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SiC Power Semiconductor Market Set for Explosive Growth at 33.10% CAGR to 2031, Led by Asia Pacific's 46% Share | Key Players - STMicroelectronics NV, Infineon Technologies AG, Toshiba Corporation

02-17-2026 07:35 AM CET | IT, New Media & Software

Press release from: DataM intelligence 4 Market Research LLP

SiC power semiconductor Market

SiC power semiconductor Market

The Global SiC Power Semiconductor Market is projected to expand at a 33.10% CAGR between 2024 and 2031.

Market growth is driven by surging electric vehicle adoption, rising demand for efficient renewable energy systems like solar inverters, and expanding needs in data centers and 5G infrastructure. Advancements in SiC manufacturing, such as lower-cost wafers and higher-efficiency MOSFETs, alongside regulatory pushes for energy-efficient power electronics, are accelerating this expansion.

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Key Industry Developments

United States:
✅ January 2026: Wolfspeed announced the commercial launch of its next-generation 200mm SiC wafers, enhancing production efficiency for EV inverters and renewable energy systems with reduced defect rates and higher yield.

✅ December 2025: onsemi unveiled advancements in its EliteSiC MOSFET platform, achieving 30% lower on-resistance for high-voltage applications in data centers and fast chargers.

✅ November 2025: Littelfuse introduced a new family of SiC power diodes optimized for 1200V industrial motor drives, featuring improved thermal management.

Asia Pacific / Japan:
✅ January 2026: Rohm Semiconductor launched its 4th-generation SiC MOSFETs with trench-gate technology, targeting 650V applications in EVs and solar inverters for superior switching performance.

✅ December 2025: Mitsubishi Electric completed its Shisui Plant for SiC wafer processing, scaling capacity ninefold to support 5G base stations and satellite communications.

✅ October 2025: Fuji Electric began mass production of 6-inch SiC power semiconductors at its Aomori facility, focusing on high-efficiency power modules for rail and industrial uses.

Strategic Mergers and Acquisitions:
✅ onsemi expanded its SiC power semiconductor portfolio by acquiring Qorvo's Silicon Carbide (SiC) JFET business, including United Silicon Carbide subsidiary, for $115 million, set to close in Q1 2025 to strengthen high- and mid-voltage capabilities.

✅ Robert Bosch GmbH advanced in high-voltage SiC production through acquiring assets from TSI Semiconductors in April 2023, planning 200-mm SiC chip output starting 2026 with a $1.5 billion investment at its Roseville facility.

✅ Qorvo previously bolstered SiC expertise via its acquisition of UnitedSiC, enabling larger players to consolidate IP and manufacturing in the SiC sector amid rising EV and renewable energy demand.

Key Players:
STMicroelectronics NV | Infineon Technologies AG | SemiQ Inc. | Microchip Technology | GeneSiC Semiconductor Inc. | Danfoss A/S | Microsemi Corporation | Toshiba Corporation | Mitsubishi Electric Corporation | Fuji Electric Co. Ltd.

Strategic Leadership Report: Top 5 Players in SiC Power Semiconductor Market 2026
-STMicroelectronics NV: Launched the third-generation 650V SCTH45N65G2V silicon carbide MOSFETs, delivering superior energy efficiency and ruggedness for EV powertrains and solar inverters through advanced trench-field plate technology that reduces on-resistance by 40%.

-Infineon Technologies AG: Introduced trench-based SiC superjunction technology in 1200V ID-PAK modules for automotive traction inverters, enabling up to 40% higher power density, reduced cooling needs, and enhanced reliability in high-power EV and renewable energy systems.

-Wolfspeed, Inc. (formerly Cree): Released Gen-4 1200V SiC MOSFETs with 25% lower on-resistance and improved short-circuit withstand capability, optimizing performance for high-frequency switching in EV chargers, industrial motor drives, and data center power supplies.

-Mitsubishi Electric Corporation: Unveiled the 2nd-generation 1200V SiC MOSFET module series with double-cell trench structure, achieving 30% lower power loss and higher thermal conductivity for compact, efficient designs in railway traction and grid-tied energy storage applications.

-ROHM Co., Ltd.: Developed the 4th-generation 1200V SiC MOSFETs with advanced double trench structure, offering industry-leading low on-resistance and avalanche ruggedness to support higher power density in EV onboard chargers and renewable energy inverters.

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Market Drivers and Key Trends:
-EV Acceleration: SiC power semiconductors enable higher efficiency and power density in electric vehicle inverters and onboard chargers, extending driving range and supporting faster charging infrastructure.

-Renewable Integration: Superior high-voltage handling and low energy losses in SiC devices boost solar PV inverters and wind power converters, aiding grid stability and renewable energy adoption.

-Efficiency Gains: SiC MOSFETs and diodes deliver faster switching, higher power density, and reduced losses versus silicon, ideal for data centers, 5G base stations, and industrial motor drives.

-Market Hurdles: Elevated manufacturing costs, supply chain limitations for SiC wafers, and technical challenges in scaling high-voltage production constrain broader adoption despite falling prices.

Regional Insights:
-Asia Pacific: 46% (Largest share, driven by high-volume SiC manufacturing in China, Japan, and South Korea, along with strong EV production and renewable energy deployments).

-North America: 28% (Second largest, fueled by advanced SiC fabrication investments exceeding USD 8 billion, EV platform integrations, and data center power demands).

-Europe: 20% (Supported by automotive electrification, industrial automation, and steady renewable energy adoption).

-Rest of World: 6% (Including South America at around 7% adjusted for overlaps, driven by grid upgrades and localized clean energy projects).

Market Opportunities & Challenges: SiC Power Semiconductor Market 2026
-Opportunities: A "High-Voltage Evolution" accelerates adoption in EV inverters and renewable grid systems; advancements in 8-inch wafer production enable scalable manufacturing for next-gen modules. U.S. CHIPS Act funding and EU Green Deal incentives support domestic fabs, creating low-risk pathways for supply chain localization.

-Challenges: Wafer defect rates hinder yield consistency, inflating upfront costs amid geopolitical substrate shortages. Intense competition from GaN alternatives pressures SiC in mid-power apps, demanding precise differentiation via thermal management innovations.

-Strategic Verdict: 1200V+ automotive modules and integrated powertrains emerge as dominant 2026 growth vectors.

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Market Segmentation Analysis:
-By Component: SiC Modules Lead with Highest Efficiency
SiC discrete devices hold 45% market share in 2024, offering high-voltage switching for compact power electronics in EVs and renewables.
SiC modules capture 35%, dominating industrial applications with integrated reliability and thermal management for high-power systems.
SiC power integrated circuits claim 20%, enabling smarter control in consumer and telecom devices via miniaturized designs.

-By Application: Electric Vehicles Dominate Amid Electrification Surge
Electric vehicles seize 40% share, propelled by SiC's fast switching for efficient inverters and onboard chargers in rising EV adoption.
Renewable energy systems follow at 25%, leveraging SiC for solar inverters and wind converters to minimize losses.
Power supplies take 15%, industrial motor drives 10%, and others 10%, supporting data centers and rail systems.

-By End-User: Industrial Sector Commands Largest Share
Industrial end-users lead at 30%, utilizing SiC for robust motor drives and automation in manufacturing.
Energy and power hold 25%, boosted by grid-tied inverters for renewables.
Electric vehicles (overlapping applications) at 20%, consumer electronics 10%, telecommunications 5%, aerospace and defense 5%, and others 5%. Industrial has the highest market share.

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