Future Perspective: Key Trends Shaping the Chemical Mechanical Polishing Market Until 2030

The chemical mechanical polishing (CMP) market is poised for robust expansion over the coming years, driven by rapid technological advancements and growing demand across semiconductor sectors. As innovations evolve and new applications emerge, this market is set to play a crucial role in shaping the future of semiconductor manufacturing and packaging.

Forecasted Growth Trajectory of the Chemical Mechanical Polishing Market Size Through 2030
The chemical mechanical polishing market is projected to reach a value of $9.17 billion by 2030, growing at a compound annual growth rate (CAGR) of 7.7%. This positive outlook is fueled by several factors such as the increasing use of advanced logic and memory chips, rising demand for compound semiconductors, and the expansion of emerging semiconductor technologies. Additionally, the industry's strong focus on lowering defect rates and escalating investments in semiconductor fabrication plants further support this growth. Noteworthy trends anticipated in this period include the adoption of innovative CMP slurry formulations, a greater need for high-precision planarization, broader implementation in cutting-edge semiconductor nodes, advances in consumables optimization, and an enhanced emphasis on yield improvement.

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Key Players Driving the Chemical Mechanical Polishing Market Forward
The CMP market is currently led by a number of prominent companies known for their innovation and market presence. These include Ebara Corporation, Applied Materials Inc., Cabot Microelectronics Corporation, Lapmaster Wolters GmbH, Fujimi Incorporated, CMC Materials Inc., Hitachi Chemical Company Ltd., Badische Anilin- und Sodafabrik SE, Revasum Inc., Versum Materials Inc., Evonik Industries AG, Asahi Glass Corporation, DuPont de Nemours Inc., Ferro Corporation, 3A Composites India Private Limited, HKC Vietnam Company Limited, Logitech International SA, Tianjin Huahaiqingke, Tokyo Seimitsu Co. Ltd., K.C. Tech Co. Ltd., IV Technologies Inc., Merck Group, Solvay S.A., Air Products and Chemicals Inc., Entegris Inc., Okamoto Corporation, Compagnie de Saint-Gobain S.A., Dow Inc., and LAM Research Corporation.

A significant development occurred in October 2023 when Japan-based Fujifilm acquired Entegris's Electronic Chemicals business for US$700 million in cash. This strategic acquisition is aimed at expanding Fujifilm's product portfolio and strengthening its global manufacturing and supply capabilities for high-purity process chemicals tailored to the semiconductor industry. Entegris's Electronic Chemicals segment specializes in providing high-purity chemical solutions essential for semiconductor and other advanced manufacturing processes, making it a valuable addition to Fujifilm's offerings.

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Emerging Trends Enhancing the Chemical Mechanical Polishing Market's Growth
Leading companies in the CMP space are concentrating on developing advanced slurry formulations to meet the rising complexity of semiconductor devices, particularly focusing on AI-related semiconductor integration. One significant innovation is the introduction of bonding CMP slurries, which are designed specifically for polishing bonding surfaces in semiconductor hybrid bonding processes. For instance, in September 2025, Fujifilm Corporation unveiled a CMP slurry tailored for advanced packaging applications. This slurry addresses the challenges of hybrid bonding in AI semiconductors by combining specially formulated abrasives, additives, and corrosion inhibitors. It enables the precise planarization of bonding surfaces that combine copper and oxide films, facilitating the integration of multiple semiconductor chips into a single package. This results in ultra-flat surfaces, reduced defects, and improved reliability-key factors for boosting AI semiconductor performance and supporting next-generation packaging technologies.

Breakdown of the Chemical Mechanical Polishing Market Segmentation
The chemical mechanical polishing market is segmented across multiple categories to cover the full range of products and applications:

1) By Type: CMP Equipment, CMP Consumable, Slurry, PAD, PAD Conditioner, and Other Consumable Types
2) By Equipment: Polishing and Grinding Equipment, Slurry Testing Equipment
3) By Technology: Leading Edge Technology, More than Moore's Technology, Emerging Technologies
4) By Application: Compound Semiconductors, Integrated Circuits, MEMS (microelectromechanical systems) and NEMS (nanoelectromechanical systems), and Other Applications

Further subcategories include:
- CMP Equipment: Single-Station Equipment, Multi-Station Equipment, Inline Equipment
- CMP Consumable: Slurry Filters, Polishing Pads, CMP Tools
- Slurry Types: Oxide Slurry, Non-Oxide Slurry, Advanced Slurry Systems
- PAD Types: Standard Polishing Pads, Advanced Polishing Pads, Specialized Polishing Pads
- PAD Conditioner Types: Mechanical Pad Conditioners, Chemical Pad Conditioners
- Other Consumables: Cleaning Agents, Dressing Tools, and other related consumables

This detailed segmentation allows for a comprehensive understanding of the product types and technologies shaping the chemical mechanical polishing market today and into the future.

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This release was published on openPR.