Press release
Market Trend Analysis: The Impact of Recent Innovations on the Molded Interconnect Device (MID) Market
Molded Interconnect Device (MID) Market
Rapid Growth Outlook for the Molded Interconnect Device Market Through 2030
The MID market is projected to experience rapid growth, reaching a valuation of $4.08 billion by 2030. This represents a robust compound annual growth rate (CAGR) of 15.3% over the forecast period. The rising demand for high-density interconnect solutions, alongside growth in wearable and medical electronics, is a primary factor fueling this expansion. Additional contributors include the increasing integration of antennas and RF modules, broader adoption in advanced automotive systems, and the development of cost-effective precision molded circuitry. The market is also being shaped by innovations such as intelligent 3D electromechanical integration, automated laser direct structuring (LDS) and two-shot molding processes, smart connected MID components, digitally optimized manufacturing workflows, and sustainable lightweight electronic structures.
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Leading Companies Driving Progress in the Molded Interconnect Device Market
Several prominent companies dominate the MID market landscape, including Molex LLC, TE Connectivity Ltd., Amphenol Corporation, LPKF Laser & Electronics AG, 2E mechatronic GmbH & Co. KG, Harting Technologiegruppe, Arlington Plating Company, MID Solutions LLC, MacDermid Inc., JOHNAN Corporation, TactoTek Oy, Axon' Cable S.A.S, S2P Solutions, Suzhou Cicor Technology Co. Ltd, Chogori Technology Co. Ltd., Mitsubishi Engineering-Plastics Corporation, Galtronics Corporation Ltd., RTP Company, BASF SE, EMS-Chemie Holding AG, Ensinger GmbH, Zeon Corporation, SelectConnect Technologies, Multiple Dimensions AG, Cicor Group, Tesa SE, Yomura Technologies Inc., T-Ink Inc., and ODU GmbH & Co. KG.
Significant Acquisition Enhancing Market Position
In October 2023, TE Connectivity Ltd., a Swiss supplier of sensors, connectors, and electronic components, acquired Schaffner Holding AG. Although the financial terms were undisclosed, this acquisition aims to expand TE Connectivity's offerings in electromagnetic solutions, particularly for industrial and automotive applications. Schaffner Holding AG specializes in EMC filters, harmonic filters, and electromagnetic components tailored for molded interconnect devices used in industrial and mobility sectors. This strategic move is expected to broaden TE Connectivity's presence in electrification and power-quality markets.
View the full molded interconnect device (mid) market report:
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Innovative Trends Bolstering the MID Market Expansion
Key players in the MID market are focusing on cutting-edge products such as light antennas to drive revenue growth. These antennas enable a revolutionary form of wireless communication known as LiFi (Light Fidelity), which offers faster speeds, better reliability, and enhanced security compared to traditional Wi-Fi and 5G. For example, in February 2023, pureLiFi Limited, a Scotland-based company specializing in LiFi technology, introduced the LiFi Light Antenna. This compact antenna, smaller than a US dime, can be seamlessly integrated into smartphones and other connected devices, facilitating widespread adoption of LiFi. Its optimized performance, size, cost, and manufacturability make it an attractive option for device manufacturers aiming to implement LiFi at scale.
How the Molded Interconnect Device Market Is Structured
This report segments the MID market by product, process, and application to provide a comprehensive overview of the sector:
1) By Product:
- Antenna and Connectivity Modules
- Connectors and Switches
- Sensors
- Lighting
2) By Process:
- Laser Direct Structuring (LDS)
- Two-Shot Molding
- Other Processes
3) By Application Areas:
- Automotive
- Consumer Products
- Healthcare
- Industrial
- Military and Aerospace
- Telecommunication and Computing
Further subcategories within these segments include:
- Antenna and Connectivity Modules: Integrated Antennas, RF Modules
- Connectors and Switches: Electrical Connectors, Mechanical Switches
- Sensors: Temperature Sensors, Pressure Sensors, Proximity Sensors
- Lighting: LED Lighting Modules, Decorative Lighting Solutions
This segmentation offers a detailed perspective on the diverse components and processes that drive the molded interconnect device market forward.
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