Press release
Global Semiconductor Assembly and Testing Services Market to grow at a CAGR of 5.68% during the period 2017-2021
The main objective of this report is to define, describe, and forecast the global "Semiconductor Assembly and Testing Services" market on the basis of types of applications, major sectors, deployment models, organization size, and regions. The report contains an analysis of the major factors influencing the growth of the market (drivers, restraints, opportunities, and challenges). It aims to strategically analyze the micromarkets with respect to individual growth trends, prospects, and their contribution to the market. The report attempts to forecast the market size for 5 major regions, namely, North America, Europe, Asia Pacific (APAC), Middle East and Africa (MEA), and Latin America. It contains key vendor profiles and comprehensively analyzes their core competencies. The report also tracks and analyzes competitive developments, including partnerships, collaborations, acquisitions, new product developments, and R&D activities in the market.
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About Semiconductor Assembly and Testing Services
The number of electronic devices we use in our day-to-day life has been increasing in the past few decades. These devices range from simple media players, smartphones, laptops, and TVs to wearable smart watches and Internet of Things (IoT) devices such as connected thermostats, automated lighting, and remote health monitoring equipment. Semiconductor assembly and testing services (SATS) or outsourced semiconductor assembly and testing (OSAT) refers to the outsourcing of integrated circuit packaging and final product testing to third-party service providers.
Technavios analysts forecast the global semiconductor assembly and testing services market to grow at a CAGR of 5.68% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor assembly and testing services market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
The market is divided into the following segments based on geography:
Americas
APAC
EMEA
Technavio's report, Global Semiconductor Assembly and Testing Services Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
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Key vendors
Amkor Technology
ASE Group
Jiangsu Changjiang Electronics Technology (JCET)
Powertech Technology
Siliconware Precision Industries (SPIL)
Other prominent vendors
Chipbond Technology
ChipMOS TECHNOLOGIES
FormFactor
Formosa Advanced Technologies
King Yuan ELECTRONICS
Lingsen Precision Industries
PSi Technologies
SIGNETICS
Tessolve Semiconductor
Tianshui Huatian Technology
Unisem
UTAC
Market driver
Growth of cloud-based servers and big data services
For a full, detailed list, view our report
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Market challenge
Highly cyclic nature of electronics industry
For a full, detailed list, view our report
Market trend
Growth of advanced system in package (SiP) modules
For a full, detailed list, view our report
Key questions answered in this report
What will the market size be in 2021 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
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