Printed Circuit Board (PCB) Market Size, Share & Forecast 2031 | Valuates Reports

Printed Circuit Board (PCB) Market Size

The global market for Printed Circuit Board (PCB) was valued at US$ 96030 million in the year 2024 and is projected to reach a revised size of US$ 131330 million by 2031, growing at a CAGR of 4.6% during the forecast period.

By Type
• Rigid 1-2Sided
• Standard Multilayer
• HDI/Microvia/Build-Up
• IC Substrate
• Flexible Circuits
• Rigid Flex

By Application
• Consumer Electronics
• Computer
• Communications
• Industrial/Medical
• Automotive
• Military/Aerospace

Key Companies
ZDT, Unimicron, DSBJ, Nippon Mektron, TTM, Compeq, Tripod, Shennan Circuits, Ibiden, HannStar Board (GBM), SEMCO, Kingboard, AT&S, Nanya PCB, Wus

Get Free Sample: https://reports.valuates.com/request/sample/QYRE-Auto-5F4363/Global_Printed_Circuit_Board_PCB_Market_Insights_and_Forecast_to_2028

Major Trends
• High-density interconnect PCBs gaining traction across advanced electronics
• IC substrate demand rising due to semiconductor packaging complexity
• Automotive electrification increasing multilayer PCB adoption
• Flexible and rigid-flex circuits enabling device miniaturization
• 5G and data center expansion driving high-speed PCB requirements
• Defense and aerospace electronics boosting high-reliability board demand
• Asia-Pacific manufacturing dominance shaping global PCB supply chains
________________________________________

Trends Influencing the Growth of the Printed Circuit Board (PCB) Market

The Printed Circuit Board (PCB) market is undergoing significant transformation driven by rapid technological advancement, increasing electronic content across industries, and the global expansion of digital infrastructure. As electronic devices become more compact, powerful, and interconnected, PCB design complexity continues to rise. Industry insights from leading consulting firms highlight that advanced interconnect technologies, thermal management, and signal integrity optimization are becoming core differentiators in modern electronics manufacturing.

By type, the HDI/Microvia/Build-Up segment is one of the fastest-growing categories due to its ability to support miniaturized, high-performance electronics with dense component placement and fine-pitch interconnections. These boards are essential for smartphones, wearables, networking equipment, and advanced computing platforms. Their compatibility with high-speed signal transmission and reduced form factors directly supports market expansion.

IC Substrate PCBs are experiencing accelerated growth as semiconductor packaging complexity increases. These substrates are critical for advanced chip packaging technologies such as flip-chip, ball grid array, and system-in-package architectures. As chip performance scales and packaging densities rise, IC substrates are becoming a strategic enabler of semiconductor innovation, particularly in high-performance computing, AI accelerators, and advanced consumer electronics.

Flexible Circuits and Rigid Flex PCBs are gaining strong adoption due to their ability to support compact, lightweight, and mechanically dynamic electronic designs. These technologies enable foldable devices, wearable electronics, medical implants, and aerospace systems where space optimization and durability are critical. The integration of flexible interconnects into multifunctional devices is driving sustained demand in this segment.

Standard Multilayer PCBs continue to serve a broad range of applications, including enterprise computing, industrial automation, and telecommunications. These boards provide reliable performance for moderately complex systems and remain a core component of mainstream electronics manufacturing.

Rigid 1-2Sided PCBs maintain relevance in cost-sensitive and low-complexity applications such as household appliances, basic consumer electronics, and industrial controls. While growth in this segment is comparatively moderate, replacement cycles and emerging market demand continue to support stable consumption.

The Others category includes specialty PCBs such as metal core boards, ceramic substrates, and high-frequency laminates, which are increasingly adopted in niche applications requiring advanced thermal or electrical performance.

By application, Consumer Electronics remains the largest demand segment due to high production volumes of smartphones, wearables, home appliances, and entertainment devices. Continuous product innovation and shorter product life cycles drive ongoing demand for advanced PCB solutions.

The Computer segment is experiencing strong growth driven by cloud computing, AI infrastructure, and data center expansion. Servers, storage systems, and networking equipment require high-layer-count, high-speed PCBs to support advanced processing and memory architectures.

