Press release
Key Growth Patterns, Segment Analysis, and Competitive Strategies Influencing the Interconnect and Passive Components Market
Interconnect And Passive Components Market
Forecasted Market Value and Growth Trajectory for the Interconnect and Passive Components Market
The market for interconnect and passive components is projected to grow significantly, reaching a valuation of $289.83 billion by 2030. This growth represents a compound annual growth rate (CAGR) of 6.6%. Several factors contribute to this upward trend, including the rising need for compact, high-performance electronic devices and the expanding use of high-speed data transmission systems. Additionally, the increasing integration of automotive electronics and electric vehicle circuitry, along with the widespread rollout of 5G and IoT technologies, are key drivers. A growing emphasis on energy-efficient and thermally stable passive components further fuels market expansion. Prominent trends forecasted during this period include greater miniaturization of passive components, heightened demand for high-frequency interconnect solutions, the use of advanced materials to improve thermal stability, growth in modular and high-density connector systems, and increasing incorporation of passive components within embedded designs.
Download a free sample of the interconnect and passive components market report:
https://www.thebusinessresearchcompany.com/sample.aspx?id=12934&type=smp
Emerging Leaders in the Interconnect and Passive Components Market
The interconnect and passive components market features several influential companies shaping its future. Leading players include Foxconn Electronics Inc., Nichicon Corporation, Koch Industries Inc., Panasonic Corporation, Cisco Systems Inc., KYOCERA AVX Components Corporation, TE Connectivity Corporation, TDK Corporation, Molex Incorporated, YAZAKI Corporation, Amphenol Corporation, Murata Manufacturing Co. Ltd., Samsung Electro-Mechanics Co. Ltd., AMETEK Inc., Hubbell Inc., Delphi Technologies PLC, Yageo Corporation, Vishay Intertechnology Inc., Bourns Inc., Taiyo Yuden Co. Ltd., Japan Aviation Electronics Industry Ltd., KEMET Electronics Corporation, HIROSE ELECTRIC CO., Sumida Corporation, TT Electronics PLC, Rubycon Corporation, Pulse Electronics Corporation, J.S.T. Mfg. Co., Chogori Technology Co. Ltd., and Zeeteq Electronics Co. Ltd.
Significant Industry Acquisition Strengthening Market Position
In May 2024, Amphenol Corporation, a US-based manufacturer specializing in electronic connectors, completed the acquisition of Carlisle Interconnect Technologies (CIT) for $2.025 billion. This strategic purchase boosts Amphenol's capacity to deliver highly engineered interconnect solutions targeting commercial aviation, defense, and industrial sectors. Carlisle Interconnect Technologies is recognized for producing high-performance wire and cable products, including optical fiber, enhancing Amphenol's product portfolio and market reach.
View the full interconnect and passive components market report:
https://www.thebusinessresearchcompany.com/report/interconnect-and-passive-components-global-market-report
Innovations and Trends Driving the Interconnect and Passive Components Sector
Leading companies in the market are focusing on innovation, particularly in developing high-frequency passive components that support dependable, high-performance satellite communications. For example, in August 2023, Smiths Interconnect Inc., a US electronics manufacturer, introduced its E-Band passive components lineup featuring WR12 couplers, loads, and isolators. These broadband WR12 waveguide components are tailored for next-generation E-Band terrestrial uplink applications to Low Earth Orbit (LEO) constellations and payloads, optimized to handle the high RF power necessary for reliable communication links. The product range is especially suitable for prestigious space missions, benefiting from in-house design, manufacturing, and testing. The WR12 waveguide hybrids offer global usability with broad tuning capabilities, high-power termination, and stable performance across the 71-76 GHz and 81-86 GHz frequency bands.
Detailed Segmentation in the Interconnect and Passive Components Market Report
This market report organizes the interconnect and passive components industry into distinct segments for clarity:
1) By Product Type: Passive Components, Interconnects
2) By Application Area: Consumer Electronics, Data Processing, Telecommunication, Military and Aerospace, Automotive, Industrial, Healthcare
3) By Mounting Technology: Surface Mount Technology (SMT), Through-Hole Technology (THT)
Further breakdown includes:
- Passive Components subdivided into Resistors, Capacitors, Inductors, Filters, Crystals and Oscillators, and Sensors.
- Interconnects divided into Connectors, Cables and Wires, Circuit Board Connectors, Terminals, Adapters, and Sockets and Plugs.
This detailed classification supports a comprehensive understanding of the market's broad spectrum and aids in identifying specific growth opportunities across various sectors.
Reach out to us:
The Business Research Company: https://www.thebusinessresearchcompany.com/,
Americas +1 310-496-7795,
Europe +44 7882 955267,
Asia & Others +44 7882 955267 & +91 8897263534,
Email us at info@tbrc.info.
Follow Us On:
LinkedIn: https://in.linkedin.com/company/the-business-research-company,
Twitter: https://twitter.com/tbrc_info,
YouTube: https://www.youtube.com/channel/UC24_fI0rV8cR5DxlCpgmyFQ
Learn More About The Business Research Company
With over 17500+ reports from 27 industries covering 60+ geographies, The Business Research Company has built a reputation for offering comprehensive, data-rich research and insights. Armed with 1,500,000 datasets, the optimistic contribution of in-depth secondary research, and unique insights from industry leaders, you can get the information you need to stay ahead.Our flagship product, the Global Market Model (GMM), is a premier market intelligence platform delivering comprehensive and updated forecasts to support informed decision-making.
