Near Field Communication (NFC) 2017 Global Key Players - NXP Semiconductors, Sony, Toshiba Semiconductor, Intel, Apple Market Analysis and Forecast to 2022

Near Field Communication (NFC) Chip

Report Details:

This report focuses on top manufacturers in global market, with production, price, and revenue and market share for each manufacturer

Top Key Palyers:

NXP Semiconductors
Sony
Toshiba Semiconductor
Intel
Apple
DNP
Qualcomm
Broadcom
Samsung
Nokia
ST

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Geographically, this report is segmented into several key Regions, with production, consumption, revenue (million USD), market share and growth rate of Near Field Communication (NFC) Chip in these regions, from 2012 to 2022 (forecast), covering
United States
EU
China
Japan
South Korea
Taiwan

On the basis of product, this report displays the production, revenue, price, market share and growth rate of each type, primarily split into
48 Bytes
144 Bytes
504 Bytes
888 Bytes
Other

On the basis on the end users/applications, this report focuses on the status and outlook for major applications/end users, consumption (sales), market share and growth rate of Near Field Communication (NFC) Chip for each application, including
Cellphone
Chip Card
Other

Some Major Points from Table of content:

Global Near Field Communication (NFC) Chip Market Research Report 2017
1 Near Field Communication (NFC) Chip Market Overview
1.1 Product Overview and Scope of Near Field Communication (NFC) Chip
1.2 Near Field Communication (NFC) Chip Segment by Type (Product Category)
1.2.1 Global Near Field Communication (NFC) Chip Production and CAGR (%) Comparison by Type (Product Category) (2012-2022)
1.2.2 Global Near Field Communication (NFC) Chip Production Market Share by Type (Product Category) in 2016
1.2.3 48 Bytes
1.2.4 144 Bytes
1.2.5 504 Bytes
1.2.6 888 Bytes
1.2.7 Other
1.3 Global Near Field Communication (NFC) Chip Segment by Application
1.3.1 Near Field Communication (NFC) Chip Consumption (Sales) Comparison by Application (2012-2022)
1.3.2 Cellphone
1.3.3 Chip Card
1.3.4 Other
1.4 Global Near Field Communication (NFC) Chip Market by Region (2012-2022)
1.4.1 Global Near Field Communication (NFC) Chip Market Size (Value) and CAGR (%) Comparison by Region (2012-2022)
1.4.2 United States Status and Prospect (2012-2022)
1.4.3 EU Status and Prospect (2012-2022)
1.4.4 China Status and Prospect (2012-2022)
1.4.5 Japan Status and Prospect (2012-2022)
1.4.6 South Korea Status and Prospect (2012-2022)
1.4.7 Taiwan Status and Prospect (2012-2022)

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7 Global Near Field Communication (NFC) Chip Manufacturers Profiles/Analysis
7.1 NXP Semiconductors
7.1.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.1.2 Near Field Communication (NFC) Chip Product Category, Application and Specification
7.1.2.1 Product A
7.1.2.2 Product B
7.1.3 NXP Semiconductors Near Field Communication (NFC) Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.1.4 Main Business/Business Overview
7.2 Sony
7.2.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.2.2 Near Field Communication (NFC) Chip Product Category, Application and Specification
7.2.2.1 Product A
7.2.2.2 Product B
7.2.3 Sony Near Field Communication (NFC) Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.2.4 Main Business/Business Overview
7.3 Toshiba Semiconductor
7.3.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.3.2 Near Field Communication (NFC) Chip Product Category, Application and Specification
7.3.2.1 Product A
7.3.2.2 Product B
7.3.3 Toshiba Semiconductor Near Field Communication (NFC) Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.3.4 Main Business/Business Overview
7.4 Intel
7.4.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.4.2 Near Field Communication (NFC) Chip Product Category, Application and Specification
7.4.2.1 Product A
7.4.2.2 Product B
7.4.3 Intel Near Field Communication (NFC) Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.4.4 Main Business/Business Overview
7.5 Apple
7.5.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.5.2 Near Field Communication (NFC) Chip Product Category, Application and Specification
7.5.2.1 Product A
7.5.2.2 Product B
7.5.3 Apple Near Field Communication (NFC) Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.5.4 Main Business/Business Overview
7.6 DNP
7.6.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.6.2 Near Field Communication (NFC) Chip Product Category, Application and Specification
7.6.2.1 Product A
7.6.2.2 Product B
7.6.3 DNP Near Field Communication (NFC) Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.6.4 Main Business/Business Overview
7.7 Qualcomm
7.7.1 Company Basic Information, Manufacturing Base, Sales Area and Its Competitors
7.7.2 Near Field Communication (NFC) Chip Product Category, Application and Specification
7.7.2.1 Product A
7.7.2.2 Product B
7.7.3 Qualcomm Near Field Communication (NFC) Chip Capacity, Production, Revenue, Price and Gross Margin (2012-2017)
7.7.4 Main Business/Business Overview

..…Continued

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