Key Factors and Emerging Trends Shaping the Soft Chemical-Mechanical Polishing (CMP) Pad Market Environment

The soft chemical-mechanical polishing (CMP) pad market is positioned for notable expansion over the coming years, driven by innovation and growing demand across several high-tech sectors. As semiconductor manufacturing and advanced device fabrication continue to evolve, the market is set to respond with increasing adoption of sophisticated polishing solutions. Let's delve into the current landscape, key players, and market segments shaping this industry's future.

Projected Growth and Market Size Outlook for Soft CMP Pads
The soft chemical-mechanical polishing (CMP) pad market is forecasted to reach a value of $1.69 billion by 2030, growing at a compound annual growth rate (CAGR) of 8.0%. This upward trajectory is fueled by rising production of advanced logic chips and expanding demand for AI hardware. Additionally, growth in automotive semiconductors, photonic device manufacturing, and the need for precise planarization processes are significant contributors. Key trends expected to impact the market include a higher usage of CMP pads in cutting-edge node fabrication, an emphasis on defect-free planarization, increased memory device output, a shift towards low-pressure polishing techniques, and progress in pad material technology.

Download a free sample of the soft chemical-mechanical polishing (cmp) pad market report:
https://www.thebusinessresearchcompany.com/sample.aspx?id=27794&type=smp&utm_source=OpenPR&utm_medium=Paid&utm_campaign=Feb_PR

Factors Stimulating Market Growth in Soft Chemical-Mechanical Polishing Pads
One major driver behind market growth is the surge in advanced logic chip fabrication, which requires reliable and high-performance planarization solutions to maintain quality and efficiency. As semiconductor devices become increasingly complex, the demand for innovative CMP pads that can meet these stringent manufacturing standards grows accordingly.
Another influential factor is the booming automotive semiconductor sector, propelled by the rise of electric and autonomous vehicles. This trend is complemented by expansion in AI-related hardware and photonic devices, all of which depend on precise planarization techniques made possible by soft CMP pads.

Leading Companies Shaping the Soft CMP Pad Industry
The market includes several dominant firms such as 3M Company, DuPont de Nemours Inc., Entegris Inc., Cabot Corporation, SKC Co. Ltd., Fujibo Holdings Inc., JSR Corporation, Hubei DingLong Chemical Co. Ltd., Beijing Grish Hitech Co. Ltd., Nitta Corporation, KPX Chemical Co. Ltd., Pureon AG, IV Technologies Inc., FNS TECH Co. Ltd., TWI Incorporated, Coorstek Inc., Resonac Corporation, KCTech Co. Ltd., Anji Microelectronics Co. Ltd., and Jiangsu Nata Opto-electronic Material Co. Ltd.
A recent notable development occurred in April 2025, when Enpulse Co. Ltd., a South Korean electronics company, acquired the CMP PAD Business Division from SKC Solmics Co., Ltd. This strategic acquisition aims to broaden Enpulse's semiconductor materials portfolio and strengthen its foothold in the semiconductor supply chain by integrating SKC Solmics' CMP pad technologies and industry expertise. SKC Solmics itself specializes in CMP pads and related materials for semiconductor processing.

View the full soft chemical-mechanical polishing (cmp) pad market report:
https://www.thebusinessresearchcompany.com/report/soft-chemical-mechanical-polishing-cmp-pad-global-market-report?utm_source=OpenPR&utm_medium=Paid&utm_campaign=Feb_PR

Market Segmentation Reveals Key Soft CMP Pad Categories
This report segments the soft chemical-mechanical polishing (CMP) pad market into several categories for better insight:
1) Pad Type: Divided into Low-Hardness CMP Pads and Ultra-Soft or Porous CMP Pads.
2) Pad Structure: Includes Non-Woven Soft Pads, Felt-Based CMP Pads, Porous Polymer CMP Pads, and Composite Soft CMP Pads.
3) Material Type: Comprises Polyurethane-Based Soft Pads, Polyester-Based Soft Pads, and Polymer Composite Soft Pads.
4) Application Areas: Covers Wafer Polishing, Thin-Film Chemical Mechanical Polishing, Memory Device Manufacturing, Logic Device Manufacturing, and Photonic Device Manufacturing.
5) End Users: Encompasses Semiconductor Foundries, Integrated Device Manufacturers (IDMs), and Memory Chip Manufacturers.

Detailed subcategories include:
- For Low-Hardness CMP Pads: Standard Low-Hardness Polyurethane CMP Pads, Controlled-Porosity variants, Fine-Texture types, Low-Defectivity pads designed for delicate films, and Soft CMP Pads intended for low-pressure planarization.
- Under Ultra-Soft or Porous CMP Pads: High-Porosity versions, Non-Woven Ultra-Soft Pads, Felt-Based Ultra-Soft Pads, Micro-Porous Polymer CMP Pads, and Composite Ultra-Soft CMP Pads.

This comprehensive segmentation highlights the diverse range of products tailored to meet the precise demands of semiconductor polishing operations.

Reach out to us:
The Business Research Company: https://www.thebusinessresearchcompany.com/,
Americas +1 310-496-7795,
Europe +44 7882 955267,
Asia & Others +44 7882 955267 & +91 8897263534,
Email us at info@tbrc.info.

Follow Us On:
LinkedIn: https://in.linkedin.com/company/the-business-research-company,
Twitter: https://twitter.com/tbrc_info,
YouTube: https://www.youtube.com/channel/UC24_fI0rV8cR5DxlCpgmyFQ

Learn More About The Business Research Company
With over 17500+ reports from 27 industries covering 60+ geographies, The Business Research Company has built a reputation for offering comprehensive, data-rich research and insights. Armed with 1,500,000 datasets, the optimistic contribution of in-depth secondary research, and unique insights from industry leaders, you can get the information you need to stay ahead.Our flagship product, the Global Market Model (GMM), is a premier market intelligence platform delivering comprehensive and updated forecasts to support informed decision-making.

This release was published on openPR.