Wafer Mounter Equipment Market to grow at a CAGR of 4.42% during 2017-2021: DISCO, Semiconductor Equipment, and Advanced Dicing Technologies

MarketResearchNest.com adds “Global Wafer Mounter Equipment Market 2017-2021” new report to its research database. The report spread across 110 pages with table and figures in it.

Research analysts forecast the global wafer mounter equipment market to grow at a CAGR of 4.42% during the period 2017-2021.

About Wafer Mounter Equipment
Wafer mounters are a part of the wafer fabrication process. After wafer grinding is carried out, the wafer is mounted on a metal frame for film or tape to be applied to it. This process is called wafer mounting. This becomes an essential step in the overall fabrication process as the film or tape reduces particulate contamination, thereby ensuring a highly efficient semiconductor device or component.

Covered in this report
The report covers the present scenario and the growth prospects of the global wafer mounter equipment market for 2017-2021. To calculate the market size, the report considers the sale of wafer mounter equipment to the end-user sectors.

Browse full table of contents and data tables at
https://www.marketresearchnest.com/global-wafer-mounter-equipment-market-2017-2021.html

The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA

Technavio's report, Global Wafer Mounter Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.

Technavio recognizes the following companies as the key players in the global wafer mounter equipment market: DISCO, Semiconductor Equipment, and Advanced Dicing Technologies.

Other Prominent Vendors in the market are: Lintec (Adwill), Longhill Industries, NITTO DENKO, POWATEC, Syagrus Systems, Takatori, Technovision, and ULTRON SYSTEMS.

Commenting on the report, an analyst from Research team said: “The latest trend gaining momentum in the market is Increase in the wafer size. The semiconductor industry is continuously evolving with rapid technological advancements and transitions such as the miniaturization of nodes and the rise in the wafer sizes. Hence, to survive in this changing, competitive landscape, equipment manufacturers need to develop new technologies that are in line with the changes in the semiconductor IC architecture. Considering this, they invest heavily in R&D to manufacture next-generation semiconductors ICs. Over the last four decades, the semiconductor industry has been witnessing an increase in the size of silicon wafers, from 100 mm to 300 mm. The shift to wafers with larger diameters reduces the cost of manufacturing semiconductor ICs by 20%-25%.”

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According to the report, one of the major drivers for this market is Increase in capital spending. The global semiconductor industry is expected to witness a surge in capital spending, especially after the cyclical period in 2016. This increase in capital spending is a major driver for the global wafer mounter equipment market as it indicates that foundries and memory manufacturers are aiming at investing funds in purchasing new equipment as per the latest technological developments in the industry.

Further, the report states that one of the major factors hindering the growth of this market is Complexity of technology transitions. A major challenge to the growth of the global wafer mounter equipment is the complexity of technology transitions that are occurring across the semiconductor landscape. There have been significant achievements in new wafer sizes, node sizes, process technologies, and manufacturing technologies that have forced equipment manufacturers to make changes to their products. The wafer-related technological transitions include the increasing wafer sizes, to manufacturer a large number of ICs on the same wafer. This results in an increase in the throughput of the wafer manufacturing process. Investments in increasing wafer sizes (from 200 mm and 300 mm to 450 mm) are increasing significantly.

The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to a SWOT analysis of the key vendors.

Key questions answered in this report: What will the market size be in 2021 and what will the growth rate be; What are the key market trends; What is driving this market; What are the challenges to market growth; Who are the key vendors in this market space; What are the market opportunities and threats faced by the key vendors; What are the strengths and weaknesses of the key vendors;

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