United States Die Bonder Equipment Market by Manufacturers, States, Type and Application, Forecast to 2022

Die bonding is the method of attaching a chip or die to a package or substratum. Die bonding, also referred as die attaching is the process of bonding or attaching a chip either to a substrate or to some package or another die. This process can obtain many forms and can be useful in various different ways. Hence, die bonder equipment is used broadly in the fabrication and manufacture procedure of semiconductor devices. Die bonder equipment executes a variety of functions including picking out the die from wafer or waffle tray and connecting it to the substrate or other die. The most frequently used practice of die attaching is to move forward the aimed die from the tape with the assistance of a pin. Die attaching procedure is carried out by using several techniques such as eutectic bonding, adhesive bonding, soldering and glass /silver & glass bonding.

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The United States die bonder equipment market is anticipated to experience a stable growth during the forecast period from 2017 to 2022 owing to the rapid growth of the semiconductor industry with prominent compound annual growth rate. Growing demand of semiconductor Integrated Circuits is one of the key important factors expected to propel the requirement of die bonder equipment in the near future. Rising need of electronic systems with the escalating no of several end user applications is forecasted to provide the stimulus for mounting demand of Integrated Circuits. This in spin is probably to activate the market growth of die bonder equipment in the United States.

In addition, budding market for most recent technologies like Internet of Things, UHD TVs (Ultra High Definition Television) and hybrid laptops is most likely to fuel the demand for semiconductor Integrated Circuits, which as result is foretold to propel the requirement of various die bonder equipment, in the coming years,. Furthermore, rising trend towards automation in automotives is one more significant factor estimated to generate massive demand of Integrated Circuits essential for a range of functions like GPS, ABS, power doors and windows, airbag control, car navigation and display and automated driving amongst others. This is likely to boost the requirement for advanced and innovative packaging techniques like die bonders.

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The key market players in the United States Die Bonder Equipment market are HYBOND, Inc., BE Semiconductor Industries N.V. (Besi), West•Bond, Inc., ASM Pacific Technology Ltd., DIAS Automation (HK) Ltd., Fasford Technology Co., Ltd., Kulicke and Soffa Industries, Inc., Panasonic Corporation, SHINKAWA Electric, Toray Engineering Co., Ltd. and Palomar Technologies, Inc. According to types, the market industry is segmented into; fully Automatic, Semi-Automatic and Manual. By applications, the Die Bonder Equipment market is split into; Integrated Device Manufacturers (IDMs) and Outsourced Semiconductor Assembly and Test (OSAT). Geographically, the United States Die Bonder Equipment market is segmented into states which are; Illinois, California, Florida, Texas and New York.

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Some Point From TOC:

Table of Contents
1 Market Overview
1.1 Die Bonder Equipment Introduction
1.2 Market Analysis by Type
1.2.1 Fully Automatic
1.2.2 Semi-Automatic
1.2.3 Manual
1.3 Market Analysis by Applications
1.3.1 Integrated Device Manufacturers (IDMs)
1.3.2 Outsourced Semiconductor Assembly and Test (OSAT)
1.4 Market Analysis by States
1.4.1 California Status and Prospect (2012-2022)
1.4.2 Texas Status and Prospect (2012-2022)
1.4.3 New York Status and Prospect (2012-2022)
1.4.4 Florida Status and Prospect (2012-2022)
1.4.5 Illinois Status and Prospect (2012-2022)
1.5 Market Dynamics
1.5.1 Market Opportunities
1.5.2 Market Risk
1.5.3 Market Driving Force
2 Manufacturers Profiles
2.1 Besi
2.1.1 Profile
2.1.2 Die Bonder Equipment Type and Applications
2.1.2.1 Type 1
2.1.2.2 Type 2
2.1.3 Besi Die Bonder Equipment Sales, Price, Revenue, Gross Margin and Market Share (2016-2017)
2.1.4 Business Overview
2.1.5 Besi News
2.2 ASM Pacific Technology (ASMPT)

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