Semiconductor Assembly & Testing Services Market is Projected to Reach US$ 39,000 Million by 2021

Semiconductor Assembly & Testing Services Market in the International Market

The semiconductor assembly as well as testing services are expected to exceed more than US$ 39,000 million by 2021. It has been in the CAGR of more than 4.5% in the given forecast period. It gives identifications of new market opportunities and targeted promotional plans for semiconductor assembly & testing services market. The comprehensive company profiles of major players in the industry.

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Key Players in this Market

The Key players profiled in the report include ASE Group, Amkor Technologies Inc., STATS ChipPAC Ltd. (JCET), Silicon Precision Industries Co. Ltd., Powertech Technology Inc., Chipbond Technology Corporation, CORWIL Technology Corporation, Psi Technologies Inc. (IMI), Global Foundries.

Company profile includes assign such as financial summary, company summary, SWOT analysis, and business strategy and planning, current developments.
The Top Companies Report is intended to provide our buyers with an idea of the industry’s most influential players.

Segmentation in this Market

The market is segmented on the lines of its services, application and regional. It also covers assembly and packaging services. It comes with testing services. Assembly segmentation consists water level packaging, gold wire bonding, and copper wire. It has flip chip, copper chip and TSV. In the application segmentation it includes automotive electronics, industrial, communication, computing, consumer electronics, and networking application.

The geographic segmentation has various regions like Asia Pacific, Latin America, Middle East and Africa, North America, and Europe. The market revenue has further segmented into U.S. Canada, U.K., Germany, China, Japan, India, GCC countries, and Brazil.

The semiconductor production is explosive in nature. Some of the leading market contributors in the business are focusing on leveraging their resources in utilizing. The majority of the semiconductor testing, packaging associated services and assembly are also outsourced by them. There are many driving and restraint factors. Some of the driving factors are growing requirement for the mobility and connectivity in customer electronics products. It is also raising demand of higher electronic systems in the automobiles. The barriers are like high capital necessity for offering superior end packaging solutions.

The information covers the supporting and restraining factors of the semiconductor assembly & testing services market. The rising demand of higher electronic systems in the automobiles has become the driving factor in the market.

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This report offers a study of Global and Regional Markets

The report has the overview of the Global Market for Semiconductor Assembly & testing services. It shows the discussion of research and development, as well as the demand for new products and new technologies. It has the profiles of major players in the industry. It has shown the restraining factors like the high capital necessity for offering superior end packaging solutions. The Instability in the market and fluctuations in exchange rates has become the barrier in the market.

Table of Contents

1. INTRODUCTION
2. Assumptions & Acronyms Used
3. Research Methodology
4. Market Overview
5. Global Semiconductor Assembly and Testing Services Market Analysis, By Services
5.1. Introduction
5.2. Global Semiconductor Assembly and Testing Services Market Forecast By Services
5.2.1. Assembly & Packaging services (Interconnecting technologies)
5.2.1.1. Copper and gold wire bonding
5.2.1.2. Copper clip
5.2.1.3. Flip Chip
5.2.1.4.Wafer Level Packaging
5.2.1.5. TSV
5.2.2. Testing Services
5.3. Basis Point Share (BPS) Analysis, By Services
5.4. Y-o-Y Growth Comparison, By Services
5.5. Market Absolute $ Opportunity, By Services
5.6. Global Semiconductor Assembly and Testing Services Market Attractiveness Analysis, By Services
5.7. Qualitative Analysis
6. Global Semiconductor Assembly and Testing Services Market Analysis, By Packaging Solutions
7. Global Semiconductor Assembly and Testing Services Market Analysis, By Applications
8. Global Semiconductor Assembly and Testing Services Market Analysis, By Region
9. North America North America Semiconductor Assembly and Testing Services Market Analysis
10. APAC (Excluding Taiwan) Semiconductor Assembly and Testing Services Market Analysis
11. Taiwan Semiconductor Assembly and Testing Services Market Analysis
12. Europe Semiconductor Assembly and Testing Services Market Analysis
13. Middle East & Africa (MEA) Semiconductor Assembly and Testing Services Market Analysis
14. Latin America Semiconductor Assembly and Testing Services Market Analysis
15. Competition Landscape
15.1. Competition Dashboard
15.2. Competitive Strategies
15.3. Market Structure
15.4. Company Profiles
15.4.1. ASE Group
15.4.1.1. Revenue
15.4.1.2. Products/Brand Offerings
15.4.1.3. Company Highlights
15.4.2. Amkor Technology Inc.
15.4.3. STATS chipPAC Ltd. (JCET)
15.4.4. Powertech Technology Inc.
15.4.5. Silicon Precision Industries Company Ltd.
15.4.6. CORWIL Technology Corp.
15.4.7. Chipbond Technology Corporation
15.4.8. Integrated Microelectronics Inc.(Psi Technologies Inc.)
15.4.9. GlobalFoundries Inc.

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