Press release
United States Solvent-Borne Adhesives Market to Reach US$ 3.76 Billion by 2032| North America leads with 30% share | Top Companies - Henkel GmbH & Co. KGaA, 3M, Avery Dennison Corporation
Solvent Borne Adhesives Market
As per DataM intelligence research report "Solvent Borne Adhesives Market size reached US$9.26 billion in 2024 and is expected to reach US$12.54 billion by 2032, growing with a CAGR of 3.86% during the forecast period 2025-2032"
The market is driven by strong demand from packaging, automotive, and construction industries. High bonding strength and fast curing properties support adoption. Despite environmental regulations, demand remains strong in industrial applications requiring high performance.
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Solvent-Borne Adhesives Market: Competitive Intelligence
Henkel GmbH & Co. KGaA, 3M, Avery Dennison Corporation, H.B. Fuller, Arkema Group, Sika AG, RPM International Inc., LINTEC Corporation
The Solvent-Borne Adhesives Market continues to gain structural strength through the combined influence of Henkel GmbH & Co. KGaA, 3M, Avery Dennison Corporation, H.B. Fuller, Arkema Group, Sika AG, RPM International Inc., and LINTEC Corporation. Together, these companies support critical end-use industries such as construction, automotive, packaging, electronics, and industrial manufacturing, where high-performance bonding, durability, and process reliability remain essential. Their portfolios help address demanding application requirements including heat resistance, chemical stability, and strong adhesion across diverse substrates. As a result, the Solvent-Borne Adhesives Market benefits from steady demand, technological continuity, and broad industrial relevance despite ongoing shifts toward alternative adhesive technologies.
The collective momentum created by these companies enhances the competitive depth of the Solvent-Borne Adhesives Market by combining global scale with specialized expertise. Henkel, 3M, Arkema Group, and Sika AG bring extensive R&D capabilities, strong regulatory frameworks, and multinational distribution networks that reinforce market leadership and customer trust. At the same time, Avery Dennison Corporation, H.B. Fuller, RPM International Inc., and LINTEC Corporation contribute application-specific innovation, particularly in labels, tapes, construction materials, and industrial assembly. This balance of scale, specialization, and geographic reach supports consistent product availability and enables faster adaptation to evolving performance and compliance expectations.
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Fund Raisings
✅ January 2026 - H.B. Fuller Company (United States)
H.B. Fuller allocated strategic investment to expand its solvent-borne adhesive production and formulation capabilities. The funding supports performance improvements for industrial, packaging, and construction applications.
✅ December 2025 - RPM International Inc. (United States)
RPM International directed internal capital toward innovation in high-strength solvent-borne adhesive technologies. The investment enhances durability and bonding performance across industrial end-use segments.
✅ November 2025 - DIC Corporation (Japan)
DIC Corporation invested growth capital to strengthen its solvent-borne adhesives portfolio for industrial and specialty applications. The initiative supports advanced resin development and manufacturing efficiency.
Product Launches & Partnerships
✅ January 2026 - H.B. Fuller Company (United States)
H.B. Fuller launched a new solvent-borne adhesive designed for high-performance bonding in packaging and flexible materials. The product offers improved heat resistance and long-term adhesion strength.
✅ December 2025 - RPM International Inc. (United States)
RPM International introduced an upgraded solvent-borne adhesive optimized for construction and industrial assembly. The solution delivers faster curing and enhanced bond reliability.
✅ October 2025 - DIC Corporation (Japan)
DIC released advanced solvent-borne adhesives focused on precision bonding and coating applications. The products support demanding industrial processes and specialty manufacturing requirements.
Mergers & Acquisitions
✅ January 2026 - H.B. Fuller Company (United States)
H.B. Fuller expanded its adhesive technologies portfolio through acquisition of a specialty bonding solutions provider. The move strengthens its solvent-borne adhesive capabilities across industrial markets.
✅ November 2025 - DIC Corporation (Japan)
DIC Corporation acquired a regional specialty adhesives business to enhance its solvent-borne product offerings. The acquisition improves technological depth and customer reach in Japan.
✅ October 2025 - RPM International Inc. (United States)
RPM International completed a strategic acquisition to broaden its industrial adhesives segment. The deal reinforces long-term growth in solvent-borne adhesive applications.
Segment Covered in the Solvent-Borne Adhesives Market:
By Resin
The market is segmented into Polyurethane 30%, Acrylic 25%, Polyamide 15%, Vinyl Acetate 10%, PVC Copolymers 5%, and Others 15%, with polyurethane and acrylic dominating due to their strong adhesion, versatility, and wide industrial usage. Polyamide and vinyl acetate are growing in specialty applications such as footwear and packaging.
By Application
Applications include Packaging 30%, Automotive 20%, Construction 15%, Footwear 10%, Electronics 10%, Aerospace & Marine 5%, and Others 10%, with packaging and automotive leading due to high demand for bonding strength and industrial processing. Electronics and construction are expanding with miniaturization and infrastructure projects.
By End-User
End-users include Automotive & Transportation 25%, Building & Construction 20%, Consumer Goods 15%, Industrial 15%, Medical 10%, and Others 15%, with automotive and construction dominating due to large-scale adhesive consumption in assembly and infrastructure. Consumer goods and medical segments are growing with demand for durability and safety compliance.
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Regional Analysis
North America - 30% Share
North America leads with 30% share due to industrial manufacturing, automotive production, and high-quality adhesive adoption in the U.S. and Canada.
Europe - 25%
Share
Europe holds 25% share supported by automotive, packaging, and aerospace industries in Germany, France, and the UK.
Asia Pacific - 35% Share
Asia Pacific captures 35% share driven by rapid industrialization, packaging growth, automotive assembly, and electronics manufacturing in China, India, Japan, and Southeast Asia.
Latin America - 5% Share
Latin America accounts for 5% share with growth in construction, packaging, and automotive industries in Brazil, Mexico, and Argentina.
Middle East & Africa - 5% Share
Middle East & Africa holds 5% share with increasing adoption in construction, automotive, and industrial sectors in GCC countries and South Africa.
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✅ Sustainability Impact Analysis
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DataM Intelligence is a Market Research and Consulting firm that provides end-to-end business solutions to organizations from Research to Consulting. We, at DataM Intelligence, leverage our top trademark trends, insights and developments to emancipate swift and astute solutions to clients like you. We encompass a multitude of syndicate reports and customized reports with a robust methodology.
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