.

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The analyst of the report have detected that the growing need for mechanical protection of insulated printed circuit boards has given birth to the demand for encapsulation of electronic products. In addition to that, environmental obstructions such as vibration, general contamination, physical or thermal impact, and moisture have the potential of cause malfunction into the printed circuit boards of electronic devices, and consequently, the demand in the encapsulation resins market is expanding. Growing ubiquity of smartphones, increasing disposable income of urban population that is augmenting the demand for electronic devices, increasing number of number of prospected requirement inside the LED electronic products, and consistent product innovations by the companies are some of the other factors driving the demand in the global encapsulation resins market.

Based on product type, the report segments the global encapsulation resins market into polyurethane resins, epoxy resins, silicone resins, and others. During the forecast period, the epoxy resins segment is primed to provide for the maximum demand. On the basis of end-use, the market has been bifurcated into automotive components, electronics and electrical components, telecommunication components, and others. Currently, the electronics and electrical industry constitutes for the most prominent chunk of demand and the scenario is expected to remain so until 2026 too.

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Geographically, the report takes stock of the potential of demand that can be expected out of North America including Canada and the U.S., Latin America including Brazil and Mexico, Europe including the U.K., Germany, Spain, France, and Italy, Asia Pacific except Japan including South Korea, India, China, Taiwan, Singapore, and Australia, and the Middle East and Africa as well as in the country of Japan. Currently, the APEJ region is providing for the maximum demand, driven by growing demand for electronic devices and the presence of a number of leading vendors in the region.

The report contains profiles of a number of leading companies in the global encapsulation resins market, including Fuji Chemical Industrial Co., Ltd., Shin-Etsu Chemical Co. Ltd., Dow Chemical Company, H. B. Fuller Company, Master Bond Inc., Huntsman Corporation, Henkel Ag & Co. kgaa, Hitachi Chemical, ACC Silicones Ltd., and BASF. The analysts of the report have detected a fragmented competitive landscape while anticipating the entrance of a few new players too during the forecast period.

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