Communications is another key growth area, fueled by global 5G deployment, broadband infrastructure modernization, and increasing data traffic. These systems demand PCBs with superior signal integrity, thermal stability, and reliability.

The Industrial/Medical segment continues to expand as automation, robotics, smart manufacturing, and medical device innovation increase reliance on high-reliability electronic systems. PCBs in this segment must meet stringent safety, performance, and regulatory standards.

The Automotive segment is one of the fastest-growing application areas due to vehicle electrification, advanced driver-assistance systems, infotainment, and connectivity. Automotive PCBs require robust thermal management, vibration resistance, and long-term reliability, driving demand for advanced multilayer, HDI, and metal core boards.

Military/Aerospace applications demand high-reliability, mission-critical PCBs capable of operating in extreme environments. This segment contributes high-value demand, supported by defense modernization programs and aerospace innovation.

The Others category includes energy systems, smart infrastructure, and emerging IoT applications, all of which require reliable and scalable PCB solutions.

From a production standpoint, China, China Taiwan, South Korea, and Japan dominate global PCB manufacturing due to advanced fabrication capabilities, high-volume production capacity, and strong electronics supply chains. Southeast Asia is emerging as a manufacturing hub as companies diversify production footprints. North America and Europe continue to lead in high-value PCB design, prototyping, and specialty manufacturing.

From a consumption perspective, Asia-Pacific represents the largest and fastest-growing market due to high electronics production volumes, expanding automotive manufacturing, and increasing investment in digital infrastructure. North America and Europe maintain strong consumption driven by data center growth, automotive innovation, and industrial automation. Southeast Asia and Latin America are emerging consumption regions supported by electronics assembly expansion and industrial development.

Overall, the PCB market is being shaped by digital transformation, electrification, and miniaturization, positioning advanced PCB technologies as foundational components of modern electronic ecosystems.

View Full Report: https://reports.valuates.com/market-reports/QYRE-Auto-5F4363/global-printed-circuit-board-pcb
________________________________________
Market Share

HDI/Microvia/Build-Up and IC Substrate PCBs collectively account for a growing share of the market due to their critical role in advanced semiconductor packaging, high-performance computing, and miniaturized consumer electronics. Standard Multilayer PCBs continue to hold a substantial share, supported by enterprise computing, telecommunications, and industrial applications.

Flexible Circuits and Rigid Flex segments are expanding their market presence due to rising adoption in wearable electronics, medical devices, automotive systems, and aerospace platforms. Rigid 1-2Sided PCBs maintain a stable share in cost-sensitive and low-complexity applications, while the Others category contributes incremental growth through specialty and high-performance board types.

By application, Consumer Electronics represents the largest share due to high-volume device production. The Computer and Communications segments follow closely, driven by data center expansion and global connectivity initiatives. The Automotive segment is rapidly increasing its market share, supported by vehicle electrification and advanced electronics integration. Industrial/Medical and Military/Aerospace segments contribute high-value demand, while the Others category adds incremental growth across emerging use cases.

Regionally, Asia-Pacific dominates market consumption due to large-scale electronics manufacturing and strong supply chain ecosystems. North America holds a significant share driven by innovation, data center investment, and defense electronics demand. Europe maintains a stable share supported by automotive engineering leadership, industrial modernization, and sustainability initiatives. Southeast Asia and Latin America represent emerging growth markets as electronics production and consumption continue to expand.

Purchase Regional Report: https://reports.valuates.com/request/regional/QYRE-Auto-5F4363/Global_Printed_Circuit_Board_PCB_Market_Insights_and_Forecast_to_2028

Email Id:
Please reach us at sales@valuates.com

Address:
Valuates,
4th Floor,
Balaraj's Arcade,
Whitefield Main road,
Bangalore 560066,

Valuates offers an extensive collection of market research reports that helps companies to take intelligent strategical decisions based on current and forecasted Market trends.
To achieve a consistent view of the market, data is gathered from various primary and secondary sources, at each step, data triangulation methodologies are applied to reduce deviance and find a consistent view of the market. Each sample we share contains detail research methodology employed to generate the report, Please also reach to our sales team to get the complete list of our data sources

This release was published on openPR.