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Microelectronics Packaging Market : Analysis and Forecast upto 2025
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Technological advancements in printed electronics is a common trend observed in recent years. High cost of microelectronics packaging is one of the major challenge faced by the microelectronics packaging market. Manufacturers around the world are all in the effort to research and improvement of the microelectronic packaging industry in order to get leading position in technology. Market for microelectronics packaging material like metals, ceramics, glass, polymer, etc. is also expected to increase during forecast period. Single chip to chip development and planer to 3D packaging development are some of the future key development trends for the microelectronics packaging market anticipated to be observed during forecast period.
In terms of geography, the microelectronics packaging market has been divided in to five key regions including North America, Latin America, Europe, Asia-Pacific and Middle East & Africa. The microelectronics packaging market is expected to register healthy CAGR during the forecast period. Currently North America is on the lead for this technology followed by Asia Pacific and Europe. Asia-Pacific is anticipated to experience higher growth for microelectronics packaging market. In countries like China and Japan the domestic microelectronics packaging market is in a rapid growth phase
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Some of the key players in the Microelectronics Packaging Market are AMETEK ECP, Teledyne Microelectronics etc.
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