SiC Wafer Laser MicroJet Cutting Equipment Market Gains Momentum as Wide-Bandgap Semiconductor Production Scales Globally

SiC Wafer Laser MicroJet Cutting Equipment Market Size

The global market for SiC Wafer Laser MicroJet Cutting Equipment was valued at US$ 12 million in the year 2024 and is projected to reach a revised size of US$ 23.2 million by 2031, growing at a CAGR of 10.0% during the forecast period.

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By Type
• for 6 inches wafer
• for 8 inches wafer

By Application
• Foundry
• IDM

Key Companies
Synova S.A.

Major Trends
• Increasing adoption of Laser MicroJet technology for precision SiC cutting
• Rising demand for equipment supporting 8-inch SiC wafer processing
• Growth driven by expansion of power semiconductor foundries and IDMs
• Strong focus on minimizing material loss and improving yield
• Advancements in non-contact and low-damage cutting solutions
• Expansion of SiC manufacturing capacity across Asia-Pacific

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Trends Influencing the Growth of the Market

The SiC Wafer Laser MicroJet Cutting Equipment market is experiencing significant growth as silicon carbide semiconductor production expands to meet rising demand for high-efficiency power devices. Silicon carbide is a hard and brittle material, making traditional mechanical cutting methods challenging due to risks of chipping, cracking, and material waste. Laser MicroJet cutting technology, which combines laser precision with water-guided processing, has emerged as an effective solution for achieving accurate, low-damage wafer separation. This technology is increasingly recognized as a critical enabler for high-yield SiC wafer processing in advanced semiconductor manufacturing environments.

From a type perspective, equipment designed for 6 inches wafer processing currently represents a substantial portion of the market, reflecting the established use of 6-inch SiC wafers in commercial production. These systems support existing manufacturing lines and provide reliable performance for current-generation power semiconductor applications. However, equipment designed for 8 inches wafer processing is emerging as the fastest-growing segment as the industry transitions toward larger wafer diameters to improve manufacturing efficiency and reduce cost per device. The shift to 8-inch wafers requires advanced cutting solutions capable of maintaining precision while handling larger substrates, driving increased demand for next-generation Laser MicroJet systems.

From an application perspective, Foundry operations are a major growth driver as outsourced semiconductor manufacturing expands to meet demand for electric vehicles, renewable energy systems, and industrial power electronics. Foundries require high-throughput, high-precision cutting equipment to maintain yield and support diverse customer requirements. The IDM (Integrated Device Manufacturer) segment also contributes strongly to market expansion, as vertically integrated semiconductor companies invest in in-house SiC production capabilities to secure supply chains and optimize process control. Both segments prioritize cutting technologies that minimize kerf loss, reduce micro-cracks, and improve overall device reliability, making Laser MicroJet systems increasingly attractive.

Regionally, Asia-Pacific, particularly China, Japan, South Korea, and Taiwan, dominates consumption due to strong growth in SiC device manufacturing and heavy investment in electric mobility and energy infrastructure. Europe and North America remain important markets, driven by automotive electrification strategies and strategic semiconductor supply chain initiatives. Emerging demand in Southeast Asia and Latin America reflects gradual expansion of semiconductor ecosystems supporting industrial and energy applications. Industry insights from leading consulting firms such as McKinsey, Deloitte, KPMG, and PwC indicate that electrification trends, renewable energy adoption, and demand for energy-efficient power electronics are structural drivers reinforcing long-term growth in SiC wafer processing technologies.

Market Share

The SiC Wafer Laser MicroJet Cutting Equipment market is highly specialized, with Synova S.A. holding a leading position due to its proprietary Laser MicroJet technology and established expertise in precision cutting solutions for hard and brittle materials. Market dynamics are influenced by technological differentiation, cutting accuracy, process stability, and the ability to meet evolving wafer size requirements. As demand for SiC semiconductors grows, competitive positioning increasingly depends on innovation in automation, throughput optimization, and integration with advanced semiconductor manufacturing workflows. Continuous investment in R&D and collaboration with semiconductor manufacturers remains central to sustaining leadership in this niche but rapidly expanding market.

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