Press release
Plasma Surface Treatment Equipment for Semiconductor Market Set to Surge - Key Insights You Must Know
Plasma Surface Treatment Equipment for Semiconductor Market SizeThe global market for Plasma Surface Treatment Equipment for Semiconductor was valued at US$ 278 million in the year 2024 and is projected to reach a revised size of US$ 424 million by 2031, growing at a CAGR of 6.3% during the forecast period.
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Plasma Surface Treatment Equipment for Semiconductor Market
Plasma surface treatment equipment can be used in the semiconductor industry in processes such as precision cleaning, surface activation, stripper and etching, and flip chip packaging.
North American market for Plasma Surface Treatment Equipment for Semiconductor is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
Asia-Pacific market for Plasma Surface Treatment Equipment for Semiconductor is estimated to increase from $ million in 2024 to reach $ million by 2031, at a CAGR of % during the forecast period of 2025 through 2031.
The major global manufacturers of Plasma Surface Treatment Equipment for Semiconductor include Nordson, PVA TePla, Panasonic, Shenzhen OKSUN Technology, Tonson Tech, Vision Semicon, Yield Engineering Systems, CRF Plasma, Tantec, FARI, etc. In 2024, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Plasma Surface Treatment Equipment for Semiconductor, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Plasma Surface Treatment Equipment for Semiconductor.
The Plasma Surface Treatment Equipment for Semiconductor market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Plasma Surface Treatment Equipment for Semiconductor market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Plasma Surface Treatment Equipment for Semiconductor manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
By Type
• Low Pressure/Vacuum Plasma Surface Treatment Equipment
• Atmospheric Plasma Surface Treatment Equipment
By Application
• Chip Bonding
• Lead Frame
Key Companies
Nordson, PVA TePla, Panasonic, Shenzhen OKSUN Technology, Tonson Tech, Vision Semicon, Yield Engineering Systems, CRF Plasma, Tantec, FARI, Samco, PINK GmbH Thermosysteme
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