Silicon Wafer Double-sides Grinding Machines Market Silicon Wafer Double-sides Grinding Machines Market

Silicon Wafer Double-sides Grinding Machines Market Size

The global market for Silicon Wafer Double-sides Grinding Machines was valued at US$ 374 million in the year 2024 and is projected to reach a revised size of US$ 587 million by 2031, growing at a CAGR of 6.7% during the forecast period.

Get Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-10W17872/Global_Silicon_Wafer_Double_sides_Grinding_Machines_Market_Research_Report_2024

By Type
• Horizontal
• Vertical

By Application
• 200mm Wafer
• 300mm Wafer

Key Companies
JTEKT, Micro Engineering, Kemet, ENGIS, Daitron, SOMOS IWT, Koyo Machinery, Revasum, SpeedFam, Lapmaster Wolters, TDG-NISSIN PRECISION MACHINERY, Qingdao Gaoce Technology, Joen Lih Machinery, Shenzhen Fangda, Hunan Yujing Machine Industrial

Major Trends
The Silicon Wafer Double-Sides Grinding Machines market is experiencing steady growth as semiconductor manufacturers focus on improving wafer flatness, thickness uniformity, and surface precision for advanced device fabrication.
• Increasing 300mm wafer production drives demand for high-precision grinding systems.
• Rising semiconductor fab investments support equipment modernization.
• Growing demand for thinner wafers in advanced logic and memory devices.
• Shift toward automation and high-throughput grinding solutions.
• Expansion of semiconductor manufacturing capacity in Asia-Pacific.
• Technological advancements enhancing surface quality and yield rates.

View Full Report: https://reports.valuates.com/market-reports/QYRE-Auto-10W17872/global-silicon-wafer-double-sides-grinding-machines

Trends Influencing the Growth of the Silicon Wafer Double-Sides Grinding Machines Market

The Silicon Wafer Double-Sides Grinding Machines market plays a crucial role in semiconductor wafer preparation processes. Double-side grinding ensures precise thickness control, improved surface flatness, and minimal subsurface damage-critical factors in advanced semiconductor device manufacturing. As chip complexity increases and performance requirements become more stringent, wafer processing precision has become a key differentiator in fabrication efficiency.

One of the primary growth drivers is the increasing transition toward 300mm wafer production. Larger wafers allow semiconductor manufacturers to improve production efficiency and reduce per-chip costs. However, processing larger wafers requires advanced grinding systems capable of maintaining uniform thickness and surface quality across a broader area. This shift is significantly boosting demand for high-precision double-side grinding machines optimized for 300mm wafer applications.

The 200mm wafer segment continues to maintain steady demand, particularly for analog, power devices, and specialty semiconductor applications. As legacy fabs expand to meet industrial and automotive demand, equipment upgrades and replacements contribute to ongoing market activity in this segment. The "Others" category includes emerging wafer sizes and specialized applications, supporting niche growth opportunities.

From a technological standpoint, both horizontal and vertical grinding machine configurations play important roles. Horizontal machines are commonly adopted for high-volume production due to stable wafer handling and consistent throughput. Vertical systems, on the other hand, offer advantages in space efficiency and advanced precision control, making them suitable for modern semiconductor fabs where cleanroom optimization and automation integration are critical.

The market is also influenced by the trend toward thinner wafers used in advanced logic, memory, and power devices. As wafer thickness decreases to enable improved electrical performance and packaging integration, grinding accuracy becomes increasingly important. Equipment manufacturers are focusing on vibration control, precision alignment, and improved abrasive materials to ensure minimal damage and higher yield rates.

Automation and smart manufacturing integration are further shaping market growth. Grinding systems are increasingly equipped with advanced monitoring systems, real-time thickness measurement, and automated process control to reduce human intervention and enhance consistency. These features support semiconductor manufacturers' goals of improving productivity and minimizing defect rates.

Regionally, production activities are concentrated in North America, Europe, China, Japan, and South Korea, where established semiconductor equipment manufacturers operate. Consumption demand is strongest in Asia-Pacific due to extensive semiconductor fabrication capacity in China, Japan, South Korea, and Taiwan. North America and Europe maintain significant demand driven by advanced logic, memory, and automotive semiconductor production.

Government-backed semiconductor investment initiatives in multiple regions are further supporting capital equipment demand, including wafer processing machinery. As global chip manufacturing capacity expands, double-side grinding machines remain essential to upstream wafer preparation processes.

Overall, the Silicon Wafer Double-Sides Grinding Machines market is driven by increasing 300mm wafer adoption, growing semiconductor fab investments, advancements in grinding precision technology, and expanding global chip production capacity.

Market Share

The Silicon Wafer Double-Sides Grinding Machines market features a competitive landscape composed of established precision machinery manufacturers and emerging regional players.

Companies such as JTEKT, Koyo Machinery, Revasum, and Lapmaster Wolters hold strong positions due to their advanced grinding technologies and long-standing relationships with semiconductor fabs. SpeedFam and ENGIS contribute significantly through precision surface finishing and wafer processing expertise.

Japanese manufacturers including TDG-NISSIN PRECISION MACHINERY, Daitron, and others maintain competitive advantages through high engineering standards and process reliability. European and North American players focus on technological innovation and integration capabilities, while Chinese companies such as Qingdao Gaoce Technology, Shenzhen Fangda, and Hunan Yujing Machine Industrial are expanding rapidly to support domestic semiconductor capacity growth.

By type, horizontal grinding machines account for a significant share due to their widespread use in high-volume manufacturing environments, while vertical systems are gaining traction in advanced fabs emphasizing automation and space efficiency.

By application, 300mm wafer grinding machines represent the dominant and fastest-growing segment, supported by large-scale semiconductor manufacturing expansion. The 200mm segment remains stable, particularly in power electronics and specialty device fabrication.

Regionally, Asia-Pacific holds the largest market share due to extensive semiconductor production capacity and ongoing investments in chip manufacturing infrastructure. North America and Europe maintain substantial shares driven by advanced technology development and strategic semiconductor initiatives.

The competitive landscape is shaped by technological precision, automation capability, machine durability, and strategic partnerships with semiconductor manufacturers, positioning double-side grinding machines as critical equipment in the global semiconductor value chain.

Purchase Regional Report: https://reports.valuates.com/request/regional/QYRE-Auto-10W17872/Global_Silicon_Wafer_Double_sides_Grinding_Machines_Market_Research_Report_2024

Email Id:
Please reach us at sales@valuates.com

Address:
Valuates,
4th Floor,
Balaraj's Arcade,
Whitefield Main road,
Bangalore 560066

Valuates offers an extensive collection of market research reports that helps companies to take intelligent strategical decisions based on current and forecasted Market trends.
To achieve a consistent view of the market, data is gathered from various primary and secondary sources, at each step, data triangulation methodologies are applied to reduce deviance and find a consistent view of the market. Each sample we share contains detail research methodology employed to generate the report, Please also reach to our sales team to get the complete list of our data sources

This release was published on openPR.