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Key Players and Competitive Overview in the Thermal Management Market for Fifth Generation (5G) Technology

02-05-2026 07:51 AM CET | IT, New Media & Software

Press release from: The Business Research Company

Thermal Management For Fifth Generation (5G) Market

Thermal Management For Fifth Generation (5G) Market

The evolution of fifth-generation (5G) technology is driving substantial advancements in thermal management solutions, which are becoming increasingly critical as network demands intensify. As 5G infrastructure expands and devices become more powerful, effective heat dissipation and cooling systems are essential to maintain performance and reliability. Let's explore the projected market growth, leading companies, emerging trends, and key segments shaping the thermal management for 5G sector.

Strong Growth Forecast for the Thermal Management for Fifth Generation (5G) Market
The thermal management market supporting fifth-generation (5G) technology is set for notable expansion in the coming years. It is expected to reach a market size of $19.82 billion by 2030, growing at a compound annual growth rate (CAGR) of 8.6%. This growth is fueled by several factors, including the rollout of standalone 5G networks, the rise of edge computing, widespread adoption of small cell technology, increased emphasis on energy-efficient networks, and advancements in thermal interface materials. Key trends anticipated during this period involve the use of advanced thermal materials, the development of compact and lightweight cooling designs, integration of hybrid cooling systems, implementation of real-time thermal monitoring, and improved methods for dissipating heat from high-density components.

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Prominent Companies Leading the Thermal Management for Fifth Generation (5G) Industry
Several influential players dominate the landscape of 5G thermal management solutions. These include well-established firms such as The Dow Chemical Company, Honeywell International Inc., 3M Company, Henkel AG & Co. KGaA, Parker-Hannifin Corporation, TDK Corporation, Kyocera Corporation, Delta Electronics Inc., Vertiv Holdings Co., H.B. Fuller Company, Boyd Corporation, Autoneum Holding AG, Syensqo, Mersen SA, Momentive Performance Materials Inc., Malico Inc., Zaward Corporation, Advanced Thermal Solutions Inc., Advanced Cooling Technologies Inc., and European Thermodynamics Ltd. A notable collaboration took place in June 2023, when DuPont de Nemours, Inc., partnered with JetCool Technologies Inc. to develop high-performance liquid cooling systems. This alliance focuses on delivering sustainable and efficient cooling solutions tailored for semiconductor manufacturers, aimed at enhancing device efficiency while lowering power consumption in data centers and high-performance computing applications. JetCool Technologies Inc. specializes in microconvective liquid cooling technology for high-power electronics.

Innovations Shaping the Future of the Thermal Management for Fifth Generation (5G) Market
Market leaders in 5G thermal management are prioritizing the creation of innovative materials capable of high thermal conductivity to meet the demanding heat dissipation needs of advanced 5G equipment. Such materials facilitate rapid heat transfer, ensuring electronic components operate reliably and have extended lifespans. For instance, in June 2025, U-MAP Co., Ltd., a Japanese technology company, introduced Thermalnite, a fibrous ceramic material with exceptional thermal conductivity. This product is designed to significantly boost heat dissipation while improving mechanical strength, fulfilling thermal management criteria for cutting-edge electronics including 5G devices. Thermalnite can enhance composite materials' thermal conductivity by as much as ten times with minimal weight addition and retained flexibility. This breakthrough supports innovative manufacturing techniques like structural design and injection molding, positioning Thermalnite as a crucial component for next-generation telecommunications infrastructure.

View the full thermal management for fifth generation (5g) market report:
https://www.thebusinessresearchcompany.com/report/thermal-management-for-fifth-generation-5g-global-market-report

Segment Breakdown of the Global Thermal Management for Fifth Generation (5G) Market
This report segments the thermal management market for fifth-generation (5G) technology into various categories:
1) By Solution Type: Materials, Hardware Systems, and Services
2) By Cooling Method: Passive, Active (Air), and Hybrid
3) By Application: Fifth Generation (5G) Infrastructure, Fifth Generation (5G) Devices, and Power and Supporting Systems

Further subsegments include:
- Materials: Thermal Interface Materials, Adhesives, Graphite, Graphene, Ceramics, Die Attach
- Hardware Systems: Heat Sinks, Vapor Chambers, Heat Pipes, Fans, Liquid Cooling, Immersion Cooling
- Services: Thermal Monitoring, Thermal Control, Thermal Design, Thermal Integration

This detailed segmentation provides a comprehensive view of the technologies and applications driving the thermal management market in the context of 5G advancements.

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