Waveguide Connectors Market to grow at a CAGR of 20.02% during 2017-2021: Advanced Technical Materials, Chengdu AINFO, CommScope, Global Invacom, HI MICROWAVE TECHNOLOGY, Radio Frequency Systems, and SAGE Millimeter

MarketResearchNest.com adds “Global Waveguide Connectors Market 2017-2021” new report to its research database. The report spread across 80 pages with table and figures in it.

Research analysts forecast the global waveguide connectors market to grow at a CAGR of 20.02% during the period 2017-2021.

About Waveguide Connectors
A waveguide is an electromagnetic feed line used in microwave communications, broadcasting, and radar installations. A waveguide connector consists of a rectangular or cylindrical metal tube, which is essentially the same as a pipe flange that connects the source of high-power radio frequency (RF) signals to the directional antenna or transmitter directly or through a waveguide tube. These waveguide connectors are paired in between the flanges; they are usually connected through four or more bolts. Waveguide connectors are also used in horn antennas and dish antennas.

Covered in this report
The report covers the present scenario and the growth prospects of the global waveguide connectors market for 2017-2021. To calculate the market size, the report considers the revenue generated through the sales of waveguide connectors for application such as microwave oven, microwave radio, and radar applications.

Browse full table of contents and data tables at
https://www.marketresearchnest.com/global-waveguide-connectors-market-2017-2021.html

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio's report, Global Waveguide Connectors Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Technavio recognizes the following companies as the key players in the global waveguide connectors market: Advanced Technical Materials, Chengdu AINFO, CommScope, Global Invacom, HI MICROWAVE TECHNOLOGY, Radio Frequency Systems, and SAGE Millimeter.

Other Prominent Vendors in the market are: Bends, Coax Adapters, Complex Assemblies, Couplers, Flexible Waveguide, Gaskets/Seals, Rotary Joints, Quick Release, Straights, Tapers, Terminations, and Twists.

Commenting on the report, an analyst from Research team said: “One trend in the market is introduction of flexible waveguide connectors. Often, a precisely designed rigid waveguide structure with the proper connector and orientation is not readily available. To receive the correct part, lead times can usually go up to several weeks or months, which is not convenient for the design, repair, or replacement of these devices.”

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According to the report, one driver in the market is miniaturization of electronic devices. Miniaturization may be described as the manufacturing of downsized mechanical, optical, and electronic products and devices. Some examples of miniaturized electronics are miniaturization of mobile phones and computers as well as vehicle engine downsizing. In electronics, Moore's Law predicts that the number of transistors on an integrated circuit for minimum component cost will double in every 18 months, thereby enabling processors to be built in smaller sizes. Advances in electronic packaging have become the backbone for high-performance miniaturized electronic systems. The integration of advanced devices with high-density packaging has been a significant factor for miniaturization in electronic devices.

Further, the report states that one challenge in the market is development of RFSoC to replace waveguide connectors. System integration, which may be described as the combined integration of circuits, components, and devices to create an interconnected functionality of electronics, is implemented in different manners. The increasing functionality of semiconductor devices and high end-user expectations have driven the development of packaging and interconnect technologies in the last four to five years. Silicon integration has brought about the concept of system-on-a-chip (SoC) for several applications, which requires lesser chips and fewer circuit board integrations. Particularly, by integrating SoC in end-user applications, consumer demands for compact and highly reliable electronic products can be met.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Key questions answered in this report: What will the market size be in 2021 and what will the growth rate be; What are the key market trends; What is driving this market; What are the challenges to market growth; Who are the key vendors in this market space; What are the market opportunities and threats faced by the key vendors; What are the strengths and weaknesses of the key vendors;

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