AI Server PCB Market Size, Share & Forecast 2031 | Valuates Reports

AI Server PCB Market Size

The global market for AI Server PCB was valued at US$ 111 million in the year 2024 and is projected to reach a revised size of US$ 242 million by 2031, growing at a CAGR of 12.0% during the forecast period.

By Type
• 20 Layers
• 24 Layers
• 28 Layers

By Application
• High Performance Computing
• E-commerce
• Finance
• Game

Key Companies
TTM, Delton Techology, Tripod Technology, Wus Printed Circuit

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Major Trends

• Rising AI workloads increasing demand for high-layer server PCBs
• High-performance computing driving complex board architecture adoption
• Data center expansion accelerating advanced PCB integration
• Financial sector digitization boosting AI infrastructure investment
• Gaming platforms increasing demand for low-latency processing hardware
• Cloud-native services driving scalable server board deployment
• Thermal management requirements shaping multilayer PCB design
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Trends Influencing the Growth of the AI Server PCB Market

The AI Server PCB market is experiencing strong momentum as artificial intelligence, machine learning, and data-intensive computing become central to enterprise and consumer digital ecosystems. AI workloads require high-speed data processing, low-latency communication, and advanced thermal management, all of which place significant performance demands on server hardware. Industry insights from leading consulting firms emphasize that next-generation data center infrastructure is increasingly dependent on high-layer-count printed circuit boards capable of supporting dense component integration and high-frequency signal transmission.

By type, the 28 Layers segment is witnessing the fastest growth due to its suitability for high-performance AI servers, advanced accelerators, and next-generation networking architectures. These boards support higher interconnect density, improved signal integrity, and advanced power distribution networks, which are essential for managing complex AI workloads. As GPU clusters, AI accelerators, and high-bandwidth memory modules become standard in modern servers, 28-layer PCBs are increasingly adopted to support performance scalability and system stability.

The 24 Layers segment also represents a significant portion of market growth, particularly in enterprise servers and hybrid cloud environments where performance requirements are high but cost optimization remains a priority. These boards provide a balance between complexity, manufacturability, and performance, making them suitable for a wide range of AI-driven computing applications.

The 20 Layers segment continues to serve mid-range server platforms and cost-sensitive AI deployments. While adoption in cutting-edge AI systems is comparatively moderate, 20-layer PCBs remain relevant for applications that require reliable performance without the full complexity of higher-layer designs.

By application, High Performance Computing is the primary growth driver, encompassing AI model training, scientific simulations, and advanced analytics workloads. These applications demand ultra-high-speed data transmission, robust power delivery, and advanced thermal management, all of which require sophisticated multilayer PCB architectures.

The E-commerce segment is expanding as online platforms increasingly rely on AI for recommendation engines, fraud detection, logistics optimization, and personalized customer experiences. AI server infrastructure supporting these applications requires scalable and reliable PCB solutions capable of handling high transaction volumes and real-time data processing.

The Finance segment is also a major contributor, driven by algorithmic trading, risk modeling, cybersecurity, and real-time transaction monitoring. Financial institutions are investing heavily in AI server infrastructure to enhance operational efficiency and maintain competitive advantage, thereby driving demand for high-performance PCB designs.

The Game segment is emerging as a growth area due to the increasing adoption of AI-driven gaming engines, real-time rendering, and cloud gaming platforms. These applications require low-latency processing and high data throughput, increasing demand for advanced server PCB architectures.

The Other category includes applications such as healthcare analytics, smart manufacturing, and autonomous systems, all of which require reliable and scalable AI server infrastructure supported by high-layer-count PCBs.

From a production perspective, China, South Korea, and Japan play critical roles in large-scale PCB manufacturing due to their advanced fabrication capabilities, strong electronics supply chains, and continuous investment in high-density interconnect technologies. North America and Europe maintain leadership in high-value PCB design, prototyping, and innovation, particularly for advanced server architectures and defense-grade applications.

From a consumption standpoint, Asia-Pacific represents the largest and fastest-growing market due to high data center construction activity, cloud service expansion, and increasing adoption of AI technologies across industries. North America and Europe maintain strong consumption driven by hyperscale data centers, enterprise digital transformation, and AI research investments. Southeast Asia and Latin America are emerging consumption markets, supported by growing cloud infrastructure and digital economy expansion.

Overall, the AI Server PCB market is being shaped by the convergence of AI infrastructure growth, data center modernization, and high-performance computing requirements, positioning advanced multilayer PCBs as foundational components of next-generation digital ecosystems.

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Market Share

The 28 Layers segment holds a growing share of the AI Server PCB market due to its alignment with high-performance AI workloads, advanced accelerator integration, and high-bandwidth networking requirements. The 24 Layers segment maintains a substantial presence, driven by enterprise server deployments and hybrid cloud infrastructure needs. The 20 Layers segment retains a stable share in mid-range and cost-optimized server applications.

By application, High Performance Computing accounts for the largest share of market adoption, supported by AI model training, scientific research, and large-scale data analytics. The E-commerce and Finance segments follow closely, driven by AI-driven transaction processing, personalization engines, and cybersecurity systems. The Game segment contributes growing demand through cloud gaming and AI-enhanced graphics workloads, while the Other segment adds incremental growth across emerging AI use cases.

Regionally, Asia-Pacific dominates market consumption due to large-scale data center development and strong electronics manufacturing ecosystems. North America holds a significant share driven by hyperscale cloud providers, AI research institutions, and enterprise digital transformation. Europe maintains a stable share supported by regulatory compliance requirements, digital infrastructure modernization, and increasing AI adoption. Southeast Asia and Latin America represent emerging growth regions with expanding cloud infrastructure and digital economy investment.

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