This release was published on openPR.
Permanent link to this press release:
Copy
Please set a link in the press area of your homepage to this press release on openPR. openPR disclaims liability for any content contained in this release.
You can edit or delete your press release Key Growth Patterns, Segment Analysis, and Competitive Strategies Influencing the Interconnect and Passive Components Market here
News-ID: 4375345 • Views: …
More Releases from The Business Research Company
Competitive Analysis: Key Market Leaders and Emerging Competitors in the Inverte …
The inverter market is on the brink of remarkable expansion as global demand for efficient energy solutions continues to rise. With growing interest in vehicle electrification, solar power adoption, and smart energy management, this sector is set to witness significant advancements and innovation in the coming years. Here's an in-depth look at the market's valuation, key players, emerging trends, and its key segments.
Forecasted Growth and Valuation of the Inverter Market…
Leading Companies Reinforcing Their Presence in the Intelligent Electrical Panel …
The intelligent electrical panel market is set to experience significant expansion as technological advancements and smart energy solutions become more widespread. With the increasing focus on energy efficiency and automation, this market is poised to evolve rapidly, driven by innovative applications and growing demand across various sectors.
Forecasted Market Value and Growth Rate of the Intelligent Electrical Panel Market
The intelligent electrical panel market is projected to reach a valuation of…
Future Perspective: Key Trends Shaping the Instrument Cluster Market Until 2030
The instrument cluster market is on a promising growth path, driven by rapid advancements in vehicle technology and increased demand for smarter, connected automotive systems. This sector is evolving to meet the needs of modern vehicles, particularly with the rise of electric and autonomous cars. Let's explore the market's size projections, leading players, emerging trends, and key segment insights.
Projected Growth and Market Size of the Instrument Cluster Market
The instrument…
Analysis of Key Market Segments Influencing the Industrial Process Variable Inst …
The industrial process variable instruments market is positioned for consistent expansion as industries increasingly adopt advanced technologies to optimize operations. Growing demand for precise measurements in manufacturing and energy sectors is driving innovation and broader deployment of these instruments, shaping the market's trajectory toward 2030.
Projected Market Size and Growth of the Industrial Process Variable Instruments Market
The industrial process variable instruments market is anticipated to reach a value of $70.58…
More Releases for Interconnect
Global Data Center Interconnect Solutions Market Size by Application, Type, and …
According to Market Research Intellect, the global Data Center Interconnect Solutions market under the Internet, Communication and Technology category is expected to register notable growth from 2025 to 2032. Key drivers such as advancing technologies, changing consumer behavior, and evolving market dynamics are poised to shape the trajectory of this market throughout the forecast period.
The data center interconnect (DCI) solutions market is experiencing strong growth due to the rising demand…
Global RF Interconnect Market Size & Trends
According to a new market research report published by Global Market Estimates, the global RF interconnect market is projected to grow at a CAGR of 7.6% from 2023 to 2028.
The growth of the global RF interconnect market is driven rise in expansion of wireless communication technologies, continuous growth in telecommunication sector, and the increasing number of IoT devices in healthcare and agriculture sector.
Browse 147 Market Data Tables and 115 Figures…
High Density Interconnect Market by Growing Technology Trends 2027 - CMK, Compeq …
What is High Density Interconnect?
High density interconnect (HDI) is a technology which enables much denser construction of a PCB by the capability to place ever more smaller components in closer proximity that also lead to shorter paths between components. HDI is much more than the miniaturization of PCB design. HDI helps in reducing the size and weight, to improving the electrical performance of devices.
The reports cover key market developments…
Global Interconnect Sales Market Report
This report studies the global Interconnect market status and forecast, categorizes the global Interconnect market size (value & volume) by key players, type, application, and region. This report focuses on the top players in North America, Europe, China, Japan, Southeast Asia India and Other regions (Middle East & Africa, Central & South America). Interconnect is an electrical connection that connects two or more devices. In telecommunications, interconnection is the physical…
Molded Interconnect Device Market
Molded Interconnect Device Market-Global Industry Analysis and Forecast (2018-2026) by Process, Product Type, End-user application and geography
Molded Interconnect Device Market was valued US$ 300 Mn in 2017 and is expected to reach US$ 890.5 Mn by 2026 at a CAGR of 14.57% during forecast period.
Molded Interconnect Device market is segmented by process, product, end-user application and region. Increasing demand in electrical and mechanical application, rising use of Molded Interconnect Device…
Medical Connectors Market 2017- Amphenol Corporation, Delphi, ITT Interconnect S …
MarketReports.biz, recently published a detailed market research study focused on the "Medical Connectors Market" across the global, regional and country level. The report provides 360° analysis of "Medical Connectors Market" from view of manufacturers, regions, product types and end industries. The research report analyses and provides the historical data along with current performance of the global Medical Connectors industry, and estimates the future trend of Medical Connectors market on…
