2017-2021 Global semiconductor chip packaging market is expected to grow at a CAGR of over 31%

This research report titled ‘Global Semiconductor Chip Packaging Market 2017-2021’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. This market research report also includes up to date analysis and forecasts for various market segments and all geographical regions.

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One of the important driving factors of the semiconductor chip packaging market is the high adoption of semiconductor ICs in automobiles. The increasing automation of automobiles is creating high demand for semiconductors for use in automotive products such as GPS, airbag control, anti-lock braking system (ABS), infotainment, and collision detection technology, which is beneficial for the market growth.
Based on packaging techniques, the report categorizes the global
semiconductor chip packaging market into the following segments:

• 3DIC TSV stacks
• Flip-chip wafer bumping
• 2.5D interposers
• 3D WLP
• Fan-in WL CSP
• FO WLP/Sip

Key vendors:

Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu

Market driver:
Growing number of fabs
For a full, detailed list, view our report

Market challenge:
Increasing complexity of semiconductor IC designs
For a full, detailed list, view our report

Market trend:
Development of 3D chip packaging
For a full, detailed list, view our report

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A variety of semiconductor ICs is used in automotive products such as GPS, airbag control, anti-lock braking system (ABS), power doors and windows, infotainment, automated driving, and collision detection technology. The automotive product market is expected to grow significantly with the increase in car production, which will boost the demand for electronic devices. This will, in turn, indirectly trigger the demand semiconductor chip packaging during the forecast period.

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