Future Perspective: Key Trends Shaping the Artificial Intelligence (AI) Image Upscaling Chip Market Until 2030

The artificial intelligence (AI) image upscaling chip market is gaining significant traction as advancements in AI technology continue to permeate various sectors. With increasing demand for enhanced visuals and smarter processing capabilities, this market is set for remarkable growth in the coming years. Let's explore the current market size, leading players, key trends, and market segmentation to get a clearer picture of where this industry is headed.

Projected Market Size and Growth Outlook for the AI Image Upscaling Chip Market
The AI image upscaling chip market is anticipated to expand rapidly, reaching a value of $4.49 billion by 2030. This upward trajectory is expected to be achieved at a robust compound annual growth rate (CAGR) of 15.8%. The expansion is driven by factors such as the growing integration of system-on-chip (SoC) based AI upscaling modules, increased adoption of edge AI processing, growth in automotive infotainment and advanced driver-assistance systems (ADAS), rising industrial imaging and machine vision applications, along with substantial investments in semiconductor research and development focused on AI hardware. Key trends forecasted to influence the market include breakthroughs in deep learning-based super-resolution algorithms, the embedding of AI upscaling within SoCs and GPUs, advancements in energy-efficient chip design, innovations in multi-modal image processing, and progress in neural network compression and optimization techniques.

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Major Companies Leading the AI Image Upscaling Chip Market
Several prominent corporations dominate the AI image upscaling chip sector. These include Apple Inc., Samsung Electronics Co. Ltd., Intel Corporation, Qualcomm Incorporated, NVIDIA Corporation, MediaTek Inc., Realtek Semiconductor Corp., Synopsys Inc., Cadence Design Systems Inc., Novatek Microelectronics Corp., Socionext Inc., Magnachip Semiconductor Corporation, Ambarella Inc., Rockchip Electronics Co. Ltd., CEVA Inc., HiSilicon (Shanghai) Technologies Co. Ltd., Amlogic Inc., Pixelworks Inc., Axera Semiconductor Co. Ltd., Advanced Micro Devices Inc., Black Sesame Technologies Inc., and Hailo Technologies Ltd.

Strategic Collaborations Advancing Market Capabilities
In January 2024, MediaTek Inc., a Taiwan-based fabless semiconductor firm, forged a partnership with Hisense Group to integrate AI-Super Resolution (AI-SR) technology into Hisense's range of smart TVs. This collaboration centers on utilizing MediaTek's Pentonic chipsets, which intelligently upscale content from standard full HD to 4K resolution by applying smart image analysis techniques to minimize compression artifacts and recover fine details. Hisense Group, headquartered in China, is a major player in electronics manufacturing and a provider of AI-assisted image processing chips, making this partnership a significant step toward enhanced consumer viewing experiences.

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Emerging Trends Driving Innovation in the AI Image Upscaling Chip Industry
Leading market players are concentrating efforts on developing AI-powered picture quality enhancement technologies designed to deliver sharper images, more accurate colors, and immersive viewing experiences across consumer electronics. These AI-driven algorithms operate at the chip level to intelligently upscale resolution, reduce noise, enhance contrast, and optimize brightness in real time, adjusting dynamically according to content and display characteristics.

For example, in January 2025, MediaTek Inc. launched MiraVision Pro, a suite of advanced AI-powered technologies debuting on the Pentonic 800 smart TV chipset. This includes AI-Super Resolution 3.0 for smooth resolution scaling, 500K-zone AI-Contrast 2.0 for precise HDR performance, and AI-based On-Screen-Display upscaling that enhances interface clarity beyond standard 4K. All these features are powered by a neural processing unit that enables cinematic-quality visuals without increasing power consumption or hardware complexity. MiraVision Pro analyzes video frames dynamically to upscale lower-resolution content while preserving intricate details and natural textures, offering device manufacturers a way to deliver premium high-definition experiences efficiently.

Segment Breakdown and Market Share in the Global AI Image Upscaling Chip Market
The comprehensive market is segmented by product type, payload capacity, application, and end-user categories. These include:
1) Product Type: Fixed-Wing Drones, Rotary-Wing Drones, Hybrid Drones
2) Payload Capacity: Lightweight, Medium, Heavy
3) Application: Stockpile Volume Measurement, Inventory Management, Site Surveying and Mapping, Safety and Compliance, Other Applications
4) End-User: Construction, Mining, Quarrying, Agriculture, Other End-Users

Further detailed subcategories under each product type include:
- Fixed-Wing Drones: Long Range Fixed Wing, High Endurance Fixed Wing, Lightweight Fixed Wing, Survey Grade Fixed Wing, Autonomous Fixed Wing
- Rotary-Wing Drones: Quad Rotor Drone, Hexa Rotor Drone, Octo Rotor Drone, Compact Rotary Drone, Heavy Lift Rotary Drone
- Hybrid Drones: Vertical Take-Off Hybrid, Long Endurance Hybrid, Survey Grade Hybrid, Heavy Payload Hybrid

Geographic and regional factors also play a critical role in shaping market growth trends, with diverse applications across industries highlighting the broad potential for these technologies.

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This release was published on openPR.